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公开(公告)号：US20230257576A1
公开(公告)日：2023-08-17
申请号：US17914690
申请日：2021-04-01
Inventor： Eiichiro SAITO
CPC classification number: C08L63/00 , C08J5/244 , H05K1/036 , C08J2363/00 , C08J2463/00 , C08L2205/035 , C08L2205/025 , H05K2201/0195
Abstract: The present disclosure provides a thermosetting resin sheet that makes it easier, while an insulating layer where a conductor is to be embedded is being formed, to embed the conductor in the insulating layer and reduces the chances of causing a decline in moldability. A thermosetting resin sheet (1) includes a prepreg layer (2) and a resin sheet layer (3) stacked on the prepreg layer (2). The prepreg layer (2) includes a base member (4) and an uncured product or semi-cured product of a first thermosetting resin composition impregnated into the base member (4). The resin sheet layer (3) is an uncured product or semi-cured product of a second thermosetting resin composition. A curing time of the resin sheet layer (3) is longer than a curing time of the prepreg layer (2).
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公开(公告)号：US20230257540A1
公开(公告)日：2023-08-17
申请号：US18012583
申请日：2021-07-07
Inventor： Tomoyuki AOKI , Akihiro YAMAUCHI , Eiichiro SAITO
CPC classification number: C08J5/244 , C08J5/18 , H05K1/182 , H05K1/0366 , B29B11/16 , C08J2363/00 , C08J2463/00 , B29K2101/10
Abstract: A resin sheet according to the present disclosure includes an uncured product or semi-cured product of a thermosetting resin composition. A melt viscosity of the resin sheet is equal to or greater than 10 Pa·s and equal to or less than 2000 Pa·s when measured using a Koka flow tester under a measuring condition including 130° C. and 1 MPa and is equal to or greater than 6 Pa·s and equal to or less than 1200 Pa·s when measured using the Koka flow tester under a measuring condition including 130° C. and 4 MPa.
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Patent Agency Ranking
公开(公告)号：US20220372245A1
公开(公告)日：2022-11-24
申请号：US17771079
申请日：2020-10-21
Inventor： Akihiro YAMAUCHI , Eiichiro SAITO , Nobuo SHIBATA , Kouichi AOKI
Abstract: A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.
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公开(公告)号：US20250136741A1
公开(公告)日：2025-05-01
申请号：US18703589
申请日：2022-10-17
Inventor： Yuji YAMADA , Eiichiro SAITO , Hiroyuki FUJISAWA , Takahiro YAMADA
IPC: C08F290/06 , B32B15/08 , C08F290/04 , C08K3/36 , C08K5/3415 , C08K9/04
Abstract: The present disclosure provides a thermosetting resin composition contributing to reducing the elastic modulus of a cured product and increasing the flexibility thereof while reducing the chances of causing a decline in the heat resistance of the cured product. A thermosetting resin composition contains: a maleimide compound (A) having at least two maleimide groups in one molecule; a compound (B) having, at either or both of terminals thereof, a substituent with an ethylenic unsaturated bond and having a polyphenylene ether skeleton; and an inorganic filler (C). The compound (B) includes a compound (B1) having a butadiene-derived structural unit.
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5.发明公开公开(公告)号：US20230151204A1
公开(公告)日：2023-05-18
申请号：US17916487
申请日：2021-04-05
Inventor： Yohei MAEDA , Eiichiro SAITO , Akihiro YAMAUCHI
IPC: C08L63/00 , C08K5/5313 , C08J5/18 , H05K1/03 , C08K5/523 , C08K5/5399 , C08K3/36
CPC classification number: C08L63/00 , C08K5/5313 , C08J5/18 , H05K1/0373 , C08K5/523 , C08K5/5399 , C08K3/36 , C08J2363/00 , C08L2201/02 , C08K2003/2227
Abstract: A resin composition contains a resin component (A) and a phosphorus-containing flame retardant (B). The resin component (A) contains an epoxy resin (a1), of which the viscosity at 25° C. is equal to or less than 50000 mPa·s. The proportion of the epoxy resin (a1) to the resin component (A) is equal to or greater than 20% by mass. The phosphorus-containing flame retardant (B) includes a phosphorus-containing flame retardant (B1) that neither melts nor thermally decomposes at a temperature lower than 150° C.
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公开(公告)号：US20220098404A1
公开(公告)日：2022-03-31
申请号：US17426917
申请日：2020-01-30
Inventor： Kouichi AOKI , Tomoyuki AOKI , Eiichiro SAITO
IPC: C08L71/12
Abstract: The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.
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公开(公告)号：US20210235580A1
公开(公告)日：2021-07-29
申请号：US17050624
申请日：2019-04-22
Inventor： Akihiro YAMAUCHI , Eiichiro SAITO , Kouichi AOKI
IPC: H05K1/03 , B32B15/08 , H05K7/20 , H01L23/373
Abstract: A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.
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