公开(公告)号：US06949719B2

公开(公告)日：2005-09-27

申请号：US10831111

申请日：2004-04-26

申请人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

发明人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

IPC分类号： F27D1/00 ,  F27D17/00 ,  F28F13/14 ,  H01L21/22 ,  F27B5/14

CPC分类号： F28F13/14 ,  Y10T156/1348 ,  Y10T428/236 ,  Y10T428/24149 ,  Y10T428/24157

摘要： A thermal insulator can change a heat insulation characteristic partially with a simple structure. The thermal insulator is divided into a plurality of parts in accordance with a temperature of a heat source which is insulated by the thermal insulator. The plurality of parts are formed of different honeycomb structures, respectively, so as to provide different heat insulation characteristics. The plurality of parts may be formed by different materials, or a shape or dimension such as a cell pitch of the honeycomb structure may be varied. Heat is collected from air within the honeycomb cells, and is transferred to other parts for heating.

摘要翻译： 绝热体可以通过简单的结构部分地改变绝热特性。 热绝缘体根据由绝热体绝缘的热源的温度分为多个部分。 多个部件分别由不同的蜂窝结构形成，以提供不同的隔热特性。 多个部分可以由不同的材料形成，或者可以改变诸如蜂窝结构体的细胞间距的形状或尺寸。 从蜂窝状细胞内的空气中收集热量，并将其转移到其他部分进行加热。

公开(公告)号：US06756565B2

公开(公告)日：2004-06-29

申请号：US10026946

申请日：2001-12-27

申请人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

发明人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

IPC分类号： F27D112

CPC分类号： F28F13/14 ,  Y10T156/1348 ,  Y10T428/236 ,  Y10T428/24149 ,  Y10T428/24157

摘要： A thermal insulator can change a heat insulation characteristic partially with a simple structure. The thermal insulator is divided into a plurality of parts in accordance with a temperature of a heat source which is insulated by the thermal insulator. The plurality of parts are formed of different honeycomb structures, respectively, so as to provide different heat insulation characteristics. The plurality of parts may be formed by different materials, or a shape or dimension such as a cell pitch of the honeycomb structure may be varied. Heat is collected from air within the honeycomb cells, and is transferred to other parts for heating.

公开(公告)号：US06547660B1

公开(公告)日：2003-04-15

申请号：US09669909

申请日：2000-09-27

申请人： Osamu Suenaga ,  Tadahiro Ohmi ,  Sadao Kobayashi

发明人： Osamu Suenaga ,  Tadahiro Ohmi ,  Sadao Kobayashi

IPC分类号： B01L104

CPC分类号： H01L21/67109 ,  H01L21/67098 ,  Y10S414/135 ,  Y10S414/14

摘要： A semiconductor manufacturing facility is provided, which can reduce a thermal load in a clean room and reduce an amount of energy thereof. Semiconductor manufacturing equipment, which generates heat when it is used, is installed in the clean room and is covered by a housing. The housing is configured to be capable of introducing the air inside the clean room into an interior thereof. The air inside the housing is exhausted outside the clean room through a plurality of exhaust passage members. A heat insulating material is associated with the housing to reduce the release of heat from the housing to the air inside the clean room. A space between the housing and the semiconductor manufacturing equipment may be hermetically sealed, and an air introducing member may be connected to the housing to take air outside the clean room into the hermetically sealed space.

摘要翻译： 提供了一种半导体制造设备，其可以降低洁净室中的热负荷并减少其能量。 使用时产生热量的半导体制造设备安装在洁净室中并被壳体覆盖。 壳体构造成能够将清洁室内的空气引入其内部。 壳体内的空气通过多个排气通道构件在洁净室外排出。 绝热材料与壳体相关联，以减少热量从壳体释放到洁净室内的空气。 壳体和半导体制造设备之间的空间可以被气密地密封，并且空气引入构件可以连接到壳体以将清洁室外的空气吸入密封空间。

