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    LIGHTING DEVICE AND METHOD OF MANUGACTURING IT
    3.
    发明申请
    LIGHTING DEVICE AND METHOD OF MANUGACTURING IT 审中-公开
    照明设备及其制造方法

    公开(公告)号：US20160363293A1

    公开(公告)日：2016-12-15

    申请号：US15182684

    申请日：2016-06-15

    Applicant: OSRAM GmbH

    Inventor： Marco Munarin ,  Martin Reiss ,  Alberto Alfier ,  Thomas Rieger

    IPC: F21V15/01

    CPC classification number: F21V15/012 ,  F21S4/22 ,  F21V15/013 ,  F21V19/004 ,  F21V31/005 ,  F21V31/04 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2115/10

    Abstract: In various embodiments, a lighting device is provided. The lighting device includes a channel-shaped elongate profiled body having a central or web portion and two side portions sidewise of the web portion, a profiled body having mutually opposed undercuts opening inwardly of the channel shape of profiled body, and a light radiation source assembly including an elongate support board carrying one or more light radiation sources, e.g. LED sources, the support board having longitudinal sides extending into the said undercuts, wherein the light radiation source assembly is retained by the channel-shaped profiled body.

    Abstract translation: 在各种实施例中，提供照明装置。 照明装置包括通道形的细长成型体，其具有中央或腹板部分和腹板部分的侧面的两个侧面部分，成型体具有相对的向下开口，其形状为成型体的通道形状;以及光辐射源组件 包括承载一个或多个光辐射源的细长支撑板，例如 LED源，所述支撑板具有延伸到所述底切部分中的纵向侧面，其中所述光辐射源组件被所述槽形异型体保持。

    METHOD FOR PRODUCING SUPPORT STRUCTURES FOR LIGHTING DEVICES AND CORRESPONDING DEVICE
    4.
    发明申请
    METHOD FOR PRODUCING SUPPORT STRUCTURES FOR LIGHTING DEVICES AND CORRESPONDING DEVICE 审中-公开

    公开(公告)号：US20190021169A1

    公开(公告)日：2019-01-17

    申请号：US16032089

    申请日：2018-07-11

    Applicant: OSRAM GmbH

    Inventor： Lorenzo Baldo ,  Alessio Griffoni ,  Thomas Rieger

    IPC: H05K1/18 ,  H05K3/12 ,  H05K3/40 ,  F21V19/00 ,  H05K3/30 ,  H05K3/00

    Abstract: A method for forming support structures for electrically-powered lighting devices, the method comprising: providing an electrically insulating ribbon-like substrate, forming electrically-conductive lines on a surface of the substrate by screen printing of electrically-conductive ink, the screen printing comprising printing a plurality of repeated printed images, which follow one another along a longitudinal direction and are separated from each other by separation gaps, and forming electrically-conductive ink jumpers that extend through the separation gaps and which provide electrical continuity between electrically-conductive lines of adjacent printed images, wherein forming ink jumpers comprises delivering electrically-conductive ink by inkjet printing.

    A METHOD OF THERMAL DECOUPLING OF PRINTED CIRCUITS AND A PRINTED CIRCUIT FOR USE THEREIN
    7.
    发明申请
    A METHOD OF THERMAL DECOUPLING OF PRINTED CIRCUITS AND A PRINTED CIRCUIT FOR USE THEREIN 审中-公开

    公开(公告)号：US20190059163A1

    公开(公告)日：2019-02-21

    申请号：US15761453

    申请日：2016-09-19

    Applicant: OSRAM GmbH

    Inventor： Thomas Rieger ,  Davide Grosso ,  Franco Zanon

    IPC: H05K3/40 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  F21V29/10

    Abstract: In order to counter heat propagation between adjacent sections of a ribbon-like printed circuit board, the sections being individually exposed to heat between opposed border lines, with printed circuit board including an electrically insulating substrate with electrically conductive pads for mounting components thereon, the adjacent sections are terminated at the opposed border lines with at least one electrically conductive borderline pad, which has a separation gap to the border line, and/or is coupled to an electrically conductive line extending on substrate between a first end at borderline pad and a second end away from borderline pad. The first end and the second end may be located at a first and at a second distances to border line, the second distance being longer than the first distance, and/or the electrically conductive line may have a narrower cross section than the first and the second ends.

    METHOD FOR MANUFACTURING A LIGHT-EMITTING DEVICE
    8.
    发明申请
    METHOD FOR MANUFACTURING A LIGHT-EMITTING DEVICE 有权

    公开(公告)号：US20210351317A1

    公开(公告)日：2021-11-11

    申请号：US17283973

    申请日：2019-10-10

    Applicant: OSRAM GmbH

    Inventor： Davide Grosso ,  Thomas Rieger ,  Hans Layer

    IPC: H01L33/00 ,  H01L33/46 ,  H01L33/62

    Abstract: A method for manufacturing a light-emitting device may include producing a support having at least one conductor track on a surface of the support. The method may further include producing a reflective coating directly on the at least one conductor track by means of a film transfer method such that the conductor track is substantially covered by the reflective coating and arranging a light-emitting component on or above the reflective coating. The light-emitting component may be electrically conductively connected to the conductor track(s).

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