公开(公告)号：US11670745B2

公开(公告)日：2023-06-06

申请号：US16634585

申请日：2018-07-18

Applicant: Osram OLED GmbH

Inventor： Klaus Reingruber ,  Andreas Reith ,  Tobias Gebuhr

IPC: H01L33/54 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L33/507 ,  H01L2933/005 ,  H01L2933/0041

Abstract: A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.

公开(公告)号：US20200212271A1

公开(公告)日：2020-07-02

申请号：US16634585

申请日：2018-07-18

Applicant: Osram OLED GmbH

Inventor： Klaus Reingruber ,  Andreas Reith ,  Tobias Gebuhr

IPC: H01L33/54 ,  H01L33/50

Abstract: A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.

公开(公告)号：US11367691B2

公开(公告)日：2022-06-21

申请号：US17054730

申请日：2019-07-08

Applicant: OSRAM OLED GmbH

Inventor： Matthias Kiessling ,  Andreas Reith

IPC: H01L23/544

Abstract: An electronic semiconductor component with a housing structure and a cavity introduced into the housing structure is specified. The cavity comprises a base surface. Furthermore, the electronic semiconductor component comprises an auxiliary layer arranged on the base surface of the cavity and a marking penetrating the auxiliary layer at least as far as the base surface of the cavity. The marking comprises an optical contrast that depends on both an optical property of the housing structure and an optical property of the auxiliary layer. Furthermore, a method for producing an electronic semiconductor component is given.

公开(公告)号：US12211956B2

公开(公告)日：2025-01-28

申请号：US17254129

申请日：2019-06-27

Applicant: OSRAM OLED GmbH

Inventor： Andreas Reith ,  Rainer Bradl ,  Ulrich Streppel ,  Thomas Birke

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/40

Abstract: A radiation-emitting component is specified with—a carrier which has a top surface a radiation-emitting semiconductor chip arranged on the top surface of the carrier and configured to generate primary electromagnetic radiation, a first reflector layer arranged above a top surface of the semiconductor chip, and a cover body arranged between the first reflector layer and the radiation-emitting semiconductor chip, wherein a side surface of the cover body is inclined to the top surface of the carrier. Furthermore, a method for producing such a radiation-emitting component is specified.

公开(公告)号：US12057539B2

公开(公告)日：2024-08-06

申请号：US17055040

申请日：2019-04-02

Applicant: OSRAM OLED GmbH

Inventor： Andreas Reith ,  Paola Altieri-Weimar

IPC: H01L27/15 ,  H01L25/16 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/486

Abstract: The invention relates to an optoelectronic component having: a carrier; an optoelectronic semiconductor chip; an insulation layer, which has an electrically insulating material; and a first contact layer, which has an electrically conductive material. According to the invention, the insulation layer is arranged on the carrier and has a cavity; the semiconductor chip is arranged in the cavity; the first contact layer is arranged between the semiconductor chip and the carrier and between the insulation layer and the carrier; and the first contact layer has at least one interruption, such that the carrier is free of the first contact layer at least in some parts in the region of the cavity.