公开(公告)号：US06881685B2

公开(公告)日：2005-04-19

申请号：US10250911

申请日：2002-01-09

申请人： Osamu Suenaga ,  Sadao Kobayashi

发明人： Osamu Suenaga ,  Sadao Kobayashi

IPC分类号： F24F3/044 ,  F24F3/147 ,  F24F3/153 ,  F24F3/16 ,  F24F7/06 ,  F24F12/00 ,  H01L21/02 ,  H01L21/31 ,  B01L1/04

CPC分类号： F24F3/153 ,  F24F3/147 ,  F24F3/161 ,  F24F12/001 ,  Y02B30/563 ,  Y02P70/605 ,  Y10S414/135

摘要： An air-supply machine cleans outside air. The cleaned outside air is dehumidified by cooling by performing heat exchange between the cleaned outside air and an exhaust air from a lithography apparatus by a first heat-pipe. The dehumidified outside air is heated by performing heat treatment between the dehumidified outside air and an exhaust air from a vertical heat treatment apparatus by a second heat-pipe. The heated outside air is supplied to inside the housing of the vertical heat treatment apparatus. Thereby, the consumption of air in the clean room is reduced and the running cost of the clean room is reduced.

摘要翻译： 供气机清洗外部空气。 通过第一热管在清洁的外部空气和来自光刻设备的排出空气之间进行热交换，通过冷却来对清洁的外部空气进行除湿。 通过第二热管在除湿的外部空气与来自立式热处理装置的排气之间进行热处理，对除湿的外部空气进行加热。 加热的外部空气被供应到垂直热处理设备的壳体内部。 因此，洁净室内的空气消耗减少，洁净室的运行成本降低。

公开(公告)号：US06370897B1

公开(公告)日：2002-04-16

申请号：US09670343

申请日：2000-09-27

申请人： Osamu Suenaga ,  Tadahiro Ohmi ,  Sadao Kobayashi

发明人： Osamu Suenaga ,  Tadahiro Ohmi ,  Sadao Kobayashi

IPC分类号： F25B2700

CPC分类号： H01L21/67098 ,  Y02P70/605 ,  Y02P80/156

摘要： A cooling jacket unit (5) is provided to a periphery of a heating furnace of a heat treatment apparatus. A cooling unit has a double water jacket comprising an inner fluid passage (51) and an outer fluid passage (52), and cooling water supplied to the outer fluid passage exits from the inner fluid passage. The temperatures of the inlet port and the outlet port of the cooling jacket unit (5) are set to, for example, 40° C. and 85° C., respectively, and the cooling water (warmed exhaust water) from the outlet port is supplied to a heat recovery part (2). Heat is recovered from the cooling water by the heat recovery part (29, and the recovered heat is reused for heating a boiler water and the like. The warmed exhaust water from which the heat is recovered is supplied again to the cooling jacket unit (5) as the cooling water.

摘要翻译： 在热处理装置的加热炉的周边设有冷却套筒（5）。 冷却单元具有包括内部流体通道（51）和外部流体通道（52）的双重水套，并且供应到外部流体通道的冷却水从内部流体通道离开。 冷却套筒单元（5）的入口和出口的温度分别设定为例如40℃和85℃，并且来自出口的冷却水（加热的排出水） 被供给到热回收部（2）。 通过热回收部（29）从冷却水回收热量，回收的热量再次用于加热锅炉用水等，再次将热回收的加热废水再次供给到冷却套（5） ）作为冷却水。

公开(公告)号：US07160362B2

公开(公告)日：2007-01-09

申请号：US10482332

申请日：2002-06-26

申请人： Isao Terada ,  Minoru Tanaka ,  Yuji Matumura ,  Sadao Kobayashi ,  Naoki Mori ,  Hiromu Itoh ,  Yoshihide Wakayama ,  Osamu Suenaga

发明人： Isao Terada ,  Minoru Tanaka ,  Yuji Matumura ,  Sadao Kobayashi ,  Naoki Mori ,  Hiromu Itoh ,  Yoshihide Wakayama ,  Osamu Suenaga

