Film-forming method
    1.
    发明授权

    公开(公告)号:US10428422B2

    公开(公告)日:2019-10-01

    申请号:US15586488

    申请日:2017-05-04

    Applicant: PHILTECH Inc.

    Abstract: A film-forming method for forming a film in a film-forming apparatus includes generating first gas molecular species and second gas molecular species by causing the first source gas and the second source gas accumulated in the accumulation mechanisms to pass through respective instantaneously-heating units, sharply raising partial pressure of the first gas molecular species and partial pressure of the second gas molecular species by projectingly supplying the first gas molecular species and the second gas molecular species to the reaction chamber in which the substrate has been placed, which has been depressurized, and which has a constant capacity; bringing the first gas molecular species or the second gas molecular species into reaction by alternately repeatedly guiding the first gas molecular species or the second gas molecular species to a surface of the substrate, and forming a compound film on the surface of the substrate.

    Solid gasification apparatus
    4.
    发明授权
    Solid gasification apparatus 有权
    固体气化装置

    公开(公告)号:US09340736B2

    公开(公告)日:2016-05-17

    申请号:US14679952

    申请日:2015-04-06

    Applicant: PHILTECH Inc.

    Abstract: A solid gasification apparatus includes a reaction chamber thermally insulated by a heat insulating material, a heat beam fluid heat exchange apparatus that produces a first heated gas and a second heated gas, and a unit that includes a gas flow path. The unit sprays the first heated gas against a material solid in a reaction chamber to heat the material solid, and, simultaneously, makes the material solid react with the first heated gas to produce a produced gas containing the element of the material solid. The unit makes a second heated gas contact and react with the produced gas.

    Abstract translation: 固体气化装置包括由绝热材料热绝缘的反应室,产生第一加热气体和第二加热气体的热束流体热交换装置,以及包括气体流路的单元。 单元将第一加热气体相对于反应室中的材料固体喷射以加热材料固体,并且同时使材料固体与第一加热气体反应,以产生含有材料固体元素的产生气体。 该装置使第二次加热的气体接触并与产生的气体反应。

    SOLID GASIFICATION APPARATUS
    5.
    发明申请
    SOLID GASIFICATION APPARATUS 有权
    固体气化装置

    公开(公告)号:US20150315501A1

    公开(公告)日:2015-11-05

    申请号:US14679952

    申请日:2015-04-06

    Applicant: PHILTECH Inc.

    Abstract: A solid gasification apparatus includes a reaction chamber thermally insulated by a heat insulating material, a heat beam fluid heat exchange apparatus that produces a first heated gas and a second heated gas, and a unit that includes a gas flow path. The unit spays the first heated gas against a material solid in a reaction chamber to heat the material solid, and, simultaneously, makes the material solid react with the first heated gas to produce a produced gas containing the element of the material solid. The unit makes a second heated gas contact and react with the produced gas.

    Abstract translation: 固体气化装置包括由绝热材料热绝缘的反应室,产生第一加热气体和第二加热气体的热束流体热交换装置,以及包括气体流路的单元。 单元将第一加热气体相对于反应室中的材料固体喷射以加热材料固体,并且同时使材料固体与第一加热气体反应,以产生含有材料固体元素的产生气体。 该装置使第二次加热的气体接触并与产生的气体反应。

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