公开(公告)号：US20110157673A1

公开(公告)日：2011-06-30

申请号：US13022896

申请日：2011-02-08

申请人： Osamu MITOMI ,  Yasunori Iwasaki ,  Yuji Hori ,  Kenji Aoki ,  Jungo Kondo

发明人： Osamu MITOMI ,  Yasunori Iwasaki ,  Yuji Hori ,  Kenji Aoki ,  Jungo Kondo

IPC分类号： G02F1/01

CPC分类号： G02F1/2255

摘要： An optical modulator includes an optical modulation substrate, an electrical length adjusting substrate, a package containing the substrates, and a plurality of input ports for inputting high frequency electrical signals. The optical modulation substrate includes a substrate body made of an electro-optic material, a ground electrode and a plurality of signal electrodes provided on the substrate body, optical waveguides propagating lights interacting with the signal electrodes, respectively, and electrode input ports inputting the high frequency electrical signals into the signal electrodes, respectively. The signal electrode includes an interacting part, an input end part provided between the electrode input port and interacting part, and a terminal part. The electrical length adjusting substrate includes conductive lines connected to the input ports for inputting the high frequency electrical signals, respectively. The conductive lines have electrical lengths different from each other for adjusting the phase differences among the ports.

摘要翻译： 光调制器包括光调制基板，电长度调节基板，包含基板的封装以及用于输入高频电信号的多个输入端口。 光调制基板包括由电光材料制成的基板主体，接地电极和设置在基板主体上的多个信号电极，分别与信号电极相互作用的光波导传播光和输入高电平的电极输入端 频率电信号分别进入信号电极。 信号电极包括相互作用部分，设置在电极输入端口和相互作用部分之间的输入端部分和端子部分。 电长度调节基板包括分别连接到用于输入高频电信号的输入端口的导线。 导线具有彼此不同的电长度，用于调节端口之间的相位差。

公开(公告)号：US08411349B2

公开(公告)日：2013-04-02

申请号：US13022896

申请日：2011-02-08

申请人： Osamu Mitomi ,  Yasunori Iwasaki ,  Yuji Hori ,  Kenji Aoki ,  Jungo Kondo

发明人： Osamu Mitomi ,  Yasunori Iwasaki ,  Yuji Hori ,  Kenji Aoki ,  Jungo Kondo

IPC分类号： G02F1/01 ,  G02F1/03 ,  H04B10/04

CPC分类号： G02F1/2255

摘要： An optical modulator includes an optical modulation substrate, an electrical length adjusting substrate, a package containing the substrates, and a plurality of input ports for inputting high frequency electrical signals. The optical modulation substrate includes a substrate body made of an electro-optic material, a ground electrode and a plurality of signal electrodes provided on the substrate body, optical waveguides propagating lights interacting with the signal electrodes, respectively, and electrode input ports inputting the high frequency electrical signals into the signal electrodes, respectively. The signal electrode includes an interacting part, an input end part provided between the electrode input port and interacting part, and a terminal part. The electrical length adjusting substrate includes conductive lines connected to the input ports for inputting the high frequency electrical signals, respectively. The conductive lines have electrical lengths different from each other for adjusting the phase differences among the ports.

摘要翻译： 光调制器包括光调制基板，电长度调节基板，包含基板的封装以及用于输入高频电信号的多个输入端口。 光调制基板包括由电光材料制成的基板主体，接地电极和设置在基板主体上的多个信号电极，分别与信号电极相互作用的光波导传播光和输入高电平的电极输入端 频率电信号分别进入信号电极。 信号电极包括相互作用部分，设置在电极输入端口和相互作用部分之间的输入端部分和端子部分。 电长度调节基板包括分别连接到用于输入高频电信号的输入端口的导线。 导线具有彼此不同的电长度，用于调节端口之间的相位差。