IPC分类号： F24F7/06 ,  B01D53/26

CPC分类号： F24F3/14 ,  B01D47/00 ,  B01D53/75 ,  F24F2003/1617 ,  Y02A50/21

摘要： A method of cleaning air, including a humidifying operation for humidifying the air containing chemical contaminants by a humidifier and taking a part of the gaseous contaminants in the air into excessive moisture to remove the contaminants from the air, and a dehumidifying operation for dehumidifying the humidified air by a condenser and taking the gaseous chemical contaminants remaining, without being removed, in the humidifying operation into condensed water for removal. By using an oblique honeycomb having both front and rear faces and both upper and lower faces disposed in open state, air is led from the front opening part of the oblique honeycomb and water is fed from the upper opening part thereof to one or both of the humidifier and condenser.

摘要翻译： 一种清洁空气的方法，包括加湿操作，用于通过加湿器加湿包含化学污染物的空气，并将一部分空气中的气态污染物吸入过量的水分以从空气中除去污染物;以及除湿操作，用于对加湿的 空气通过冷凝器，并且在加湿操作中将气态化学污染物保留，而不被除去，进入冷凝水以除去。 通过使用具有前表面和后表面以及设置在打开状态的上表面和下表面的倾斜蜂窝体，从倾斜蜂窝体的前开口部分引导空气，并且水从其上部开口部分被供给到一个或两个 加湿器和冷凝器。

公开(公告)号：US06883283B2

公开(公告)日：2005-04-26

申请号：US10103135

申请日：2002-03-22

申请人： Osamu Suenaga ,  Kazuo Yamamoto ,  Kaoru Fujihara ,  Sadao Kobayashi

发明人： Osamu Suenaga ,  Kazuo Yamamoto ,  Kaoru Fujihara ,  Sadao Kobayashi

IPC分类号： E04B5/43 ,  F16F15/02 ,  G03F7/20 ,  H01L21/00 ,  H01L21/027 ,  E02D27/00

CPC分类号： H01L21/67196 ,  G03F7/70833 ,  G03F7/709

摘要： A semiconductor manufacturing facility has a proper strength and an anti-vibration effect. The semiconductor facility contains processing apparatuses, installation tables and an installation floor. An apparatus having a vibration source is installed on an installation table having a rigid structure. The installation table is installed on the installation floor having a floor construction including a plurality of columns, which support a floor member extending in horizontal directions. An interval of the columns is 4 m to 12 m.

摘要翻译： 半导体制造设备具有适当的强度和抗振动效果。 半导体设备包括处理设备，安装台和安装楼层。 具有振动源的装置安装在具有刚性结构的安装台上。 安装台安装在具有支撑沿水平方向延伸的地板构件的多个列的地板结构的安装地板上。 柱的间隔为4m至12m。

公开(公告)号：US06427462B1

公开(公告)日：2002-08-06

申请号：US09669908

申请日：2000-09-27

申请人： Osamu Suenaga ,  Tadahiro Ohmi ,  Sadao Kobayashi

发明人： Osamu Suenaga ,  Tadahiro Ohmi ,  Sadao Kobayashi

IPC分类号： F27D900

CPC分类号： H01L21/67109 ,  Y02P80/156

摘要： A heat generating part (1) of semiconductor manufacturing equipment is cooled by cooling water. An inner fluid passage (21) having an inlet port (31) of the cooling water on a vertically lower portion thereof is formed so as to surround a periphery of the heat generating part (1). An outer fluid passage (22) having an outlet port (32) of the cooling water on a vertically upper portion thereof is formed so as to surround a periphery of the inner fluid passage (21) and be capable of exchanging heat with the cooling water in the inner fluid passage. A communication passage (24) is provided to connect a vertically upper portion of said inner fluid passage and a vertically lower portion of said outer fluid passage. The cooling water flowing out of the outlet port (32) of the outer fluid passage (22) is supplied to the inlet port (31) of the inner fluid passage (21).

