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公开(公告)号：US20190130973A1
公开(公告)日：2019-05-02
申请号：US16233351
申请日：2018-12-27
Applicant: Pragmatic Printing LTD.
Inventor： Richard Price , Catherine Ramsdale
Abstract: A method of manufacturing an electronic circuit comprises: providing an electronic circuit having a first configuration in which the circuit comprises a resistive element having a first resistance, and irradiating at least a part of the resistive element with electromagnetic radiation to change the resistance of the resistive element from the first resistance to a second resistance, the second resistance being lower than the first resistance. A method of storing data comprises: receiving a piece of data to be stored; determining a number according to the data; and irradiating at least part of a resistive element with that number of pulses of electromagnetic radiation to change a resistance of the resistive element from a first resistance to a second resistance, the second resistance being lower than the first resistance. A difference between the first resistance and the second resistance is dependent on the number. Corresponding circuits and data storage systems are disclosed.
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公开(公告)号：US11177145B2
公开(公告)日：2021-11-16
申请号：US16621387
申请日：2018-06-18
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Neil Davies , Richard Price , Stephen Devenport , Stuart Speakman
Abstract: A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller having a removable surface portion; and transferring said ICs from the first roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.
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公开(公告)号：US10204683B2
公开(公告)日：2019-02-12
申请号：US15303982
申请日：2015-04-14
Applicant: PRAGMATIC PRINTING LTD
Inventor： Richard Price , Catherine Ramsdale
Abstract: A method of manufacturing an electronic circuit comprises: providing an electronic circuit having a first configuration in which the circuit comprises a resistive element having a first resistance, and irradiating at least a part of the resistive element with electromagnetic radiation to change the resistance of the resistive element from the first resistance to a second resistance, the second resistance being lower than the first resistance. A method of storing data comprises: receiving a piece of data to be stored; determining a number according to the data; and irradiating at least part of a resistive element with that number of pulses of electromagnetic radiation to change a resistance of the resistive element from a first resistance to a second resistance, the second resistance being lower than the first resistance. A difference between the first resistance and the second resistance is dependent on the number. Corresponding circuits and data storage systems are disclosed.
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公开(公告)号：US20170040056A1
公开(公告)日：2017-02-09
申请号：US15303982
申请日：2015-04-14
Applicant: PRAGMATIC PRINTING LTD
Inventor： Richard Price , Catherine Ramsdale
IPC: G11C13/04
CPC classification number: G11C13/047 , G11B9/04 , G11B11/08 , G11B11/12 , G11C11/5685 , G11C13/0002 , G11C13/0007 , G11C13/004 , G11C13/0069 , G11C13/044
Abstract: A method of manufacturing an electronic circuit comprises: providing an electronic circuit having a first configuration in which the circuit comprises a resistive element having a first resistance, and irradiating at least a part of the resistive element with electromagnetic radiation to change the resistance of the resistive element from the first resistance to a second resistance, the second resistance being lower than the first resistance. A method of storing data comprises: receiving a piece of data to be stored; determining a number according to the data; and irradiating at least part of a resistive element with that number of pulses of electromagnetic radiation to change a resistance of the resistive element from a first resistance to a second resistance, the second resistance being lower than the first resistance. A difference between the first resistance and the second resistance is dependent on the number. Corresponding circuits and data storage systems are disclosed.
Abstract translation: 一种制造电子电路的方法包括：提供具有第一结构的电子电路，其中所述电路包括具有第一电阻的电阻元件，并且用电磁辐射照射所述电阻元件的至少一部分以改变所述电阻的电阻 元件从第一电阻到第二电阻，第二电阻低于第一电阻。 存储数据的方法包括：接收待存储的数据; 根据数据确定一个数字; 以及用所述数量的电磁辐射脉冲照射电阻元件的至少一部分，以将所述电阻元件的电阻从第一电阻改变为第二电阻，所述第二电阻低于所述第一电阻。 第一电阻和第二电阻之间的差异取决于数量。 公开了相应的电路和数据存储系统。
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公开(公告)号：US12136632B2
公开(公告)日：2024-11-05
申请号：US18231585
申请日：2023-08-08
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Richard Price , Catherine Ramsdale , Brian Hardy Cobb , Feras Alkhalil
IPC: H01L27/12 , H01L21/02 , H01L21/027 , H01L21/285 , H01L21/306 , H01L21/3213 , H01L29/40 , H01L29/417
Abstract: A structure is disclosed, comprising: a first field effect transistor, FET, comprising a first source terminal, a first drain terminal, a first layer or body of semiconductive material arranged to provide a first semiconductive channel connecting the first source terminal to the first drain terminal, and a gate terminal arranged with respect to the first semiconductive channel such that a conductivity of the first semiconductive channel may be controlled by application of a voltage to the gate terminal; and a second FET comprising a second source terminal, a second drain terminal, a second layer or body of semiconductive material arranged to provide a second semiconductive channel connecting the second source terminal to the second drain terminal, and the gate terminal, the second conductive channel being arranged with respect to the gate terminal such that a conductivity of the second channel may be controlled by application of a voltage to the gate terminal. Methods of manufacturing such structures are also disclosed.