公开(公告)号：US20110262071A1

公开(公告)日：2011-10-27

申请号：US13178964

申请日：2011-07-08

申请人： Osamu Mitomi ,  Kenji Aoki ,  Yuji Hori ,  Jungo Kondo ,  Yasunori Iwasaki

发明人： Osamu Mitomi ,  Kenji Aoki ,  Yuji Hori ,  Jungo Kondo ,  Yasunori Iwasaki

IPC分类号： G02F1/035 ,  G02B6/125

CPC分类号： G02B6/125 ,  G02B6/1228 ,  G02B6/29352 ,  G02B2006/12159 ,  G02F1/0508

摘要： An optical waveguide is formed on a ferroelectric substrate having a thickness of 20 μm or less by diffusion of a dopant or ion exchange. The optical waveguide has a non-branched section 2a operating on single mode and a pair of branched sections branched from the non-branched section 2a. Each of the branched sections has a connecting part 7 extending from a branching end 10 and a multi mode propagating part 8 continuously formed from the connecting part 7. The multi mode propagating part 8 has a width “m” larger than a width “t” of the non-branched section. A width “p” of the connecting part increases from the non-branched section 2a toward the multi mode propagating part 8.

摘要翻译： 通过掺杂剂或离子交换剂的扩散，在厚度为20μm以下的强电介质基板上形成光波导。 光波导具有在单模上工作的非分支部分2a和从非分支部分2a分支的一对分支部分。 每个分支部分具有从分支端10延伸的连接部分7和从连接部分7连续形成的多模传播部分8.多模传播部分8具有大于宽度“t”的宽度“m” 的非支化部分。 连接部的宽度“p”从非分支部2a向多模传播部8增大。

公开(公告)号：US08729771B2

公开(公告)日：2014-05-20

申请号：US13253156

申请日：2011-10-05

申请人： Hiroki Kobayashi ,  Takanori Sakurai ,  Yuji Hori ,  Yasunori Iwasaki

发明人： Hiroki Kobayashi ,  Takanori Sakurai ,  Yuji Hori ,  Yasunori Iwasaki

IPC分类号： H03H9/05 ,  H03H9/02

CPC分类号： H03H9/0585 ,  H03H3/10 ,  H03H9/02574 ,  H03H9/02622 ,  Y10T29/42

摘要： According to a composite substrate manufacturing method of the present invention, (a) a piezoelectric substrate having minute asperities formed in a rear surface thereof, and a support substrate having a smaller thermal expansion coefficient than the piezoelectric substrate are prepared, (b) a filler is applied to the rear surface 11a to fill the minute asperities, thereby forming a filling layer, (c) a surface of the filling layer is mirror-polished to such an extent that an arithmetic mean roughness Ra of the surface of the filling layer is smaller than an arithmetic mean roughness Ra of the rear surface 11a in a state of above (a), and (d) the surface of the filling layer and a surface of the support substrate are bonded to each other with an adhesive layer interposed therebetween, thereby forming a composite substrate.

摘要翻译： 根据本发明的复合基板的制造方法，（a）在其后表面形成有微小的凹凸的压电基板和具有比压电基板的热膨胀系数小的支撑基板，（b）填料 施加到后表面11a以填充微小的凹凸，从而形成填充层，（c）将填充层的表面镜面抛光至使填充层的表面的算术平均粗糙度Ra为 小于上述（a）的状态下的后表面11a的算术平均粗糙度Ra，（d）填充层的表面和支撑基板的表面之间粘合层彼此接合， 从而形成复合基板。

公开(公告)号：US20120126669A1

公开(公告)日：2012-05-24

申请号：US13386854

申请日：2010-07-21

申请人： Hiroki Kobayashi ,  Yuji Hori ,  Yasunori Iwasaki

发明人： Hiroki Kobayashi ,  Yuji Hori ,  Yasunori Iwasaki

IPC分类号： H01L41/04 ,  H01L41/22

CPC分类号： H03H3/08 ,  Y10T29/42

摘要： The composite substrate is a substrate used to manufacture an acoustic wave device, and includes a support substrate, a piezoelectric substrate, and a adhesive layer with which the support substrate and the piezoelectric substrate are bonded to each other. In the composite substrate, assuming that a surface of the piezoelectric substrate that is bonded to the support substrate is defined as a first surface and a surface at the side opposite to the first surface is defined as a second surface, the piezoelectric substrate is formed such that the first surface is inside the second surface when the first surface is projected onto the second surface in a direction perpendicular to the second surface. In other words, the composite substrate has an outer peripheral surface that is formed such that the circumference thereof increases toward the top surface of the piezoelectric substrate.

