公开(公告)号：US20220140204A1

公开(公告)日：2022-05-05

申请号：US17428635

申请日：2020-02-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Yi ZHENG ,  Dominik EISERT ,  Georg ROSSBACH

IPC: H01L33/50

Abstract: A wavelength converter may include a phosphor layer and a filter layer where the filter layer may be directly attached to the phosphor layer. The wavelength converter may have an overall thickness ranging from 20 μm to 80 μm.
A light emitting device assembly and methods for preparing a wavelength converter and methods for preparing a light emitting device assembly are also disclosed.

公开(公告)号：US20230187589A9

公开(公告)日：2023-06-15

申请号：US17428635

申请日：2020-02-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Yi ZHENG ,  Dominik EISERT ,  Georg ROSSBACH

IPC: H01L33/50

CPC classification number: H01L33/502 ,  H01L33/50 ,  H01L33/501 ,  H01L33/504 ,  H01L33/508 ,  H01L2933/0041

Abstract: A wavelength converter may include a phosphor layer and a filter layer where the filter layer may be directly attached to the phosphor layer. The wavelength converter may have an overall thickness ranging from 20 μm to 80 μm.
A light emitting device assembly and methods for preparing a wavelength converter and methods for preparing a light emitting device assembly are also disclosed.