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    Lighting device with LED chip and protective cast
    2.
    发明授权
    Lighting device with LED chip and protective cast 有权
    带LED芯片和保护套的照明装置

    公开(公告)号：US09380652B2

    公开(公告)日：2016-06-28

    申请号：US13866052

    申请日：2013-04-19

    Applicant: OSRAM GmbH

    Inventor： Krister Bergenek ,  Andreas Biebersdorf ,  Gertrud Kraeuter ,  Joerg Sorg ,  Reiner Windisch

    IPC: H05B33/02 ,  H01L25/075 ,  H01L33/50 ,  H01L33/56

    CPC classification number: H05B33/02 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    Abstract: The lighting device has at least one LED chip that is potted by means of a potting compound, which potting compound has a light-transmissive, castable and curable matrix material comprising scattering volumes as filler material, wherein the scattering volumes are distributed inhomogeneously over a thickness of the potting compound and these scattering volumes have a lower density than the matrix material in its castable state. A method is used for producing a lighting device, which comprises at least one LED chip, by means of at least the following steps: potting the at least one LED chip by means of a potting compound containing scattering volumes, wherein the scattering volumes have a lower density than a matrix material of the potting compound in this state; curing the potting compound so that an inhomogeneous distribution of the scattering volumes is obtained owing to floating of the scattering volumes in the matrix material.

    Abstract translation: 照明装置具有至少一个通过灌封化合物封装的LED芯片，该灌封化合物具有透光的，可浇注的和可固化的基质材料，其包含作为填充材料的散射体积，其中散射体积不均匀地分布在厚度 的灌封化合物，并且这些散射体积在其浇注状态下具有比基体材料更低的密度。 一种方法用于通过至少以下步骤来制造包括至少一个LED芯片的照明装置：通过包含散射体积的灌封化合物灌封至少一个LED芯片，其中散射体积具有 在这种状态下比灌封化合物的基质材料更低的密度; 固化灌封化合物，使得由于基体材料中的散射体积的浮动，可以获得散射体积的不均匀分布。

    LIGHT-EMITTING DIODE INCLUDING A PLURALITY OF LUMINESCENT REGIONS
    3.
    发明申请
    LIGHT-EMITTING DIODE INCLUDING A PLURALITY OF LUMINESCENT REGIONS 有权
    发光二极管，包括大量的发光区域

    公开(公告)号：US20150303354A1

    公开(公告)日：2015-10-22

    申请号：US14649564

    申请日：2013-12-03

    Applicant: OSRAM GMBH

    Inventor： Andreas Biebersdorf ,  Florian Boesl ,  Krister Bergenek ,  Ralph Wirth

    IPC: H01L33/50

    CPC classification number: H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/508

    Abstract: Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.

    Abstract translation: 各种实施例可以涉及包括具有用于发射初级光的至少一个发射体表面的LED芯片的发光二极管以及从至少一个发射器表面光学下游连接的多个发光区域。 发光区域中的至少一个较硬的发光区域嵌入在另一个较软的发光区域中。

    LED MODULE WITH LED CHIPS
    7.
    发明申请
    LED MODULE WITH LED CHIPS 有权
    LED模块与LED灯

    公开(公告)号：US20160133612A1

    公开(公告)日：2016-05-12

    申请号：US14899163

    申请日：2014-06-12

    Applicant: OSRAM GMBH

    Inventor： Reiner Windisch ,  Krister Bergenek ,  Andreas Biebersdorf ,  Ralph Wirth

    IPC: H01L25/075 ,  H01L33/50

    CPC classification number: H01L25/0753 ,  F21Y2113/13 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L33/504 ,  H01L33/507 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Various embodiments may relate to an LED module, including a number of first inherently unpackaged LED chips, which are in each case designed to emit light of a first color at a respective light emission area, and a number of second inherently unpackaged LED chips, which are in each case designed to emit light of a second color, different than the first color, at a respective light emission area. The LED chips are provided jointly in a housing, and the respective light emission area of a second LED chip is at least 25% smaller than the respective light emission area of a first LED chip. The sum of the light emission areas of the first LED chips is at least 50% greater than the sum of the light emission areas of the second LED chips.

    Abstract translation: 各种实施例可以涉及LED模块，其包括多个第一固有地未封装的LED芯片，其在每种情况下被设计为在相应的发光区域发射第一颜色的光，以及多个第二固有地未封装的LED芯片，其中 在每种情况下设计成在相应的发光区域发射与第一颜色不同的第二颜色的光。 LED芯片联合设置在壳体中，并且第二LED芯片的各个发光区域比第一LED芯片的各个发光区域小至少25％。 第一LED芯片的发光面积的总和比第二LED芯片的发光面积的和大至少50％。

    CALIBRATING A LIGHTING DEVICE COMPRISING A SEMICONDUCTOR LIGHT SOURCE
    9.
    发明申请
    CALIBRATING A LIGHTING DEVICE COMPRISING A SEMICONDUCTOR LIGHT SOURCE 审中-公开
    校准包含半导体光源的照明设备

    公开(公告)号：US20140117994A1

    公开(公告)日：2014-05-01

    申请号：US14065470

    申请日：2013-10-29

    Applicant: OSRAM GmbH

    Inventor： Andreas Biebersdorf

    IPC: G01R31/44

    CPC classification number: H05B33/0866

    Abstract: In various embodiments, a method for calibrating a lighting device is provided. The lighting device may include at least one semiconductor light source. The method may include: determining a thermal power loss of the at least one semiconductor light source; determining an electrical power of the at least one semiconductor light source; and determining a light power of the at least one semiconductor light source from the electrical power and the thermal power loss.

    Abstract translation: 在各种实施例中，提供了一种用于校准照明装置的方法。 照明装置可以包括至少一个半导体光源。 该方法可以包括：确定至少一个半导体光源的热功率损耗; 确定所述至少一个半导体光源的电功率; 以及从所述电功率和所述热功率损耗确定所述至少一个半导体光源的光功率。

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