公开(公告)号：US20240079216A1

公开(公告)日：2024-03-07

申请号：US18462379

申请日：2023-09-06

Applicant: PSK INC.

Inventor： KWANG SUNG YOO ,  JONG CHAN LEE ,  TAE HOON KANG

IPC: H01J37/32

CPC classification number: H01J37/32697 ,  H01J37/32568 ,  H01J37/32577 ,  H01J2237/334

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support plate for supporting a substrate and applying a power; a plasma control unit placed above the support plate to face the support plate; and a top electrode unit positioned to surround the plasma control unit, and wherein the plasma control unit includes: a dielectric plate positioned to face a top surface of a substrate mounted on the support plate; and a metal plate positioned above the dielectric plate, and the metal plate is electrically connected to the top electrode unit.

公开(公告)号：US20240087854A1

公开(公告)日：2024-03-14

申请号：US18462378

申请日：2023-09-06

Applicant: PSK INC.

Inventor： KWANG SUNG YOO ,  JONG CHAN LEE

IPC: H01J37/32

CPC classification number: H01J37/32568 ,  H01J37/32348 ,  H01J37/32697 ,  H01J37/32715 ,  H01J37/32733 ,  H01J2237/20235 ,  H01J2237/3341

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit positioned within the treating space and configured to apply a power and to support a substrate; and a plasma control unit configured to change a characteristic of a plasma formed in the treating space, and wherein the plasma control unit includes: a gap control plate positioned above the support unit; and a plate driver changing a position of the gap control plate, and the plate driver maintains a gap between a bottom surface of the gap control plate and a top surface of the support plate while changing a characteristic of the plasma by changing the position of the gap control plate.

公开(公告)号：US20240078663A1

公开(公告)日：2024-03-07

申请号：US18462386

申请日：2023-09-06

Applicant: PSK INC.

Inventor： KWANG SUNG YOO ,  GEON JONG KIM

IPC: G06T7/00 ,  G06T7/11 ,  G06T7/174 ,  H01J37/32

CPC classification number: G06T7/001 ,  G06T7/11 ,  G06T7/174 ,  H01J37/32348 ,  H01J37/3288 ,  H01J37/32899 ,  H01J2237/221 ,  H01J2237/24592 ,  H01J2237/3341

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes treating an edge region of a substrate using a plasma; and acquiring an image to be determined by imaging a substrate on which a treatment has been completed in the treating the edge region, comparing the image to be determined with an image stored in a database, and determining whether a substrate treated in the treating the edge region is defective or not, and wherein the image stored in the database is a defective image of a substrate which has been determined as defective, which is previously stored in the database in the acquiring the image to be determined.