公开(公告)号：US06949719B2

公开(公告)日：2005-09-27

申请号：US10831111

申请日：2004-04-26

申请人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

发明人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

IPC分类号： F27D1/00 ,  F27D17/00 ,  F28F13/14 ,  H01L21/22 ,  F27B5/14

CPC分类号： F28F13/14 ,  Y10T156/1348 ,  Y10T428/236 ,  Y10T428/24149 ,  Y10T428/24157

摘要： A thermal insulator can change a heat insulation characteristic partially with a simple structure. The thermal insulator is divided into a plurality of parts in accordance with a temperature of a heat source which is insulated by the thermal insulator. The plurality of parts are formed of different honeycomb structures, respectively, so as to provide different heat insulation characteristics. The plurality of parts may be formed by different materials, or a shape or dimension such as a cell pitch of the honeycomb structure may be varied. Heat is collected from air within the honeycomb cells, and is transferred to other parts for heating.

摘要翻译： 绝热体可以通过简单的结构部分地改变绝热特性。 热绝缘体根据由绝热体绝缘的热源的温度分为多个部分。 多个部件分别由不同的蜂窝结构形成，以提供不同的隔热特性。 多个部分可以由不同的材料形成，或者可以改变诸如蜂窝结构体的细胞间距的形状或尺寸。 从蜂窝状细胞内的空气中收集热量，并将其转移到其他部分进行加热。

公开(公告)号：US06756565B2

公开(公告)日：2004-06-29

申请号：US10026946

申请日：2001-12-27

申请人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

发明人： Osamu Suenaga ,  Wataru Okase ,  Takenobu Matsuo

IPC分类号： F27D112

CPC分类号： F28F13/14 ,  Y10T156/1348 ,  Y10T428/236 ,  Y10T428/24149 ,  Y10T428/24157

摘要： A thermal insulator can change a heat insulation characteristic partially with a simple structure. The thermal insulator is divided into a plurality of parts in accordance with a temperature of a heat source which is insulated by the thermal insulator. The plurality of parts are formed of different honeycomb structures, respectively, so as to provide different heat insulation characteristics. The plurality of parts may be formed by different materials, or a shape or dimension such as a cell pitch of the honeycomb structure may be varied. Heat is collected from air within the honeycomb cells, and is transferred to other parts for heating.

公开(公告)号：US06641709B2

公开(公告)日：2003-11-04

申请号：US10290293

申请日：2002-11-08

申请人： Wataru Okase ,  Koichiro Kimura ,  Takenobu Matsuo

发明人： Wataru Okase ,  Koichiro Kimura ,  Takenobu Matsuo

IPC分类号： C25D1700

CPC分类号： C25D21/04 ,  C25D17/001

摘要： A mist trap mechanism and method for a plating apparatus, which can provide an improved mist removing effect by a simple structure, are provided. A gas discharge passage is formed to connect the space in a plating chamber and space outside of the plating chamber and provided with a liquid spouting portion and a solid wall. The discharge gas collides with the liquid spouted from the liquid spouting portion, and the discharge gas collides with the solid wall which has its surface wetted with the liquid spouted from the liquid spouting portion. Such a two-staged collision of the discharge gas effectively takes the mist contained in the discharge gas into the liquid. A liquid recovery portion is disposed in connection with the gas discharge passage to collectively catch the mist in a state captured by the liquid.

摘要翻译： 提供一种能够通过简单的结构提供改善的除雾效果的电镀装置的雾滴捕获机构和方法。 形成气体排出通道，以连接电镀室中的空间和电镀室外的空间，并设置有液体喷射部分和固体壁。 排出气体与从液体喷出部喷出的液体相撞，排出气体与表面被从液体喷出部喷出的液体润湿的固体壁碰撞。 这种放电气体的两阶段碰撞有效地将放出气体中所含的雾气引入液体。 液体回收部分与气体排出通道相连配置，以在由液体俘获的状态下集中地吸收雾气。

