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公开(公告)号：US20180368257A1
公开(公告)日：2018-12-20
申请号：US16011689
申请日：2018-06-19
申请人： OSRAM GmbH
摘要： In various embodiments, a substrate for receiving an optoelectronic component is provided. The substrate includes a carrier body, and filler particles, which are embedded in the carrier body and which each have an electrically and thermally highly conductive core and an electrically insulating enveloping layer.
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公开(公告)号：US09380652B2
公开(公告)日：2016-06-28
申请号：US13866052
申请日：2013-04-19
申请人： OSRAM GmbH
IPC分类号： H05B33/02 , H01L25/075 , H01L33/50 , H01L33/56
CPC分类号： H05B33/02 , H01L25/0753 , H01L33/505 , H01L33/56 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： The lighting device has at least one LED chip that is potted by means of a potting compound, which potting compound has a light-transmissive, castable and curable matrix material comprising scattering volumes as filler material, wherein the scattering volumes are distributed inhomogeneously over a thickness of the potting compound and these scattering volumes have a lower density than the matrix material in its castable state. A method is used for producing a lighting device, which comprises at least one LED chip, by means of at least the following steps: potting the at least one LED chip by means of a potting compound containing scattering volumes, wherein the scattering volumes have a lower density than a matrix material of the potting compound in this state; curing the potting compound so that an inhomogeneous distribution of the scattering volumes is obtained owing to floating of the scattering volumes in the matrix material.
摘要翻译： 照明装置具有至少一个通过灌封化合物封装的LED芯片，该灌封化合物具有透光的，可浇注的和可固化的基质材料，其包含作为填充材料的散射体积，其中散射体积不均匀地分布在厚度 的灌封化合物，并且这些散射体积在其浇注状态下具有比基体材料更低的密度。 一种方法用于通过至少以下步骤来制造包括至少一个LED芯片的照明装置：通过包含散射体积的灌封化合物灌封至少一个LED芯片，其中散射体积具有 在这种状态下比灌封化合物的基质材料更低的密度; 固化灌封化合物，使得由于基体材料中的散射体积的浮动，可以获得散射体积的不均匀分布。
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公开(公告)号：US20150233561A1
公开(公告)日：2015-08-20
申请号：US14621410
申请日：2015-02-13
申请人： OSRAM GmbH
CPC分类号： F21V23/005 , B29L2031/06 , B33Y10/00 , B33Y80/00 , F21K9/232 , F21V23/003 , F21V23/06 , F21V29/58 , F21V29/70 , F21Y2101/00 , F21Y2107/20 , F21Y2115/10 , Y10T29/49826
摘要： In various embodiments, a lighting unit is provided. The lighting unit may include a hollow body made of a plastics material as a substrate, which hollow body has an outer surface and an opposite inner surface, wherein the latter at least partially delimits a hollow body internal volume, a plurality of light emitting diodes, which are arranged on the outer surface of the hollow body, and a conductor track structure, which is electrically conductively connected to the light emitting diodes. The conductor track structure is arranged on the inner surface of the hollow body, and the electrically conductive connection to the light emitting diodes is produced by through-contacts, which are passed through the plastics material.
摘要翻译： 在各种实施例中，提供照明单元。 照明单元可以包括由作为基底的塑料材料制成的中空体，该空心体具有外表面和相对的内表面，其中后者至少部分地限定中空体内部体积，多个发光二极管， 其布置在中空体的外表面上，导体轨道结构与导电连接到发光二极管。 导体轨道结构布置在中空体的内表面上，并且与发光二极管的导电连接通过通过塑料材料的通孔产生。
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公开(公告)号：US10292240B2
公开(公告)日：2019-05-14
申请号：US15022570
申请日：2014-09-19
发明人： Matthias Loster , Gertrud Kraeuter , Clemens Meyer
IPC分类号： G01J1/44 , H05B37/02 , H03K17/94 , F21V23/00 , F21V23/04 , H05B33/08 , H05K1/18 , F21Y115/10 , F21Y107/10 , F21Y101/00
摘要： Various embodiments may relate to a sensor unit having a plurality of sensor elements, the detection data of which are used for controlling an opto-electronic light source. According to various embodiments, the plurality of sensor elements are arranged on a substrate body, which is provided in the form of a molded circuit carrier made of a plastic material, and detect different regions and/or sizes.
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公开(公告)号：US20150014711A1
公开(公告)日：2015-01-15
申请号：US14371739
申请日：2013-01-08
申请人： OSRAM GmbH
发明人： Krister Bergenek , Ralph Wirth , Axel Kaltenbacher , Andreas Biebersdorf , Joerg Sorg , Christine Maier , Harald Jaeger , Gertrud Kraeuter , Frank Jermann , Stefan Lange
CPC分类号： H01L33/56 , H01L33/40 , H01L33/483 , H01L33/502 , H01L33/507
摘要： Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.
摘要翻译： 各种实施例涉及包括至少一个光电子半导体芯片布置在其上的载体元件的光电子部件，以及覆盖件，该盖子以围绕半导体芯片周向延伸的区域并与载体元件一起安装在载体元件上 形成密封空腔，其中所述至少一个光电半导体芯片布置在惰性气体中。
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公开(公告)号：US20130309437A1
公开(公告)日：2013-11-21
申请号：US13894461
申请日：2013-05-15
申请人： OSRAM GmbH
发明人： Gertrud Kraeuter
CPC分类号： B05D5/06 , C08G77/62 , C09D183/16 , C09K11/02 , C09K11/08 , Y10T428/23
摘要： A method for producing a luminescent material element which is configured for conversion of pump light is provided. The method may include: providing a polysilazane solution; bringing the polysilazane solution in contact with a luminescent material; and partially curing the polysilazane solution.
