公开(公告)号：US11920001B2

公开(公告)日：2024-03-05

申请号：US17660647

申请日：2022-04-26

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Keisuke Kawashima ,  Honami Nawa

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C08G75/045

CPC classification number: C08G75/045

Abstract: A photocurable composition contains:
a component (A): (meth)acrylic acid ester having 2 to 6 (meth)acryloyl groups in one molecule,
a component (B): a thiol compound having 2 to 4 thiol groups in one molecule, and
a component (C): a photobase generator,
in which a mass ratio of the component (A) to the component (B) is 66:34 to 33:67, inclusive,
a functional group equivalent of the component (A) is 96 g/eq to 180 g/eq, inclusive,
a functional group equivalent of the component (B) is 95 g/eq to 190 g/eq, inclusive, and
a content of the component (C) is 0.5 parts by mass to 2 parts by mass with respect to 100 parts by mass of a total of the component (A), the component (B), and the component (C).

公开(公告)号：US09859190B2

公开(公告)日：2018-01-02

申请号：US15409519

申请日：2017-01-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Honami Nawa ,  Hirohisa Hino

IPC: H01L23/373 ,  B05D7/00 ,  H01L23/42

CPC classification number: H01L23/3737 ,  B05D7/5483 ,  H01L23/295 ,  H01L23/367 ,  H01L23/42

Abstract: Provided herein is a resin structure having high heat dissipation, and desirable adhesion at the interface with a heat generating device. The resin structure is provided on a substrate to dissipates heat of the substrate to outside, and includes: a water-based coating material layer provided on the substrate and including a water-based coating material, and fillers having an average particle size of 30 μm to 150 μm; and a resin layer provided on the water-based coating material layer and containing a thermosetting resin. The fillers have a far-infrared emissivity of 0.8 or more, and an average aspect ratio of 1 to 12 as measured as a ratio of lengths along the long axis and the short axis through the center of gravity of the fillers. At least 80% of the total number of fillers has a length that is at least 1.7 times longer than the total thickness of the water-based coating material of the water-based coating material layer and the thermosetting resin of the resin layer, as measured along the long axis through the center of gravity of the fillers.

公开(公告)号：US10407604B2

公开(公告)日：2019-09-10

申请号：US14706349

申请日：2015-05-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Honami Nawa ,  Hirohisa Hino ,  Arata Kishi ,  Naomichi Ohashi ,  Yasuhiro Suzuki ,  Hidenori Miyakawa

IPC: C09K5/14 ,  C08L23/16 ,  C09D123/16 ,  C08K3/34 ,  H05K7/20 ,  C08L91/00

Abstract: Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 μm to 20 μm; and a filler having a grain diameter of 15 μm or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 μm to 20 μm.

公开(公告)号：US09322541B2

公开(公告)日：2016-04-26

申请号：US14569045

申请日：2014-12-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hirohisa Hino ,  Arata Kishi ,  Honami Nawa

IPC: H01M10/50 ,  F21V29/15 ,  H01M10/653 ,  H01M10/6551 ,  H01M10/655 ,  H01M10/613 ,  H01M10/66 ,  H01M4/86

CPC classification number: F21V29/15 ,  H01M4/8642 ,  H01M10/613 ,  H01M10/653 ,  H01M10/655 ,  H01M10/6551 ,  H01M10/66

Abstract: A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity λ of the heat conduction layer is 1.0 W/(m·K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity ε of the heat radiation layer is 0.7 or more.

Abstract translation: 冷却结构可以有效地减少热量，从而抑制制热电子设备的温度升高，而不使用散热器或水冷套，并且可以实现其小型化或减轻重量。 冷却结构包括：通过在发热体的表面上涂布第一浆料而形成的导热层; 以及通过在导热层的表面上涂布第二糊剂形成的散热层。 导热层包括第一树脂和第一填料，导热层的导热系数λ为1.0W /（m·K）以上。 散热层包括第二树脂和第二填料，以及红外发射率 的散热层为0.7以上。