专利检索 ap:("PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.") AND inv:"Hisashi FUJINAGA" 第 1 页

1.

发明公开
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD 审中-公开

公开(公告)号：US20240182614A1

公开(公告)日：2024-06-06

申请号：US18282942

申请日：2022-03-22

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Masashi KODA , Akira IRIFUNE , Mitsuyoshi NISHINO , Hisashi FUJINAGA , Yuuki HIROKAWA

IPC分类号： C08F212/34 , C08J5/24 , C08K3/013 , C08K3/22 , C08K3/36 , C08K9/02 , C08K9/06 , H05K1/03

CPC分类号： C08F212/34 , C08J5/244 , C08K3/013 , C08K9/02 , C08K9/06 , H05K1/0373 , C08K2003/222 , C08K3/36 , H05K2201/0104 , H05K2201/0166 , H05K2201/0215

摘要： A resin composition contains a polyfunctional vinyl aromatic copolymer (A) containing a repeating unit (a) derived from a divinyl aromatic compound and a repeating unit (b) derived from a monovinyl aromatic compound, a curing agent (B), at least one filler (C) selected from the group consisting of a titanate compound filler (C1) and a magnesium oxide filler (C2), and a silica filler (D), in which the content ratio of the high dielectric constant filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.