公开(公告)号：US11881544B2

公开(公告)日：2024-01-23

申请号：US17960794

申请日：2022-10-05

Applicant: OSRAM OLED GmbH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

CPC classification number: H01L33/54 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/502 ,  H01L21/568 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/2518 ,  H01L2224/82 ,  H01L2933/005 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US11189990B2

公开(公告)日：2021-11-30

申请号：US16615452

申请日：2018-05-18

Applicant: OSRAM OLED GmbH

Inventor： Andreas Wojcik ,  Hubert Halbritter ,  Thomas Schwarz

IPC: H01S5/0231 ,  H01S5/0234 ,  H01S5/02234 ,  H01S5/0232 ,  H01S5/0236 ,  H01S5/0233 ,  H01L23/00 ,  H01S5/042 ,  H01S5/02345 ,  H01S5/028

Abstract: A semiconductor laser component including a semiconductor chip arranged to emit laser radiation, a cladding that is electrically insulating and covers the semiconductor chip in places, and a bonding layer that electrically conductively connects the semiconductor chip to a first connection point, wherein the semiconductor chip includes a cover surface, a bottom surface, a first front surface, a second front surface, a first side surface and a second side surface, the first front surface is arranged to decouple the laser beam, the cladding covers the semiconductor chip at least in places on the cover surface, the second front surface, the first side surface and the second side surface, and the bonding layer on the cladding extends from the cover surface to the first connection point.

公开(公告)号：US10607969B2

公开(公告)日：2020-03-31

申请号：US16098212

申请日：2017-05-09

Applicant: OSRAM OLED GmbH

Inventor： Jürgen Moosburger ,  Frank Singer ,  Thomas Schwarz ,  Alexander Martin

IPC: H01L25/075 ,  G09F9/302 ,  H01L33/58 ,  H01L33/54 ,  G09F9/33 ,  G09F27/00 ,  H01L33/62 ,  H01L33/48

Abstract: A module for a video wall is disclosed. In an embodiment a module includes a carrier, a plurality of components comprising at least one light-emitting structural element arranged on the carrier and an optical element, wherein the components are arranged at a prespecified lateral distance in relation to one another, wherein a retaining recess is formed between at least two components, wherein the retaining recess comprises at least two component recesses of two components which are arranged next to one another, wherein a retaining pin is fastened in the retaining recess, wherein the retaining pin is connected to the optical element, and wherein the optical element is configured to influence light irradiation onto the components and/or light emission from the components.

公开(公告)号：US11282823B2

公开(公告)日：2022-03-22

申请号：US16757270

申请日：2018-10-16

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz

IPC: H04B10/00 ,  H01L25/16 ,  H05B45/20 ,  H05B47/185 ,  H04B10/50

Abstract: A semiconductor device with at least one radiation emitting optical semiconductor chip, an integrated circuit, and exactly two connecting contacts. The semiconductor device has a variable radiation characteristic which is controlled as a function of a voltage signal both for data transmission and for supplying the semiconductor device which can be applied to the connecting contacts and varied over time.

公开(公告)号：US11276803B2

公开(公告)日：2022-03-15

申请号：US15534155

申请日：2015-12-04

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/62 ,  H01L33/00 ,  H01L23/00 ,  H01L33/60 ,  H01L21/56

Abstract: In an embodiment an optoelectronic semiconductor device includes a semiconductor chip having a semiconductor layer sequence with an active region, a radiation exit surface arranged parallel to the active region and a plurality of side faces arranged obliquely or perpendicular to the radiation exit surface. The device further includes a contact track electrically connecting the semiconductor chip to a contact surface configured to externally contact the semiconductor device, a molding and a rear side of the semiconductor chip remote from the radiation exit surface, the rear side being free of a material of the molding, wherein one of the side faces is configured as a mounting side face for fastening of the semiconductor device, and wherein the contact track partially runs on one of the side faces.

公开(公告)号：US10964861B2

公开(公告)日：2021-03-30

申请号：US16866890

申请日：2020-05-05

Applicant: OSRAM OLED GmbH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US10854804B2

公开(公告)日：2020-12-01

申请号：US15565239

申请日：2016-04-07

Applicant: OSRAM OLED GmbH

Inventor： Martin Haushalter ,  Frank Singer ,  Thomas Schwarz ,  Andreas Ploessl

IPC: H01L33/60 ,  H01L33/64 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

Abstract: A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.

公开(公告)号：US10665758B2

公开(公告)日：2020-05-26

申请号：US15747188

申请日：2016-07-14

Applicant: OSRAM OLED GmbH

Inventor： Christian Leirer ,  Thomas Schwarz ,  Lutz Höppel

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/30 ,  H01L33/44

Abstract: A component having a metal carrier and a method for producing a component are disclosed. In an embodiment the component includes a carrier having a metallic carrier layer, an insulating layer and a first through-contact extending in a vertical direction throughout the carrier layer, wherein the through-contact is electrically isolated from the carrier layer via the insulating layer. The component further includes a semiconductor body and a wiring structure arranged in the vertical direction between the carrier and the semiconductor body at least places and electrically contacting the semiconductor body, wherein the wiring structure has a first connection area and a second connection area, wherein the connection areas adjoin the carrier and are assigned to different electrical polarities of the component, wherein the first through-contact is in electrical contact with one of the connection areas, and wherein the component is configured to be externally electrically connectable via the carrier.

公开(公告)号：US11784062B2

公开(公告)日：2023-10-10

申请号：US16765801

申请日：2018-11-23

Applicant: Osram OLED GmbH

Inventor： Thomas Schwarz ,  Andreas Plössl ,  Jörg Sorg

IPC: H01L21/50 ,  H01L25/075 ,  H01L25/16 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L21/48 ,  H01L21/52

CPC classification number: H01L21/50 ,  H01L21/4803 ,  H01L21/52 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: The invention relates to a method for producing optoelectronic components. The invention comprises: provision of a metal substrate, the substrate having a front side and a rear side opposite the front side; front-side removal of substrate material such that the substrate comprises substrate sections protruding in the region of the front side and recesses arranged there between; formation of a plastic body adjacent to substrate sections; arrangement of optoelectronic semiconductor chips on substrate sections; rear-side removal of substrate material in the region of the recesses, such that the substrate is structured into separate substrate sections; and performance of a separation process. The plastic body is divided into separate substrate sections and individual optoelectronic components with at least one optoelectronic semiconductor chip are formed. The invention also relates to an optoelectronic component.

公开(公告)号：US11251081B2

公开(公告)日：2022-02-15

申请号：US16758659

申请日：2018-10-25

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schwarz ,  Lutz Höppel ,  Thorsten Frank Baumheinrich ,  Jens Richter

IPC: H01L21/78 ,  H01L25/16

Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned. In a step F) separation trenches (6) are introduced between the electronic circuits, which extend from a side of the electronic circuits facing away from the carrier to the sacrificial layer and penetrate the thinned semiconductor substrate. In a step G) the sacrificial layer is removed in the region between the electronic circuits and the carrier.