公开(公告)号：US12080834B2

公开(公告)日：2024-09-03

申请号：US17270761

申请日：2019-08-09

Applicant: OSRAM OLED GmbH

Inventor： Simon Jerebic ,  Daniel Leisen ,  Philipp Pust ,  Thomas Birke

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/24 ,  H01L33/60

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/24 ,  H01L33/60 ,  H01L2933/0041

Abstract: In an embodiment an optoelectronic lighting device includes a carrier, exactly one light-emitting optoelectronic semiconductor component, wherein the semiconductor component has a light emission area on at least one surface side, and wherein the semiconductor component is arranged on an upper side of the carrier, at least one functional layer arranged above the light emission area and/or adjacent to the light emission area and an edging for the functional layer, wherein the edging surrounds the functional layer when viewed in a circumferential direction, the circumferential direction being parallel to the upper side of the carrier around the functional layer, and wherein the edging is formed of a transparent material.

公开(公告)号：US20240395983A1

公开(公告)日：2024-11-28

申请号：US18795489

申请日：2024-08-06

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Simon Jerebic ,  Philipp Pust ,  Thomas Birke

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/24 ,  H01L33/60

Abstract: In an embodiment an optoelectronic lighting device includes a carrier, at least one light-emitting optoelectronic semiconductor component arranged on an upper side of the carrier and having a first light emission area on a surface side facing away from the carrier and a second light emission area on a side surface perpendicular to the carrier, at least one functional layer arranged on the first light emission area and on the second light emission area, wherein the functional layer is a conversion layer containing phosphor, and a border interface surrounding the functional layer in plan view, wherein the border interface includes a transparent material, and wherein the border interface is located on an outer surface of the optoelectronic lighting device.

公开(公告)号：US12211956B2

公开(公告)日：2025-01-28

申请号：US17254129

申请日：2019-06-27

Applicant: OSRAM OLED GmbH

Inventor： Andreas Reith ,  Rainer Bradl ,  Ulrich Streppel ,  Thomas Birke

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/40

Abstract: A radiation-emitting component is specified with—a carrier which has a top surface a radiation-emitting semiconductor chip arranged on the top surface of the carrier and configured to generate primary electromagnetic radiation, a first reflector layer arranged above a top surface of the semiconductor chip, and a cover body arranged between the first reflector layer and the radiation-emitting semiconductor chip, wherein a side surface of the cover body is inclined to the top surface of the carrier. Furthermore, a method for producing such a radiation-emitting component is specified.

公开(公告)号：US20210280751A1

公开(公告)日：2021-09-09

申请号：US17270761

申请日：2019-08-09

Applicant: OSRAM OLED GmbH

Inventor： Simon Jerebic ,  Daniel Leisen ,  Philipp Pust ,  Thomas Birke

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/24 ,  H01L33/60

Abstract: In an embodiment an optoelectronic lighting device includes a carrier, exactly one light-emitting optoelectronic semiconductor component, wherein the semiconductor component has a light emission area on at least one surface side, and wherein the semiconductor component is arranged on an upper side of the carrier, at least one functional layer arranged above the light emission area and/or adjacent to the light emission area and an edging for the functional layer, wherein the edging surrounds the functional layer when viewed in a circumferential direction, the circumferential direction being parallel to the upper side of the carrier around the functional layer, and wherein the edging is formed of a transparent material.