公开(公告)号：US06634370B2

公开(公告)日：2003-10-21

申请号：US09849276

申请日：2001-05-07

申请人： Satoshi Nakashima ,  Wataru Okase ,  Takenobu Matsuo ,  Tameyasu Hyakuzuka ,  Yasushi Yagi ,  Yoshiyuki Harima ,  Jun Yamauchi ,  Hiroki Taniyama ,  Kyungho Park ,  Yoshitsugu Tanaka ,  Yoshinori Kato ,  Hiroshi Sato

发明人： Satoshi Nakashima ,  Wataru Okase ,  Takenobu Matsuo ,  Tameyasu Hyakuzuka ,  Yasushi Yagi ,  Yoshiyuki Harima ,  Jun Yamauchi ,  Hiroki Taniyama ,  Kyungho Park ,  Yoshitsugu Tanaka ,  Yoshinori Kato ,  Hiroshi Sato

IPC分类号： B08B300

CPC分类号： H01L21/67167 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67178 ,  H01L21/6723 ,  H01L21/68707

摘要： Liquid treatment units are disposed in multi-tiers surrounding a main-arm 35. Among liquid treatment units, plating units M1 through M4 are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit 70 where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.

摘要翻译： 液体处理单元设置在主臂35周围的多层中。在液体处理单元中，电镀单元M1至M4设置在下层侧，以及用于后处理处理的单元，例如清洁单元70，其中 更清洁的气氛被设置在上层侧。 由此，可以同时获得面积效率的提高，清洁气氛的形成和维护。

公开(公告)号：US06740164B2

公开(公告)日：2004-05-25

申请号：US10058290

申请日：2002-01-30

申请人： Wataru Okase ,  Takenobu Matsuo

发明人： Wataru Okase ,  Takenobu Matsuo

IPC分类号： H01L2144

CPC分类号： H01L21/2885 ,  C25D7/12 ,  C25D17/001

摘要： Plating apparatus and plating method that can plate more uniformly on a processing surface of a workpiece are provided. The plating apparatus is comprised of a plating solution bathe which is provided with a first electrode held in a state soaked in a plating solution; a workpiece holding mechanism which holds a workpiece to contact its processing surface to the plating solution; and a contact member, disposed in the workpiece holding mechanism, that electrically contacts with the circumferential edge of the workpiece so to form a conductive layer on the workpiece surface as a second electrode. The contact member is divided along the circumferential direction of the workpiece with which they are electrically contacted. Thus, even if the contact resistance between each section of the contact member with the workpiece is variable, it is possible to adjust the plating electric current for each section of the contact member.

摘要翻译： 提供了可以在工件的加工表面上更均匀地平板化的电镀装置和电镀方法。 电镀装置由电镀液沐浴组成，电镀液包含浸渍在电镀液中的状态的第一电极; 工件保持机构，其保持工件以将其处理表面接触到电镀液; 以及设置在所述工件保持机构中的与所述工件的周向边缘电接触以在所述工件表面上形成作为第二电极的导电层的接触构件。 接触构件沿着与它们电接触的工件的圆周方向分开。 因此，即使接触构件与工件的每个部分之间的接触电阻是可变的，也可以调节接触构件的每个部分的电镀电流。

公开(公告)号：US06716329B2

公开(公告)日：2004-04-06

申请号：US09846660

申请日：2001-05-01

申请人： Wataru Okase ,  Takenobu Matsuo

发明人： Wataru Okase ,  Takenobu Matsuo

IPC分类号： C25D2112

CPC分类号： C25D17/001 ,  C25D7/123

摘要： A plating system is composed of a transfer device for performing transfer of a wafer, a plating unit and a washing/drying unit provided around the transfer device. Each unit is structured to be detachable from the plating system. The plating unit is divided into a wafer transfer section and a plating section by a separator, and atmosphere of each section is independently set.

