公开(公告)号：US20220140204A1

公开(公告)日：2022-05-05

申请号：US17428635

申请日：2020-02-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Yi ZHENG ,  Dominik EISERT ,  Georg ROSSBACH

IPC: H01L33/50

Abstract: A wavelength converter may include a phosphor layer and a filter layer where the filter layer may be directly attached to the phosphor layer. The wavelength converter may have an overall thickness ranging from 20 μm to 80 μm.
A light emitting device assembly and methods for preparing a wavelength converter and methods for preparing a light emitting device assembly are also disclosed.

公开(公告)号：US20230187589A9

公开(公告)日：2023-06-15

申请号：US17428635

申请日：2020-02-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Yi ZHENG ,  Dominik EISERT ,  Georg ROSSBACH

IPC: H01L33/50

CPC classification number: H01L33/502 ,  H01L33/50 ,  H01L33/501 ,  H01L33/504 ,  H01L33/508 ,  H01L2933/0041

Abstract: A wavelength converter may include a phosphor layer and a filter layer where the filter layer may be directly attached to the phosphor layer. The wavelength converter may have an overall thickness ranging from 20 μm to 80 μm.
A light emitting device assembly and methods for preparing a wavelength converter and methods for preparing a light emitting device assembly are also disclosed.

公开(公告)号：US20190067898A1

公开(公告)日：2019-02-28

申请号：US16112615

申请日：2018-08-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Georg ROSSBACH ,  Hubert HALBRITTER

IPC: H01S5/00 ,  H01S5/183 ,  G02B27/42

Abstract: A laser component is provided which comprises: a surface emitting semiconductor laser configured to emit electromagnetic radiation along an emission axis, an optical element disposed downstream of the semiconductor laser along the emission axis, wherein the optical element comprises a diffractive structure, and a further optical element configured to cause radiation to be emitted asymmetrically with respect to the emission axis. Furthermore, the use of a laser component, a device having a laser component and a method for the production of laser components are provided