公开(公告)号：US20180219125A1

公开(公告)日：2018-08-02

申请号：US15746625

申请日：2016-07-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Wicke ,  Michael Wittmann

IPC: H01L33/08 ,  H01L33/60 ,  H01L33/62 ,  H01L33/50 ,  H01L33/56

CPC classification number: H01L33/08 ,  H01L33/504 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

Abstract: An optoelectronic lighting device includes a black housing including a cavity, wherein the cavity includes a base, a semiconductor component is arranged on the base of the cavity with an underside of a main body facing the base, and the cavity is filled with a reflective material from the base up to a predetermined height, which is smaller than a height of a top side of the main body relative to the base of the cavity such that electromagnetic radiation emerging from the main body through side faces may be reflected by the reflective material back in the direction of the side faces to couple reflected electromagnetic radiation into the main body such that at least part of the electromagnetic radiation coupled in may emerge again from the main body through the top side of the main body.

公开(公告)号：US10418515B2

公开(公告)日：2019-09-17

申请号：US15746625

申请日：2016-07-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Wicke ,  Michael Wittmann

IPC: H01L33/08 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/58

Abstract: An optoelectronic lighting device includes a black housing including a cavity, wherein the cavity includes a base, a semiconductor component is arranged on the base of the cavity with an underside of a main body facing the base, and the cavity is filled with a reflective material from the base up to a predetermined height, which is smaller than a height of a top side of the main body relative to the base of the cavity such that electromagnetic radiation emerging from the main body through side faces may be reflected by the reflective material back in the direction of the side faces to couple reflected electromagnetic radiation into the main body such that at least part of the electromagnetic radiation coupled in may emerge again from the main body through the top side of the main body.

公开(公告)号：US20160307674A1

公开(公告)日：2016-10-20

申请号：US15101136

申请日：2014-12-02

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Klaus Hoehn ,  Luca Haiberger ,  Markus Wicke

IPC: H01C7/10 ,  H01L27/02 ,  H01L25/16 ,  H01C17/065 ,  H01L33/62

Abstract: A varistor paste includes a matrix material and particles embedded into the matrix material, wherein the matrix material without embedded particles has a viscosity of less than 0.8 Pa·s, and the embedded particles include varistor particles. An optoelectronic component includes an optoelectronic semiconductor chip and a varistor element connected in parallel with the optoelectronic semiconductor chip, wherein the varistor element includes a matrix material and particles embedded into the matrix material, the embedded particles include varistor particles, and the matrix material has a glass transition temperature of more than 130° C. A method of producing a varistor paste includes providing a matrix material having a viscosity of less than 0.8 Pa·s; and embedding particles into the matrix material to form a varistor paste, wherein the embedded particles include varistor particles.

Abstract translation: 压敏电阻糊包括基质材料和嵌入基质材料中的颗粒，其中不含嵌入颗粒的基体材料具有小于0.8Pa·s的粘度，并且嵌入的颗粒包括变阻器颗粒。 光电子部件包括与光电子半导体芯片并联连接的光电子半导体芯片和变阻器元件，其中，所述变阻器元件包括嵌入到所述基体材料中的基体材料和微粒，所述嵌入粒子包括变阻器粒子，所述基体材料具有 玻璃化转变温度大于130℃。制造非线性电阻糊的方法包括提供粘度小于0.8Pa·s的基质材料; 并将颗粒嵌入基质材料中以形成压敏胶浆，其中所述嵌入的颗粒包括变阻器颗粒。

公开(公告)号：US10115713B2

公开(公告)日：2018-10-30

申请号：US14430625

申请日：2013-09-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Markus Wicke ,  Yanqi Wang

IPC: H01L33/00 ,  H01L31/10 ,  H01L25/16 ,  H01L31/14 ,  H01L31/0232 ,  H05B33/08

Abstract: An optoelectronic assembly includes at least one first component that emits first electromagnetic radiation and at least one first photosensitive component that controls the first component. The first photosensitive component connects in parallel to the first component and has a first radiation-sensitive region in a beam path of the first electromagnetic radiation.

公开(公告)号：US20150236000A1

公开(公告)日：2015-08-20

申请号：US14430625

申请日：2013-09-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Luca Haiberger ,  Markus Wicke ,  Yanqi Wang

IPC: H01L25/16 ,  H01L31/0232 ,  H05B33/08 ,  H01L31/14

CPC classification number: H01L25/167 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic assembly includes at least one first component that emits first electromagnetic radiation and at least one first photosensitive component that controls the first component. The first photosensitive component connects in parallel to the first component and has a first radiation-sensitive region in a beam path of the first electromagnetic radiation.

Abstract translation: 光电组件包括发射第一电磁辐射的至少一个第一部件和控制第一部件的至少一个第一光敏部件。 第一感光部件与第一部件并联连接，并且在第一电磁辐射的光束路径中具有第一辐射敏感区域。