摘要翻译： 电镀系统由设置在转印装置周围的晶片，电镀单元和洗涤/干燥单元的转印用转印装置构成。 每个单元被构造成可从电镀系统拆卸。 电镀单元通过隔板分为晶片转印部和镀层部，各部分的气氛被独立设定。

公开(公告)号：US5359148A

公开(公告)日：1994-10-25

申请号：US96893

申请日：1993-07-26

申请人： Wataru Okase ,  Takashi Tanahashi ,  Takenobu Matsuo

发明人： Wataru Okase ,  Takashi Tanahashi ,  Takenobu Matsuo

IPC分类号： H01L21/203 ,  C23C16/44 ,  C30B25/14 ,  C30B31/16 ,  F16J15/02 ,  F16L23/16 ,  H01L21/00 ,  H01L21/205 ,  H01L21/22 ,  H01L21/302 ,  H01L21/31 ,  C23C16/00

CPC分类号： C23C16/4409 ,  C23C16/4401 ,  C30B25/14 ,  C30B31/16 ,  F16J15/022 ,  F16L23/16 ,  F16L23/22 ,  H01L21/67115 ,  Y10S285/911

摘要： A heat-treating apparatus has a reaction vessel being adapted for performing a heat process for a workpiece to be treated and having a joint pipe portion and an outer pipe jointed to the joint pipe portion and of the reaction vessel. A sealing member is disposed between the outer pipe and the joint pipe portion. The sealing member has a relatively soft core member and a film harder than the core member. The film is disposed on the surface of the core member and has a heat resistance and a chemical resistance. Since the core member of the sealing portion has flexibility, it easily deforms corresponding to the shape of the sealing portion. The film provided on the core member prevents the sealing member from thermally adhering to the sealing portion and from thermally deteriorating.

摘要翻译： 热处理装置具有适于对待处理的工件进行加热处理的反应容器，并具有连接到接合管部分和反应容器的接合管部分和外管。 密封构件设置在外管和接头管部之间。 密封构件具有相对软的芯构件和比芯构件更硬的膜。 该膜设置在芯构件的表面上并具有耐热性和耐化学性。 由于密封部的芯构件具有柔性，因此容易根据密封部的形状而变形。 设置在芯构件上的膜防止密封构件热粘附到密封部分并导致热劣化。

公开(公告)号：US07112268B2

公开(公告)日：2006-09-26

申请号：US10468781

申请日：2002-02-20

申请人： Wataru Okase ,  Takenobu Matsuo

发明人： Wataru Okase ,  Takenobu Matsuo

IPC分类号： C25D7/12 ,  C25D17/06 ,  C25D17/00 ,  C25D17/02

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/06 ,  H01L21/2885

摘要： A plating device and a plating method are provided that are capable of enhancing uniformity in plating on a treatment surface of an object to be treated. The plating device includes: a plating solution bath capable of storing a plating solution and having a first electrode to be immersed in the stored plating solution; a treatment object holding mechanism configured to hold the object to be treated to bring the treatment surface thereof into contact with the plating solution; and a contact disposed in the treatment object holding mechanism and brought into electrical contact with a peripheral edge of the object to be treated so as to make a conductive layer on the treatment surface, which is brought into contact with the plating solution, serve as a second electrode, the contact having a bellows construction or a spring construction movable in a direction facing the object to be treated, and the treatment object holding mechanism being capable of holding the object to be treated while the bellows construction or the like in the contact is in a compressed state. The contact itself is formed as a pliable structure instead of a rigid structure, thereby keeping the contact resistance constant by fluctuation in contact pressure which is controlled to be small even when a slight displacement of the compression direction occurs.

摘要翻译： 提供能够提高被处理物的处理面上的电镀均匀性的电镀装置和电镀方法。 电镀装置包括：电镀溶液浴，其能够存储电镀液，并具有要浸入所述电镀溶液中的第一电极; 处理对象保持机构，其构造成保持被处理物体使其处理面与电镀液接触; 以及设置在处理对象保持机构中并与待处理物体的周边边缘电接触以在与电镀液接触的处理面上形成导电层的接触件作为 第二电极，具有波纹管结构的接触件或可沿面向被处理物体的方向移动的弹簧结构，以及能够在接触处的波纹管结构等处保持待处理物体的处理对象保持机构为 处于压缩状态。 接触本身形成为柔性结构而不是刚性结构，从而即使当发生压缩方向的轻微位移时，接触压力的波动也保持接触电阻恒定，该接触压力的波动被控制为较小。

