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公开(公告)号：US20200280269A1
公开(公告)日：2020-09-03
申请号：US16645563
申请日：2018-10-26
Inventor： HIDEYUKI ARAI , JUN'ICHI NAKA , TOSHIAKI OZEKI , KOJI OBATA
IPC: H02N2/18 , G01H11/08 , H01L41/04 , H01L41/08 , H01L41/113 , H01L41/193 , F16H19/00 , F16H19/06 , F16H19/04
Abstract: The present disclosure provides a vibration power generation device capable of generating large electric power relative to an amount of displacement of a portion of a specimen. Vibration power generation device according to the present invention includes piezoelectric part and displacement enhancer. In response to displacement of a portion of specimen, displacement enhancer displaces a portion of piezoelectric part by a displacement amount greater than an amount of the displacement of the portion of specimen. When the portion of piezoelectric part is displaced, piezoelectric part generates electric power in accordance with an amount of the displacement of the portion of piezoelectric part.
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Patent Agency Ranking
公开(公告)号：US20200342282A1
公开(公告)日：2020-10-29
申请号：US16955772
申请日：2019-02-04
Inventor： KOJI OBATA , HIDEYUKI ARAI , JUN'ICHI NAKA
IPC: G06K19/077 , H01Q1/22 , H01L29/786
Abstract: Improving safety against peeling-off of a semiconductor device from an article and omitting an adhesion work of the semiconductor device to the article are made possible. Provided is semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The one or more components are directly fixed on a surface of article. Provided is a manufacturing method of semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The manufacturing method includes at least one of following step P1 and step Q1: step P1 of directly mounting the semiconductor chip on a surface of an article; and step Q1 of directly forming one or more components selected from a group including the thin film transistor, the antenna, and the wiring on the surface of the article by a printing method.
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公开(公告)号：US20200372317A1
公开(公告)日：2020-11-26
申请号：US16769652
申请日：2019-01-23
Inventor： KOJI OBATA , HIDEYUKI ARAI , JUN'ICHI NAKA
IPC: G06K19/077 , H01L21/822 , H01L29/786
Abstract: A wireless communication semiconductor device includes a circuit board, a semiconductor chip mounted on the circuit board, a thin film transistor provided on the circuit board, and an antenna provided on the circuit board. Even if a different unique ID is assigned to each of the wireless communication semiconductor devices, as compared with silicon-based wireless communication semiconductor devices, a manufacturing cost per device is sufficiently reduced, and the reduction in operation speed and reliability is sufficiently prevented.
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公开(公告)号：US20170346457A1
公开(公告)日：2017-11-30
申请号：US15594075
申请日：2017-05-12
Inventor： KOJI OBATA , KAZUO MATSUKAWA
CPC classification number: H03F3/45475 , A61B5/02108 , A61B5/02427 , A61B5/7225 , H03F2203/45514 , H03F2203/45551
Abstract: An amplifier circuit includes a first input branch circuit including a first sampling capacitor, a second input branch circuit including a second sampling capacitor, an averaging capacitor, and a subtraction capacitor, a feedback capacitor, and an operational amplifier. The first sampling capacitor samples an input voltage in a first time period and outputs a first voltage. The second sampling capacitor samples the input voltage in the first time period and outputs a second voltage. The averaging capacitor takes an average of the second voltage in the second time period and outputs a third voltage. The subtraction capacitor receives the third voltage in the first time period. The subtraction capacitor subtracts the first voltage from the third voltage and outputs a fourth voltage in the second time period. The operational amplifier is connected to the feedback capacitor and amplifies the fourth voltage. The first and second time periods are repeated alternately.
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公开(公告)号：US20220123758A1
公开(公告)日：2022-04-21
申请号：US17427060
申请日：2020-03-13
Inventor： KOJI OBATA , JUN'ICHI NAKA , JUNJI NAKATSUKA , HIROKI YOSHINO , MASAAKI NAGAI
IPC: H03M1/10
Abstract: Provided are an analog-to-digital (AD) converter, a sensor system, and a test system capable of reducing the time for test processing. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to test controller before first output part outputs the first digital data. In the test mode, test controller determines whether or not sensor system including sensor is in an abnormal state on the basis of the second digital data.
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公开(公告)号：US20220123757A1
公开(公告)日：2022-04-21
申请号：US17427061
申请日：2020-03-09
Inventor： JUN'ICHI NAKA , KOJI OBATA , JUNJI NAKATSUKA , HIROKI YOSHINO , MASAAKI NAGAI
IPC: H03M1/06
Abstract: Provided are an analog-to-digital (AD) converter, a sensor processing circuit, and a sensor system capable of improving responsiveness of feedback control. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to sensor before first output part outputs the first digital data.
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