公开(公告)号：US09287249B2

公开(公告)日：2016-03-15

申请号：US14389621

申请日：2013-03-12

申请人： Panasonic Corporation

发明人： Tomohiro Kinoshita ,  Eiji Takahashi ,  Naoki Komatsu ,  Kazuhide Uriu

IPC分类号： H01L25/18 ,  H01L25/065 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H04N21/426 ,  H04N5/775

CPC分类号： H01L25/18 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05553 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/06135 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49051 ,  H01L2224/49097 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3011 ,  H01L2924/3025 ,  H04N5/775 ,  H04N21/42607 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device comprises a first semiconductor chip; and a second semiconductor chip provided on the first semiconductor chip with having chip-on-chip connection to the first semiconductor chip, wherein when seen from a direction perpendicular to an upper surface of the second semiconductor chip, an outline of the second semiconductor chip is larger than an outline of the first semiconductor chip, a plurality of electrode terminals for the first semiconductor chip are provided on an upper surface of the first semiconductor chip, the plurality of electrode terminals for the first semiconductor chip comprise one or more first covered terminals which are covered with the second semiconductor chip and one or more first uncovered terminals which are not covered with the second semiconductor chip.

摘要翻译： 半导体器件包括第一半导体芯片; 以及设置在所述第一半导体芯片上的具有与所述第一半导体芯片的芯片上芯片连接的第二半导体芯片，其中，当从与所述第二半导体芯片的上表面垂直的方向观察时，所述第二半导体芯片的轮廓为 大于第一半导体芯片的轮廓，在第一半导体芯片的上表面上设置用于第一半导体芯片的多个电极端子，用于第一半导体芯片的多个电极端子包括一个或多个第一覆盖端子， 被第二半导体芯片和未被第二半导体芯片覆盖的一个或多个第一未覆盖端子覆盖。

公开(公告)号：US20150062437A1

公开(公告)日：2015-03-05

申请号：US14389621

申请日：2013-03-12

申请人： Panasonic Corporation

发明人： Tomohiro Kinoshita ,  Eiji Takahashi ,  Naoki Komatsu ,  Kazuhide Uriu

IPC分类号： H01L25/18 ,  H04N21/426 ,  H04N5/775 ,  H01L23/00

CPC分类号： H01L25/18 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05553 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/06135 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49051 ,  H01L2224/49097 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3011 ,  H01L2924/3025 ,  H04N5/775 ,  H04N21/42607 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device comprises a first semiconductor chip; and a second semiconductor chip provided on the first semiconductor chip with having chip-on-chip connection to the first semiconductor chip, wherein when seen from a direction perpendicular to an upper surface of the second semiconductor chip, an outline of the second semiconductor chip is larger than an outline of the first semiconductor chip, a plurality of electrode terminals for the first semiconductor chip are provided on an upper surface of the first semiconductor chip, the plurality of electrode terminals for the first semiconductor chip comprise one or more first covered terminals which are covered with the second semiconductor chip and one or more first uncovered terminals which are not covered with the second semiconductor chip.

摘要翻译： 半导体器件包括第一半导体芯片; 以及设置在所述第一半导体芯片上的具有与所述第一半导体芯片的芯片上芯片连接的第二半导体芯片，其中，当从与所述第二半导体芯片的上表面垂直的方向观察时，所述第二半导体芯片的轮廓为 大于第一半导体芯片的轮廓，在第一半导体芯片的上表面上设置用于第一半导体芯片的多个电极端子，用于第一半导体芯片的多个电极端子包括一个或多个第一覆盖端子， 被第二半导体芯片和未被第二半导体芯片覆盖的一个或多个第一未覆盖端子覆盖。