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公开(公告)号：US11501681B2
公开(公告)日：2022-11-15
申请号：US17251072
申请日：2019-05-24
Applicant: OSRAM OLED GmbH
Inventor： Tilman Rügheimer , Hubert Halbritter
Abstract: In an embodiment an arrangement includes a plurality of pixels, wherein each pixel includes at least two subpixels of each color, wherein each color is defined by a predefined target color location, wherein each subpixel comprises an optoelectronic component defined by a color location, wherein the color locations of the optoelectronic components of each color is chosen such that during operation of the optoelectronic components the predefined target color location is met for each color, wherein the optoelectronic components for each color are of identical design, and a controller configured to commonly control the optoelectronic components of a color.
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公开(公告)号：US11979000B2
公开(公告)日：2024-05-07
申请号：US16964072
申请日：2019-01-23
Applicant: OSRAM OLED GmbH
Inventor： Tilman Rügheimer , Hubert Halbritter
CPC classification number: H01S5/02461 , H01S5/0207 , H01S5/0217 , H01S5/02469 , H01S5/04253 , H01S5/04254 , H01S5/1833 , H01S5/18377 , H01S5/021 , H01S5/0216 , H01S5/04256 , H01S5/18313 , H01S5/18327 , H01S5/423
Abstract: Surface-emitting semiconductor laser chip (1) comprising a carrier (20), a layer stack (10) arranged on the carrier (20) and having a layer plane (L) extending perpendicularly to the stacking direction (R), a front side contact (310) and a rear side contact (320), in which in operation a predetermined distribution of a current density (I) is achieved by means of current constriction in the layer stack (10), wherein in the carrier (20) an electrical through-connection (200) is provided, which extends from a bottom surface (20a) of the carrier (20) facing away from the layer stack (10) to a surface of the carrier (20) facing the layer stack (10), and the distribution of the current density (I) is significantly influenced by the shape and size of the cross-section of the through-connection (200) parallel to the layer plane (L) on the surface facing the layer stack.
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公开(公告)号：US20210050710A1
公开(公告)日：2021-02-18
申请号：US16964072
申请日：2019-01-23
Applicant: OSRAM OLED GmbH
Inventor： Tilman Rügheimer , Hubert Halbritter
Abstract: Surface-emitting semiconductor laser chip (1) comprising a carrier (20), a layer stack (10) arranged on the carrier (20) and having a layer plane (L) extending perpendicularly to the stacking direction (R), a front side contact (310) and a rear side contact (320), in which in operation a predetermined distribution of a current density (I) is achieved by means of current constriction in the layer stack (10), wherein in the carrier (20) an electrical through-connection (200) is provided, which extends from a bottom surface (20a) of the carrier (20) facing away from the layer stack (10) to a surface of the carrier (20) facing the layer stack (10), and the distribution of the current density (I) is significantly influenced by the shape and size of the cross-section of the through-connection (200) parallel to the layer plane (L) on the surface facing the layer stack.
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公开(公告)号：US20210209991A1
公开(公告)日：2021-07-08
申请号：US17251072
申请日：2019-05-24
Applicant: OSRAM OLED GmbH
Inventor： Tilman Rügheimer , Hubert Halbritter
Abstract: In an embodiment an arrangement includes a plurality of pixels, wherein each pixel includes at least two subpixels of each color, wherein each color is defined by a predefined target color location, wherein each subpixel comprises an optoelectronic component defined by a color location, wherein the color locations of the optoelectronic components of each color is chosen such that during operation of the optoelectronic components the predefined target color location is met for each color, wherein the optoelectronic components for each color are of identical design, and a controller configured to commonly control the optoelectronic components of a color.
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