摘要翻译： 复合衬底是用于制造声波器件的衬底，并且包括支撑衬底，压电衬底和支撑衬底和压电衬底彼此结合的粘合层。 在复合基板中，假定将与支撑基板接合的压电基板的表面定义为第一表面，将与第一表面相反的一侧的表面定义为第二表面，则形成压电基板 当第一表面在垂直于第二表面的方向上投影到第二表面上时，第一表面在第二表面内。 换句话说，复合基板具有外周面，其形成为使得其周向朝向压电基板的顶面增大。

公开(公告)号：US20100244631A1

公开(公告)日：2010-09-30

申请号：US12714666

申请日：2010-03-01

申请人： Hiroki Kobayashi ,  Yuji Hori ,  Yasunori Iwasaki

发明人： Hiroki Kobayashi ,  Yuji Hori ,  Yasunori Iwasaki

IPC分类号： H01L41/053 ,  H01L41/18 ,  H01L41/22

CPC分类号： H03H9/02015 ,  H03H3/02 ,  H03H9/02574 ,  Y10T29/42

摘要： In a composite substrate 10, the piezoelectric substrate 12 which is capable of transmitting an elastic wave and a support substrate 14 which a smaller thermal expansion coefficient than the piezoelectric substrate 12 are bonded to each other. The in-plane maximum thermal strain amount which is the largest thermal strain amount in the plane of the composite substrate 10 has a minimum value and a maximum value when the piezoelectric substrate 12 and the support substrate 14 are relatively rotated 0° to 360°, and the piezoelectric substrate 12 and the support substrate 14 are bonded to each other so that the in-plane maximum thermal strain amount has the minimum value or a value in the vicinity thereof.

摘要翻译： 在复合基板10中，能够传递弹性波的压电基板12和比压电基板12更小的热膨胀系数的支撑基板14彼此接合。 当压电基板12和支撑基板14相对旋转0°至360°时，作为复合基板10的平面中最大热应变量的面内最大热应变量具有最小值和最大值， 并且压电基板12和支撑基板14彼此接合，使得面内最大热应变量具有最小值或其附近的值。

公开(公告)号：US08686622B2

公开(公告)日：2014-04-01

申请号：US13386854

申请日：2010-07-21

申请人： Hiroki Kobayashi ,  Yuji Hori ,  Yasunori Iwasaki

发明人： Hiroki Kobayashi ,  Yuji Hori ,  Yasunori Iwasaki

IPC分类号： H01L41/09 ,  H01L41/22

CPC分类号： H03H3/08 ,  Y10T29/42

摘要： The composite substrate is a substrate used to manufacture an acoustic wave device, and includes a support substrate, a piezoelectric substrate, and a adhesive layer with which the support substrate and the piezoelectric substrate are bonded to each other. In the composite substrate, assuming that a surface of the piezoelectric substrate that is bonded to the support substrate is defined as a first surface and a surface at the side opposite to the first surface is defined as a second surface, the piezoelectric substrate is formed such that the first surface is inside the second surface when the first surface is projected onto the second surface in a direction perpendicular to the second surface. In other words, the composite substrate has an outer peripheral surface that is formed such that the circumference thereof increases toward the top surface of the piezoelectric substrate.

摘要翻译： 复合衬底是用于制造声波器件的衬底，并且包括支撑衬底，压电衬底和支撑衬底和压电衬底彼此结合的粘合层。 在复合基板中，假定将与支撑基板接合的压电基板的表面定义为第一表面，将与第一表面相反的一侧的表面定义为第二表面，则形成压电基板 当第一表面在垂直于第二表面的方向上投影到第二表面上时，第一表面在第二表面内。 换句话说，复合基板具有外周面，其形成为使得其周向朝向压电基板的顶面增大。

公开(公告)号：US08421314B2

公开(公告)日：2013-04-16

申请号：US12714666

申请日：2010-03-01

申请人： Hiroki Kobayashi ,  Yuji Hori ,  Yasunori Iwasaki

发明人： Hiroki Kobayashi ,  Yuji Hori ,  Yasunori Iwasaki

IPC分类号： H01L41/04

CPC分类号： H03H9/02015 ,  H03H3/02 ,  H03H9/02574 ,  Y10T29/42

摘要： A composite substrate is provided, including a piezoelectric substrate which is capable of transmitting an elastic wave, and a support substrate, which has a smaller thermal expansion coefficient than that of the piezoelectric substrate, bonded to each other. The in-plane maximum thermal strain amount, which is the largest thermal strain amount in the plane of the composite substrate, has a minimum value and a maximum value when the piezoelectric substrate and the support substrate are relatively rotated 0° to 360°, and the piezoelectric substrate and the support substrate are bonded to each other so that the in-plane maximum thermal strain amount has the minimum value or a value in the vicinity thereof.