公开(公告)号：US06953522B2

公开(公告)日：2005-10-11

申请号：US09849345

申请日：2001-05-07

申请人： Kyungho Park ,  Wataru Okase ,  Takenobu Matsuo

发明人： Kyungho Park ,  Wataru Okase ,  Takenobu Matsuo

IPC分类号： C25D7/12 ,  C25F7/00 ,  C25D5/00 ,  C25F3/00

CPC分类号： C25D7/12 ,  C25F7/00 ,  Y10S204/07

摘要： A contact is disposed to come into contact with a metal layer formed on a substrate being treated, the contact being in contact with a surface being treated from an opposite surface through a through hole present in a substrate. Alternatively, a contact is disposed to come into contact with a metal layer formed on a substrate, the contact coming into contact at an approximate center of the substrate. Alternatively, a plurality of needle bodies are disposed to be in electrical contact with a metal layer of a substrate being treated, thereby power supply for electrolytic polishing/plating to a substrate being treated being implemented, without restricting to a periphery of a substrate, from a plurality of points on a surface thereof. Due to any one of these, liquid treatment equipment enables to improve uniformity in plane of an electric current sent to a surface being treated and of liquid treatment.

摘要翻译： 接触件设置成与被处理的基底上形成的金属层接触，所述接触通过存在于基底中的通孔从正对表面接触。 或者，接触件设置成与形成在基底上的金属层接触，接触在基板的大致中心处接触。 或者，多个针体被设置为与被处理的基板的金属层电接触，从而对被处理的基板进行电解抛光/电镀的供电，而不限于基板的周边 其表面上的多个点。 由于这些中的任何一种，液体处理设备能够改善发送到被处理的表面和液体处理的电流的平面的均匀性。

公开(公告)号：US08210022B2

公开(公告)日：2012-07-03

申请号：US12332897

申请日：2008-12-11

申请人： Shuji Moriya ,  Wataru Okase ,  Tsutomu Shinohara ,  Nobukazu Ikeda ,  Michio Yamaji ,  Yasutaka Hayashi ,  Toshihide Yoshida ,  Yasuyuki Omata

发明人： Shuji Moriya ,  Wataru Okase ,  Tsutomu Shinohara ,  Nobukazu Ikeda ,  Michio Yamaji ,  Yasutaka Hayashi ,  Toshihide Yoshida ,  Yasuyuki Omata

IPC分类号： G01F25/00 ,  G05D7/06

CPC分类号： G05D7/0635 ,  Y10T137/2708 ,  Y10T137/776 ,  Y10T137/7761 ,  Y10T137/7793

摘要： A pressure type flow rate control reference allows the performance of flow rate calibrations of a flow rate controller on all types of gases, including corrosive gases, at low costs, and also has excellent flow rate control accuracy. The pressure type flow rate control reference includes a pressure controller for adjusting the pressure of a calibration gas from a calibration gas supply source, a first volume provided on the downstream side of a pressure controller, a first connection mouth of an uncalibrated flow rate controller provided on the downstream side of the first volume, a reference pressure type flow rate controller connected to a second connection mouth on the downstream side of the uncalibrated flow rate controller, a second volume provided on the downstream side of a reference pressure type flow rate controller, and an evacuation device provided on the downstream side of the second volume.

摘要翻译： 压力式流量控制参考允许以低成本执行流量控制器对所有类型气体（包括腐蚀性气体）的流量校准，并且还具有优异的流量控制精度。 压力型流量控制基准包括用于调节来自校准气体供给源的校准气体的压力的压力控制器，设置在压力控制器的下游侧的第一容积，未校准的流量控制器的第一连接口， 在第一容积的下游侧具有与未校准流量控制器的下游侧的第二连接口连接的基准压力型流量控制器，设置在基准压力型流量控制器的下游侧的第二容积， 以及设置在第二容积的下游侧的抽空装置。