-
公开(公告)号：US12028986B2
公开(公告)日：2024-07-02
申请号：US17367269
申请日：2021-07-02
Inventor： Naomichi Ohashi , Yasuhiro Okawa , Koso Matsuno
IPC: B23K1/00 , H05K1/03 , H05K1/09 , H05K3/34 , B23K101/40 , B23K103/00
CPC classification number: H05K3/341 , B23K1/0016 , H05K1/032 , H05K1/092 , B23K2101/40 , B23K2103/42
Abstract: A method for mounting an electronic component on a resin base material, the method including:
(1) preparing the resin base material having a wiring pattern formed of a conductive paste;
(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;
(3) placing the electronic component on the solder paste; and
(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein
a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.-
Patent Agency Ranking
公开(公告)号：US11970631B2
公开(公告)日：2024-04-30
申请号：US17805328
申请日：2022-06-03
Inventor： Naomichi Ohashi , Koso Matsuno
Abstract: A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.
-
3.发明授权公开(公告)号：US10407604B2
公开(公告)日：2019-09-10
申请号：US14706349
申请日：2015-05-07
Inventor： Honami Nawa , Hirohisa Hino , Arata Kishi , Naomichi Ohashi , Yasuhiro Suzuki , Hidenori Miyakawa
Abstract: Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 μm to 20 μm; and a filler having a grain diameter of 15 μm or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 μm to 20 μm.
-
公开(公告)号：US11618110B2
公开(公告)日：2023-04-04
申请号：US17073461
申请日：2020-10-19
Inventor： Naomichi Ohashi , Koso Matsuno , Yasuhiro Okawa
IPC: B23K35/362 , B23K35/36 , B23K35/26
Abstract: A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.
-
公开(公告)号：US10440834B2
公开(公告)日：2019-10-08
申请号：US15352264
申请日：2016-11-15
Inventor： Hirohisa Hino , Naomichi Ohashi , Yuki Yoshioka , Masato Mori , Yasuhiro Suzuki
IPC: C09J163/00 , C09J9/02 , C09J11/02 , C09J11/04 , C09J11/06 , C08K3/10 , C08K3/36 , C08K9/04 , H05K3/34 , H01L23/00 , H05K1/11 , H05K1/18 , B23K35/24 , H01L23/498
Abstract: Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.
-
公开(公告)号：US09881813B2
公开(公告)日：2018-01-30
申请号：US15212158
申请日：2016-07-15
Inventor： Hirohisa Hino , Yasuhiro Suzuki , Masato Mori , Naomichi Ohashi
IPC: H01L21/48 , H01L23/498 , H01L25/065 , H01L23/00 , H01L25/10 , H01L25/00 , H01L21/60
CPC classification number: H01L21/4853 , H01L23/49816 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2021/60007 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/15311
Abstract: A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.
-
-
-
-
-
Search Results
6
records
(took 0.016 seconds)
