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1.发明申请公开(公告)号：US20180172334A1
公开(公告)日：2018-06-21
申请号：US15848607
申请日：2017-12-20
Applicant: PANASONIC CORPORATION
Inventor： Toru OKAZAKI , Masanori MINAMIO
Abstract: Disclosed are a dew condensation removal structure that removes dew condensation generated in equipment using cold such as refrigerating/freezing equipment and air conditioning equipment and that suppresses power consumption necessary to remove the dew condensation, and cooling/heating equipment including the dew condensation removal structure. The cooling/heating equipment uses the dew condensation removal structure, including: a cooling structure having a cooling surface that is directly or indirectly cooled by cold, the cooling surface facing outside air; and a dew condensation conveyance section provided on the cooling surface, in which the dew condensation conveyance section has a conveyance path that conveys dew condensation by capillary phenomenon, the dew condensation being generated on a surface of the dew condensation conveyance section.
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公开(公告)号：US20200003481A1
公开(公告)日：2020-01-02
申请号：US16456541
申请日：2019-06-28
Applicant: PANASONIC CORPORATION
Inventor： Toru OKAZAKI , Masanori MINAMIO , Terutsugu SEGAWA , Yasuhiro ASAIDA , Fumihiko KAWAI , Fuminori TAKAMI
Abstract: Provided are a magnet gasket and a cooling apparatus which enhance thermal insulation performance. The cooling apparatus includes: a thermal insulation box that has an opening end surface enclosing the opening and facing frontward; a door capable of opening and closing the opening; and a magnetic gasket attached to an inside peripheral portion of the door facing the opening end surface while the opening is closed, the magnetic gasket having: a magnet; a magnet retaining part; and a heat insulation sheet being provided between the magnet and the magnet retaining part and being provided, in a closed state in which the opening is closed by the door, on a side portion on a side of the door on a peripheral surface of the magnet and on a side portion facing an inner side in a width direction in the closed state on the peripheral surface of the magnet.
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公开(公告)号：US20140264801A1
公开(公告)日：2014-09-18
申请号：US14280244
申请日：2014-05-16
Applicant: Panasonic Corporation
Inventor： Masanori MINAMIO , Zyunya TANAKA , Shin-ichi IJIMA
IPC: H01L23/495 , H01L23/00 , H01L23/367
CPC classification number: H01L23/49537 , B29C45/14221 , B29C45/14655 , H01L21/565 , H01L21/568 , H01L23/3107 , H01L23/367 , H01L23/4334 , H01L23/49541 , H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/66 , H01L24/73 , H01L2224/32245 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48464 , H01L2224/4903 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first external connection lead which has an end protruding from the outer package; and a second lead frame including a second relay lead, a second die pad with a control element mounted thereon, and a second external connection lead which has an end protruding from the outer package, wherein the first die pad and the second die pad or the first external connection lead and the second relay lead are joined to each other at a joint portion, and an end of the second relay lead extending from a joint portion with the first relay lead is located inside the outer package.
Abstract translation: 本发明的半导体器件包括：外包装; 第一引线框架，包括第一继电器引线，安装有功率元件的第一管芯焊盘和第一外部连接引线，其具有从外部封装突出的端部; 以及第二引线框架，包括第二继电器引线，安装有控制元件的第二管芯焊盘和具有从所述外部封装突出的端部的第二外部连接引线，其中所述第一管芯焊盘和所述第二管芯焊盘或 第一外部连接引线和第二继电器引线在接合部处彼此接合，并且从第一继电器引线的接合部延伸的第二继电器引线的端部位于外部封装的内部。
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