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Patent Agency Ranking
公开(公告)号：US11978744B2
公开(公告)日：2024-05-07
申请号：US17315463
申请日：2021-05-10
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Richard Price , Catherine Ramsdale , Brian Hardy Cobb , Feras Alkhalil
IPC: H01L27/12 , H01L21/02 , H01L21/027 , H01L21/285 , H01L21/306 , H01L21/3213 , H01L29/40 , H01L29/417
CPC classification number: H01L27/1251 , H01L21/02266 , H01L21/02631 , H01L21/0274 , H01L21/2855 , H01L21/30604 , H01L21/32133 , H01L27/1262 , H01L27/127 , H01L27/1288 , H01L29/401 , H01L29/41733
Abstract: A structure is disclosed, comprising: a first field effect transistor, FET, comprising a first source terminal, a first drain terminal, a first layer or body of semiconductive material arranged to provide a first semiconductive channel connecting the first source terminal to the first drain terminal, and a gate terminal arranged with respect to the first semiconductive channel such that a conductivity of the first semiconductive channel may be controlled by application of a voltage to the gate terminal; and a second FET comprising a second source terminal, a second drain terminal, a second layer or body of semiconductive material arranged to provide a second semiconductive channel connecting the second source terminal to the second drain terminal, and the gate terminal, the second conductive channel being arranged with respect to the gate terminal such that a conductivity of the second channel may be controlled by application of a voltage to the gate terminal. Methods of manufacturing such structures are also disclosed.
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公开(公告)号：US11659669B2
公开(公告)日：2023-05-23
申请号：US16641720
申请日：2018-08-16
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Richard Price , Stephen Devenport , Brian Cobb
CPC classification number: H05K3/4632 , H05K3/361 , B29C65/1403 , B29L2031/3425
Abstract: One exemplary aspect relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations to facilitate shipping and subsequent removal of the flexible substrate from the carrier. The process includes providing a flexible substrate comprising a plurality of integrated circuits thereon providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier. The process further includes changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.
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8.发明授权公开(公告)号：US10672765B2
公开(公告)日：2020-06-02
申请号：US15236057
申请日：2016-08-12
Applicant: Pragmatic Printing Ltd
Inventor： Richard Price , Scott White
IPC: H01L27/088 , G03F7/00 , H01L29/786 , H01L51/05 , H01L27/12 , H01L29/66 , H01L21/027 , H01L21/768 , H01L21/28 , H01L21/283 , H01L21/311 , H01L21/8234 , H01L23/528 , H01L27/118
Abstract: A method of manufacturing a transistor comprising providing a substrate, a region of semiconductive material on the substrate, and a region of electrically conductive material on the region of semiconductive material; forming a covering of resist material over said regions; forming a depression in a surface of the covering of resist material that extends over a first portion of said region of conductive material, said first portion separating second and third portions of the conductive region; removing resist material located under said depression to form a window through said covering, exposing said first portion; removing said first portion to expose a connecting portion of the region of semiconductive material that connects the second and third portions; forming a layer of dielectric material over the exposed connecting portion; and forming a layer of electrically conductive material over said layer of dielectric material.
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9.发明申请公开(公告)号：US20170125406A1
公开(公告)日：2017-05-04
申请号：US15236057
申请日：2016-08-12
Applicant: Pragmatic Printing Ltd
Inventor： Richard Price , Scott White
IPC: H01L27/088 , H01L21/311 , H01L21/283 , H01L27/12 , H01L21/8234 , H01L27/118 , H01L23/528 , H01L21/768 , H01L21/027 , H01L21/28
Abstract: A method of manufacturing a transistor comprising: providing a substrate, a region of semiconductive material supported by the substrate, and a region of electrically conductive material supported by the region of semiconductive material; forming at least one layer of resist material over said regions to form a covering of resist material over said regions; forming a depression in a surface of the covering of resist material, said depression extending over a first portion of said region of conductive material, said first portion separating a second portion of the conductive region from a third portion of the conductive region; removing resist material located under said depression so as to form a window, through said covering, exposing said first portion of the electrically conductive region; removing said first portion to expose a connecting portion of the region of semiconductive material, said connecting portion connecting the second portion to the third portion of the conductive region; forming a layer of dielectric material over the exposed portion of the region of semiconductive material; and depositing electrically conductive material to form a layer of electrically conductive material over said layer of dielectric material, the layer of dielectric material electrically isolating the layer of electrically conductive material from the second and third portions of the conductive region.
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公开(公告)号：US11990484B2
公开(公告)日：2024-05-21
申请号：US17874875
申请日：2022-07-27
Applicant: PRAGMATIC PRINTING LTD.
Inventor： Richard Price , Brian Cobb , Neil Davies
CPC classification number: H01L27/1262 , H01L21/78 , H01L27/1218 , H01L27/1266
Abstract: The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.
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