公开(公告)号：US20170325350A1

公开(公告)日：2017-11-09

申请号：US15656453

申请日：2017-07-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kosaku ARITA ,  Masahiro NISHIKAWA

IPC: H05K7/14 ,  H05K5/02 ,  B60Q1/00 ,  F21S8/10 ,  H05K5/03

CPC classification number: H05K7/1427 ,  B60Q1/0094 ,  F21S41/00 ,  H05K5/0247 ,  H05K5/03 ,  H05K7/1432

Abstract: A power-supply device including: a casing having a space therein and formed by metal stamping or having a thickness ranging from 0.3 to 3.0 mm; and a circuit board disposed inside the casing, wherein the casing includes a casing portion having an opening, and a cover portion disposed to cover the opening of the casing portion, the casing portion has a through hole formed at a position corresponding to a connector terminal connected to the circuit board, and the cover portion includes a storage portion bulging outward from the casing, the storage portion storing either one of an electronic component provided to a face of the circuit board which faces the cover portion and an electronic component provided across the circuit board.

公开(公告)号：US20170009954A1

公开(公告)日：2017-01-12

申请号：US15201946

申请日：2016-07-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masatoshi UENO ,  Masahiro NISHIKAWA ,  Hiro AOKI

IPC: F21S8/10 ,  F21V7/04 ,  F21V23/06 ,  F21V29/70 ,  F21V23/00

CPC classification number: F21S45/47 ,  B60Q1/0094 ,  F21S41/147 ,  F21S41/192 ,  F21S41/39 ,  F21S45/49 ,  F21Y2115/10

Abstract: The light source unit includes: a semiconductor light emitting element; a lighting circuit configured to operate the semiconductor light emitting element; a first heat dissipation plate on which the semiconductor light emitting element is placed; a second heat dissipation plate on which the lighting circuit is placed; a wiring member electrically interconnecting the semiconductor light emitting element and the lighting circuit; and an interconnection member to which the first heat dissipation plate and the second heat dissipation plate are attached. The interconnection member is lower in thermal conductivity than the first heat dissipation plate and the second heat dissipation plate.

Abstract translation: 光源单元包括：半导体发光元件; 配置为操作所述半导体发光元件的点亮电路; 放置半导体发光元件的第一散热板; 放置照明电路的第二散热板; 电连接所述半导体发光元件和所述点亮电路的布线构件; 以及连接第一散热板和第二散热板的互连构件。 互连构件的热导率低于第一散热板和第二散热板。

公开(公告)号：US20150291088A1

公开(公告)日：2015-10-15

申请号：US14438623

申请日：2013-10-29

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masatoshi UENO ,  Toshiaki NAKAMURA ,  Kazuya KATO ,  Masashi KICHIMA ,  Masahiro NISHIKAWA

IPC: B60Q3/00 ,  H02H7/122

CPC classification number: B60Q3/00 ,  G01R31/025 ,  H02H3/16 ,  H02H3/243 ,  H02H7/122 ,  H02H7/1225 ,  H02M3/155 ,  H02M7/48 ,  H02M2001/007

Abstract: A power supply device includes a DC power supply circuit configured to output DC power, and a ground-fault determining circuit configured to determine presence or absence of a ground fault at a post-stage of the DC power supply circuit. The ground-fault determining circuit includes a capacitor having an end that is connected with ground, and a diode including an anode and a cathode. The anode is connected with another end of the capacitor, and the cathode is connected with an output end on a high voltage side of the DC power supply circuit. The ground-fault determining circuit further includes a constant voltage source configured to charge the capacitor with a prescribed charging voltage, and a comparator as a determining portion configured to determine presence of the ground fault when a voltage across the capacitor falls below a prescribed determination reference voltage lower than the prescribed charging voltage.

Abstract translation: 电源装置包括：配置为输出直流电力的直流电源电路;以及接地故障判定电路，被配置为确定直流电源电路的后级的接地故障的存在与否。 接地故障确定电路包括具有与地连接的端部的电容器和包括阳极和阴极的二极管。 阳极与电容器的另一端连接，阴极与直流电源电路的高压侧的输出端连接。 接地故障判定电路还包括被配置为以规定的充电电压对电容器充电的恒定电压源，以及作为确定部分的比较器，其被配置为当电容器两端的电压低于规定的确定基准时确定接地故障的存在 电压低于规定的充电电压。