摘要翻译： 提供一种复合基板，包括能够传递弹性波的压电基板和具有比压电基板的热膨胀系数小的热膨胀系数的支撑基板。 当压电基板和支撑基板相对旋转0°至360°时，作为复合基板的平面中最大热应变量的面内最大热应变量具有最小值和最大值，以及 压电基板和支撑基板彼此接合，使得面内最大热应变量具有最小值或其附近的值。

公开(公告)号：US20120086312A1

公开(公告)日：2012-04-12

申请号：US13253156

申请日：2011-10-05

申请人： Hiroki Kobayashi ,  Takanori Sakurai ,  Yuji Hori ,  Yasunori Iwasaki

发明人： Hiroki Kobayashi ,  Takanori Sakurai ,  Yuji Hori ,  Yasunori Iwasaki

IPC分类号： H01L41/053 ,  H01L41/22

CPC分类号： H03H9/0585 ,  H03H3/10 ,  H03H9/02574 ,  H03H9/02622 ,  Y10T29/42

摘要： According to a composite substrate manufacturing method of the present invention, (a) a piezoelectric substrate having minute asperities formed in a rear surface thereof, and a support substrate having a smaller thermal expansion coefficient than the piezoelectric substrate are prepared, (b) a filler is applied to the rear surface 11a to fill the minute asperities, thereby forming a filling layer, (c) a surface of the filling layer is mirror-polished to such an extent that an arithmetic mean roughness Ra of the surface of the filling layer is smaller than an arithmetic mean roughness Ra of the rear surface 11a in a state of above (a), and (d) the surface of the filling layer and a surface of the support substrate are bonded to each other with an adhesive layer interposed therebetween, thereby forming a composite substrate.

摘要翻译： 根据本发明的复合基板的制造方法，（a）在其后表面形成有微小的凹凸的压电基板和具有比压电基板的热膨胀系数小的支撑基板，（b）填料 施加到后表面11a以填充微小的凹凸，从而形成填充层，（c）将填充层的表面镜面抛光至使填充层的表面的算术平均粗糙度Ra为 小于上述（a）的状态下的后表面11a的算术平均粗糙度Ra，（d）填充层的表面和支撑基板的表面之间粘合层彼此接合， 从而形成复合基板。

公开(公告)号：US09070547B2

公开(公告)日：2015-06-30

申请号：US13295542

申请日：2011-11-14

申请人： Tomoyoshi Tai ,  Yuji Hori

发明人： Tomoyoshi Tai ,  Yuji Hori

IPC分类号： H01L21/30 ,  H01L21/46 ,  H01L21/02 ,  H01L21/265 ,  H01L21/762 ,  H01L33/00 ,  H01S5/02 ,  H01S5/323

CPC分类号： H01L21/02002 ,  H01L21/2654 ,  H01L21/76254 ,  H01L33/007 ,  H01L2924/0002 ,  H01S5/0206 ,  H01S5/32341 ,  H01L2924/00

摘要： A metal film is formed on at least a surface of a second substrate composed of ceramic (step c), and a first substrate composed of a group nitride is bonded to the second substrate through the metal film (step d). Since the metal film generally has higher thermal conductivity than oxide films, a composite substrate having high heat dissipation can be produced as compared with a case where the first substrate is bonded to the second substrate through an oxide film. In addition, a step of out diffusion is not required because of nonuse of an oxide film, thereby simplifying the process.

摘要翻译： 在由陶瓷（步骤c）构成的第二基板的至少一个表面上形成金属膜，通过金属膜将由氮化物构成的第一基板接合到第二基板（步骤d）。 由于金属膜通常具有比氧化膜更高的热导率，所以与第一衬底通过氧化膜结合到第二衬底的情况相比，可以制造具有高散热性的复合衬底。 此外，由于不使用氧化膜，不需要扩散步骤，从而简化了工艺。