摘要翻译： 半导体制造设备的发热部件（1）由冷却水冷却。 在其垂直下部具有冷却水的入口（31）的内部流体通道（21）形成为围绕发热部（1）的周边。 形成有在其上部上具有冷却水的出口（32）的外部流体通道（22），以便围绕内部流体通道（21）的周边并且能够与冷却水进行热交换 在内部流体通道中。 连通通道（24）设置成连接所述内部流体通道的垂直上部和所述外部流体通道的垂直下部。 从外部流路（22）的出口（32）流出的冷却水被供给到内部流体通路（21）的入口（31）。

公开(公告)号：US07212977B2

公开(公告)日：2007-05-01

申请号：US09886475

申请日：2001-06-22

申请人： Akitoshi Tsuji ,  Osamu Suenaga ,  Kiyoshi Komiyama

发明人： Akitoshi Tsuji ,  Osamu Suenaga ,  Kiyoshi Komiyama

IPC分类号： G06Q99/00

CPC分类号： H01L21/67276 ,  G06Q30/0283 ,  G06Q50/06 ,  H01L21/67242 ,  H01L21/67253 ,  Y02A20/22 ,  Y02P90/84

摘要： Power consumption of electric equipment used in a semiconductor manufacturing apparatus (100) is obtained and the total amount is displayed as calories by a display means. The semiconductor manufacturing apparatus is configured so that the equipment is set up inside a housing (10). The amount of heat discharged from the inside to the outside (a clean room) via the housing is obtained, and further, the amount of heat removed by exhaust from the interior of the housing and the amount of heat removed by cooling water that cools the equipment is also obtained, and the total amount of heat is displayed. Additionally, factors pertaining to operating costs such as power consumption are measured and their cost obtained, the amount of power consumed is multiplied by a crude oil conversion coefficient to obtain the amount of CO2 generated, and the result is displayed. The factors to be measured are measured by a thermocouple, an anemometer and an power meter, and the measurements are input to a personal computer (6) via a conversion module (7).

摘要翻译： 获得半导体制造装置（100）中使用的电气设备的功耗，并且通过显示装置将总量显示为卡路里。 半导体制造装置被配置为使得设备被设置在壳体（10）内。 通过外壳从内向外（洁净室）排出的热量得到，另外，从壳体内部排出的热量以及冷却水的冷却水除去的热量 也可获得设备，并显示总热量。 此外，测量与运行成本（如功耗）相关的因素，并获得其成本，消耗的功率量乘以原油转化系数以获得产生的CO 2的量，结果 被展示。 待测量的因素由热电偶，风速计和功率计测量，测量通过转换模块（7）输入个人计算机（6）。

公开(公告)号：US06799539B2

公开(公告)日：2004-10-05

申请号：US10468362

申请日：2003-08-19

申请人： Osamu Suenaga ,  Sadao Kobayashi

发明人： Osamu Suenaga ,  Sadao Kobayashi

IPC分类号： F22D102

CPC分类号： H01L21/67109 ,  F28D7/16 ,  Y02P80/156 ,  Y10S165/909

摘要： An amount of energy consumption in a semiconductor fabrication facility can be reduced by using cooling water drained from a semiconductor fabrication apparatus as a heat source of another semiconductor fabrication apparatus. Cooling water of 80° C. drained from a heating furnace of a heat processing apparatus (10) is supplied to a deionized water heating apparatus (32) of a cleaning apparatus (30). The deionized water heating apparatus (32) raises a temperature of deionized water of a room temperature to 60° C. through heat exchange with the cooling water of 80° C. The cooling water, whose temperature falls to 30° C. after the heat exchange, is reutilized for cooling of the heating furnace (12).

摘要翻译： 通过使用从半导体制造装置排出的冷却水作为另一半导体制造装置的热源，可以减少半导体制造设备中的能量消耗。 将从加热处理装置（10）的加热炉排出的80℃的冷却水供给到清洗装置（30）的去离子水加热装置（32）。 去离子水加热装置（32）通过与80℃的冷却水进行热交换，将室温下去离子水的温度升高到60℃。加热后的温度降至30℃的冷却水 再次利用加热炉（12）的冷却。