摘要翻译： 提供一种用于制造用于泵浦光转换的发光材料元件的制造方法。 该方法可以包括：提供聚硅氮烷溶液; 使聚硅氮烷溶液与发光材料接触; 并部分固化聚硅氮烷溶液。
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公开(公告)号：US09640739B2
公开(公告)日：2017-05-02
申请号：US14371739
申请日：2013-01-08
申请人： OSRAM GmbH
发明人： Krister Bergenek , Ralph Wirth , Axel Kaltenbacher , Andreas Biebersdorf , Joerg Sorg , Christine Maier , Harald Jaeger , Gertrud Kraeuter , Frank Jermann , Stefan Lange
CPC分类号： H01L33/56 , H01L33/40 , H01L33/483 , H01L33/502 , H01L33/507
摘要： Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.
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公开(公告)号：US09500351B2
公开(公告)日：2016-11-22
申请号：US14621410
申请日：2015-02-13
申请人： OSRAM GmbH
IPC分类号： F21S4/00 , F21V23/00 , F21K99/00 , F21V29/70 , B33Y80/00 , B33Y10/00 , F21V23/06 , F21Y101/02 , F21Y111/00 , F21V29/58 , B29L31/06
CPC分类号： F21V23/005 , B29L2031/06 , B33Y10/00 , B33Y80/00 , F21K9/232 , F21V23/003 , F21V23/06 , F21V29/58 , F21V29/70 , F21Y2101/00 , F21Y2107/20 , F21Y2115/10 , Y10T29/49826
摘要： In various embodiments, a lighting unit is provided. The lighting unit may include a hollow body made of a plastics material as a substrate, which hollow body has an outer surface and an opposite inner surface, wherein the latter at least partially delimits a hollow body internal volume, a plurality of light emitting diodes, which are arranged on the outer surface of the hollow body, and a conductor track structure, which is electrically conductively connected to the light emitting diodes. The conductor track structure is arranged on the inner surface of the hollow body, and the electrically conductive connection to the light emitting diodes is produced by through-contacts, which are passed through the plastics material.
摘要翻译： 在各种实施例中，提供照明单元。 照明单元可以包括由作为基底的塑料材料制成的中空体，该空心体具有外表面和相对的内表面，其中后者至少部分地限定中空体内部体积，多个发光二极管， 其布置在中空体的外表面上，导体轨道结构与导电连接到发光二极管。 导体轨道结构布置在中空体的内表面上，并且与发光二极管的导电连接通过通过塑料材料的通孔产生。
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公开(公告)号：US20160295664A1
公开(公告)日：2016-10-06
申请号：US15022570
申请日：2014-09-19
发明人： Matthias Loster , Gertrud Kraeuter , Clemens Meyer
CPC分类号： H05B37/0227 , F21V23/005 , F21V23/0464 , F21V23/0471 , F21Y2101/00 , F21Y2107/10 , F21Y2115/10 , G01J1/44 , H03K17/94 , H05B33/0806 , H05B33/0854 , H05B37/0218 , H05K1/181 , H05K2201/09018 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151
摘要： Various embodiments may relate to a sensor unit having a plurality of sensor elements, the detection data of which are used for controlling an opto-electronic light source. According to various embodiments, the plurality of sensor elements are arranged on a substrate body, which is provided in the form of a molded circuit carrier made of a plastic material, and detect different regions and/or sizes.
摘要翻译： 各种实施例可以涉及具有多个传感器元件的传感器单元，其检测数据用于控制光电光源。 根据各种实施例，多个传感器元件布置在基板主体上，该基板体以由塑料材料制成的模制电路载体的形式提供，并且检测不同的区域和/或尺寸。
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公开(公告)号：US20130293097A1
公开(公告)日：2013-11-07
申请号：US13866052
申请日：2013-04-19
申请人： OSRAM GmbH
IPC分类号： H05B33/02
CPC分类号： H05B33/02 , H01L25/0753 , H01L33/505 , H01L33/56 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： The lighting device has at least one LED chip that is potted by means of a potting compound, which potting compound has a light-transmissive, castable and curable matrix material comprising scattering volumes as filler material, wherein the scattering volumes are distributed inhomogeneously over a thickness of the potting compound and these scattering volumes have a lower density than the matrix material in its castable state. A method is used for producing a lighting device, which comprises at least one LED chip, by means of at least the following steps: potting the at least one LED chip by means of a potting compound containing scattering volumes, wherein the scattering volumes have a lower density than a matrix material of the potting compound in this state; curing the potting compound so that an inhomogeneous distribution of the scattering volumes is obtained owing to floating of the scattering volumes in the matrix material.
摘要翻译： 照明装置具有至少一个通过灌封化合物封装的LED芯片，该灌封化合物具有透光的，可浇注的和可固化的基质材料，其包含作为填充材料的散射体积，其中散射体积不均匀地分布在厚度 的灌封化合物，并且这些散射体积在其浇注状态下具有比基体材料更低的密度。 一种方法用于通过至少以下步骤来制造包括至少一个LED芯片的照明装置：通过包含散射体积的灌封化合物灌封至少一个LED芯片，其中散射体积具有 在这种状态下比灌封化合物的基质材料更低的密度; 固化灌封化合物，使得由于基体材料中的散射体积的浮动，可以获得散射体积的不均匀分布。
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