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公开(公告)号：US11545596B2
公开(公告)日：2023-01-03
申请号：US17351019
申请日：2021-06-17
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.
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公开(公告)号：US11069839B2
公开(公告)日：2021-07-20
申请号：US16738827
申请日：2020-01-09
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: Disclosed is an optical component package. The optical component package according to the present invention includes: a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a sub-substrate provided in a cavity of the main substrate, and electrically connected to each of the metal bodies with the vertical insulation part interposed therebetween; an optical component mounted on the sub-substrate; and a light transmitting member provided above the optical component, wherein the sub-substrate includes: an insulating body; a via hole vertically passing through the insulating body, and filled with a metal material; and a metal pad connected to the optical component.
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Patent Agency Ranking
公开(公告)号：US10658549B2
公开(公告)日：2020-05-19
申请号：US16144857
申请日：2018-09-27
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.
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公开(公告)号：US11253619B2
公开(公告)日：2022-02-22
申请号：US16890777
申请日：2020-06-02
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: Provided is a UV sterilizer including an illumination unit, a cover that has an open hole in an upper surface thereof and supports the illumination unit, and a body that is provided underneath the cover and secures an illumination distance between the illumination unit and an illumination target object. The body is composed of a first body and a second body into which the first body is inserted. The first body and the second body are separably combined with each other.
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公开(公告)号：US11201272B2
公开(公告)日：2021-12-14
申请号：US16383462
申请日：2019-04-12
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: The present invention relates generally to an optical device package on which an optical device is mounted and, more particularly, to an optical device package that is configured such that a unit substrate of the optical device package comes into surface contact with a curved surface of a light transmission member.
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6.发明申请公开(公告)号：US20180129039A1
公开(公告)日：2018-05-10
申请号：US15800522
申请日：2017-11-01
Applicant: Point Engineering Co., Ltd.
Inventor： Seung Ho Park , Moon Hyun Kim , Tae Hwan Song
IPC: G02B27/00
CPC classification number: G02B27/0006 , G02B5/00 , G02B7/00 , H01L25/0753 , H01L33/62
Abstract: An optical device substrate includes a substrate body having a mounting space formed thereon, and a lamination layer formed on the substrate body. A groove for connecting the mounting space and the outside of the substrate body is patterned in the lamination layer.
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7.发明申请公开(公告)号：US20180129038A1
公开(公告)日：2018-05-10
申请号：US15800498
申请日：2017-11-01
Applicant: Point Engineering Co., Ltd.
Inventor： Seung Ho Park , Moon Hyun Kim , Tae Hwan Song
IPC: G02B27/00
CPC classification number: G02B27/0006 , G02B7/00 , G02B7/003 , G02B27/32 , H01L33/48 , H01L33/486
Abstract: An optical device substrate includes a substrate body having a mounting space formed thereon, and a guide pattern laminated on the substrate body and configured to guide a cover for covering the mounting space.
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