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    Driver circuit for light-emitting component
    3.
    发明授权
    Driver circuit for light-emitting component 有权

    公开(公告)号：US10785841B2

    公开(公告)日：2020-09-22

    申请号：US16328794

    申请日：2017-08-30

    Applicant: OSRAM OLED GmbH

    Inventor： Andreas Wojcik ,  Hubert Halbritter ,  Josip Maric

    IPC: H05B45/37 ,  H05B45/46 ,  H01S5/40 ,  H05B45/44 ,  H01S5/042

    Abstract: A driver circuit for at least one light-emitting optoelectronic component includes a control circuit having a capacitor and a control switch, wherein the control switch electrically connects to the component such that the component is supplied with current by the capacitor as a function of a switching state of the control switch, and a charging circuit having at least a first charging switch, a bias resistor and a buffer capacitor, wherein the charging circuit electrically connects to the capacitor and is configured to charge the capacitor through the bias resistor, and the buffer capacitor is linked to a connecting line between the bias resistor and the capacitor.

    Sensor device
    4.
    发明授权
    Sensor device 审中-公开

    公开(公告)号：US10672815B2

    公开(公告)日：2020-06-02

    申请号：US15557589

    申请日：2016-03-17

    Applicant: OSRAM OLED GMBH

    Inventor： Karsten Auen ,  Andreas Wojcik ,  Hubert Halbritter ,  Tim Böscke

    IPC: H01L27/146 ,  G01S17/89

    Abstract: A sensor device is disclosed. In an embodiment, the sensor device includes a carrier having a plane carrier surface, a plurality of photodetectors arranged on the carrier surface, each photodetector including a photosensitive sensor area and a lens arrangement arranged opposite the sensor areas, wherein the lens arrangement includes an optical axis, wherein the lens arrangement is configured to image electromagnetic radiation onto the sensor areas, wherein the plurality of photodetectors comprise at least one first photodetector having a first sensor area, the first sensor area comprises at least one property which differs from a property of a second sensor area of a second photodetector of the plurality of photodetectors, and wherein the second photodetector is arranged closer to the optical axis than the at least one first photodetector in order to reduce an optical imaging aberration of the lens arrangement.

    Laser component and method of producing a laser component
    5.
    发明授权
    Laser component and method of producing a laser component 有权

    公开(公告)号：US10741993B2

    公开(公告)日：2020-08-11

    申请号：US16338559

    申请日：2017-10-26

    Applicant: OSRAM OLED GmbH

    Inventor： Hubert Halbritter ,  Andreas Wojcik

    IPC: H01S5/022 ,  H01S5/00 ,  G02B6/42

    Abstract: A laser component including a molded body, and a laser chip embedded into the molded body and configured to emit a laser beam in an emission direction, wherein a surface of the molded body includes a deflection section arranged and inclined relative to the emission direction such that a laser beam emitted by the laser chip impinges on the deflection section and is subjected to total internal reflection at the deflection section.

    Method of producing an optoelectronic lighting device and optoelectronic lighting device
    6.
    发明授权
    Method of producing an optoelectronic lighting device and optoelectronic lighting device 有权

    公开(公告)号：US10931081B2

    公开(公告)日：2021-02-23

    申请号：US16074925

    申请日：2017-02-03

    Applicant: OSRAM OLED GmbH

    Inventor： Andreas Wojcik ,  Tobias Gebuhr ,  Markus Pindl

    IPC: H01L21/70 ,  H01S5/02 ,  H01S5/022

    Abstract: A method of producing an optoelectronic lighting device includes providing a laser chip carrier on which two edge emitting laser chips, arranging a carrier including two optical elements onto the laser chip carrier, forming a respective optical connection by an optical material between a respective laser facet and a respective optical element, singulating the two laser chips by dividing the laser chip carrier between the two laser chips to form two mutually divided laser chip carrier parts, wherein the dividing includes dividing the carrier between the two optical elements to form two mutually divided carrier parts each including one of the two optical elements, such that two singulated laser chips arranged on the respective divided laser chip carrier part are formed, the respective laser facets of which are optically connected to the respective optical element of the respective carrier part by the optical material.

    SEMICONDUCTOR LASER COMPONENT AND METHOD OF PRODUCING A SEMICONDUCTOR LASER COMPONENT
    7.
    发明申请
    SEMICONDUCTOR LASER COMPONENT AND METHOD OF PRODUCING A SEMICONDUCTOR LASER COMPONENT 审中-公开

    公开(公告)号：US20200176948A1

    公开(公告)日：2020-06-04

    申请号：US16615452

    申请日：2018-05-18

    Applicant: OSRAM OLED GmbH

    Inventor： Andreas Wojcik ,  Hubert Halbritter ,  Thomas Schwarz

    IPC: H01S5/022 ,  H01S5/028 ,  H01S5/042

    Abstract: A semiconductor laser component including a semiconductor chip arranged to emit laser radiation, a cladding that is electrically insulating and covers the semiconductor chip in places, and a bonding layer that electrically conductively connects the semiconductor chip to a first connection point, wherein the semiconductor chip includes a cover surface, a bottom surface, a first front surface, a second front surface, a first side surface and a second side surface, the first front surface is arranged to decouple the laser beam, the cladding covers the semiconductor chip at least in places on the cover surface, the second front surface, the first side surface and the second side surface, and the bonding layer on the cladding extends from the cover surface to the first connection point.

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