公开(公告)号：US20230265981A1

公开(公告)日：2023-08-24

申请号：US17768698

申请日：2020-12-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin BRANDL ,  Clemens HOFMANN ,  Daniel RICHTER

IPC: F21S41/19 ,  F21S45/47 ,  F21S41/148 ,  F21S41/151

CPC classification number: F21S41/192 ,  F21S45/47 ,  F21S41/148 ,  F21S41/151 ,  F21Y2107/90

Abstract: The disclosure relates to a halogen lamp replacement, in particular for car headlights, having a carrier plate which is covered on both main surfaces by structured electrically conductive layers, to which at least one respective light-emitting component, in particular at least one respective light-emitting-diode chip, is attached, the carrier plate being designed to dissipate heat generated by the light-emitting components to a heat sink formed by a coupling structure.

公开(公告)号：US20160104822A1

公开(公告)日：2016-04-14

申请号：US14889837

申请日：2014-05-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Britta GOEOETZ ,  Martin BRANDL ,  Markus BURGER ,  Norwin VON MALM

IPC: H01L33/50 ,  F21V9/16 ,  B29D11/00

CPC classification number: H01L33/505 ,  B29D11/0074 ,  B29D11/00932 ,  B29K2083/00 ,  F21V9/30 ,  H01L33/501 ,  H01L33/508 ,  H01L33/54 ,  H01L2933/0041

Abstract: Disclosed is a method for producing a wavelength conversion element (10) wherein a wavelength conversion layer (100) is provided, the surface thereof is treated with a plasma (50), and the wavelength conversion layer is punched. Also disclosed are a wavelength conversion layer and an optoelectronic component comprising a wavelength conversion layer.

Abstract translation: 公开了一种制造其中提供波长转换层（100）的波长转换元件（10）的方法，其表面用等离子体（50）处理，并且波长转换层被冲压。 还公开了包括波长转换层的波长转换层和光电子部件。