公开(公告)号：US20230220534A1

公开(公告)日：2023-07-13

申请号：US17842335

申请日：2022-06-16

Applicant: Olum Material Corporation

Inventor： Taek Yong JANG ,  Byung Il LEE ,  Young Ho LEE

IPC: C23C14/04 ,  H01L51/56

CPC classification number: C23C14/042 ,  H01L51/56

Abstract: Proposed are a mask-integrated frame and a method of manufacturing the same. The mask-integrated frame used to deposit organic light-emitting diode (OLED) pixels on a semiconductor wafer includes a frame including an opening, a grid sheet connected onto the frame, having a circular edge, and including grids provided on at least the opening of the frame, and a mask connected onto the grid sheet, having a circular shape, and including mask patterns.

公开(公告)号：US20240049506A1

公开(公告)日：2024-02-08

申请号：US18229626

申请日：2023-08-02

Applicant: Olum Material Corporation

Inventor： Young Ho LEE ,  Hwi Su KIM ,  Dong Jin LEE ,  Byung Il LEE ,  Taek Yong JANG ,  Jong Il KIM

IPC: H10K59/12 ,  G03F7/00 ,  G03F7/09 ,  G03F1/60 ,  H10K59/131

CPC classification number: H10K59/1201 ,  G03F7/70683 ,  G03F7/09 ,  G03F7/70833 ,  G03F1/60 ,  H10K59/131

Abstract: The present invention relates to a mask-support assembly and a producing method thereof. The mask-support assembly according to the present invention may include: a support comprising an edge portion and a grid portion; and a mask connected onto the support and comprising a plurality of cell portions in each of which a mask pattern is formed, wherein at least a partial region of the support is exposed on one surface of the support except for a region where the cell portions of the mask are disposed.

公开(公告)号：US20240026517A1

公开(公告)日：2024-01-25

申请号：US18135937

申请日：2023-04-18

Applicant: Olum Material Corporation

Inventor： Taek Yong JANG ,  Young Ho LEE ,  Hwi Su KIM ,  Dong Jin LEE ,  Byung Il LEE

IPC: C23C14/04 ,  H10K99/00 ,  C25D1/10 ,  C23C14/12

CPC classification number: C23C14/042 ,  H10K99/00 ,  C25D1/10 ,  C23C14/12 ,  H10K71/166

Abstract: A mask-support assembly and a producing method thereof are provided. The mask-support assembly, which is used in a process of forming organic light-emitting diode (OLED) pixels on a semiconductor wafer, includes: a support comprising an edge portion and a grid portion; and a mask connected onto the support and comprising a plurality of cell portions in each of which a mask pattern is formed.