公开(公告)号：US20170047279A1

公开(公告)日：2017-02-16

申请号：US15231931

申请日：2016-08-09

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD.

发明人： Wen-Hung Hu

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/565 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19105

摘要： A substrate structure is provided, including: a circuit board having a plurality of wiring layers; a first circuit layer; a plurality of conductive posts disposed on the first circuit layer; a first insulating layer encapsulating the circuit board, the first circuit layer and the conductive posts; and a second circuit layer formed on the first insulating layer and electrically connected to the wiring layers with the second circuit layer electrically connected to the first circuit layer through the conductive posts. According to the present disclosure, fine-pitch circuits are formed in the circuit board, and thus only the circuit board needs a high-cost insulating material, thereby allowing the first insulating layer to be made of a low-cost material to reduce the fabrication cost.

摘要翻译： 提供了一种基板结构，包括：具有多个布线层的电路板; 第一电路层; 设置在所述第一电路层上的多个导电柱; 密封电路板的第一绝缘层，第一电路层和导电柱; 以及形成在所述第一绝缘层上并与所述布线层电连接的第二电路层，所述第二电路层通过所述导电柱与所述第一电路层电连接。 根据本公开，在电路板中形成微细间距电路，因此只有电路板需要高成本的绝缘材料，从而允许第一绝缘层由低成本材料制成以减少制造 成本。

公开(公告)号：US09711444B2

公开(公告)日：2017-07-18

申请号：US15231931

申请日：2016-08-09

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD.

发明人： Wen-Hung Hu

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L21/565 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19105

摘要： A substrate structure is provided, including: a circuit board having a plurality of wiring layers; a first circuit layer; a plurality of conductive posts disposed on the first circuit layer; a first insulating layer encapsulating the circuit board, the first circuit layer and the conductive posts; and a second circuit layer formed on the first insulating layer and electrically connected to the wiring layers with the second circuit layer electrically connected to the first circuit layer through the conductive posts. According to the present disclosure, fine-pitch circuits are formed in the circuit board, and thus only the circuit board needs a high-cost insulating material, thereby allowing the first insulating layer to be made of a low-cost material to reduce the fabrication cost.