公开(公告)号：US20150014711A1

公开(公告)日：2015-01-15

申请号：US14371739

申请日：2013-01-08

申请人： OSRAM GmbH

发明人： Krister Bergenek ,  Ralph Wirth ,  Axel Kaltenbacher ,  Andreas Biebersdorf ,  Joerg Sorg ,  Christine Maier ,  Harald Jaeger ,  Gertrud Kraeuter ,  Frank Jermann ,  Stefan Lange

IPC分类号： H01L33/56 ,  H01L33/40 ,  H01L33/50

CPC分类号： H01L33/56 ,  H01L33/40 ,  H01L33/483 ,  H01L33/502 ,  H01L33/507

摘要： Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.

摘要翻译： 各种实施例涉及包括至少一个光电子半导体芯片布置在其上的载体元件的光电子部件，以及覆盖件，该盖子以围绕半导体芯片周向延伸的区域并与载体元件一起安装在载体元件上 形成密封空腔，其中所述至少一个光电半导体芯片布置在惰性气体中。

公开(公告)号：US09640739B2

公开(公告)日：2017-05-02

申请号：US14371739

申请日：2013-01-08

申请人： OSRAM GmbH

发明人： Krister Bergenek ,  Ralph Wirth ,  Axel Kaltenbacher ,  Andreas Biebersdorf ,  Joerg Sorg ,  Christine Maier ,  Harald Jaeger ,  Gertrud Kraeuter ,  Frank Jermann ,  Stefan Lange

IPC分类号： H01L29/18 ,  H01L33/56 ,  H01L33/40 ,  H01L33/48 ,  H01L33/50

CPC分类号： H01L33/56 ,  H01L33/40 ,  H01L33/483 ,  H01L33/502 ,  H01L33/507

摘要： Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.