公开(公告)号：US20190333792A1

公开(公告)日：2019-10-31

申请号：US16388005

申请日：2019-04-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masanori IKEDA ,  Katsusuke FUKASAWA ,  Kazuhiko ITOSE

IPC: H01L21/67 ,  H05K13/04 ,  H05K3/34

Abstract: A component mounting line includes a plurality of component mounting apparatuses, each of which mounts solder and a component other than the solder on a substrate. The component mounting line includes: a time limit management unit configured to manage an elapsed time period of a member; and a usability determiner that determines whether the member is usable based on the elapsed time period of the member. The elapsed time period is a time period that has elapsed after the member is exposed to the air, and the member comprises at least one of a substrate, solder, and a component other than the solder.

公开(公告)号：US20160234983A1

公开(公告)日：2016-08-11

申请号：US14867241

申请日：2015-09-28

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC: H05K13/04 ,  H05K3/34

CPC classification number: H05K13/0465 ,  H05K3/3421 ,  H05K3/3478 ,  H05K13/08 ,  H05K13/0817 ,  H05K2203/041

Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.

Abstract translation: 一种部件安装装置，包括将电子部件安装在基板上的安装单元，供给芯片焊料的至少一个部件供给部，以及控制单元，其控制从所述部件供给部供给的芯片焊料的安装部 基于生产数据，其中指示要安装在板的每个电极上的芯片焊料的尺寸的单元。

公开(公告)号：US20160295757A1

公开(公告)日：2016-10-06

申请号：US14993852

申请日：2016-01-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC: H05K13/08 ,  H05K3/34 ,  H05K13/04

Abstract: A component mounting line includes an inspecting apparatus and a component mounting apparatus. The inspecting apparatus measures a solder volume of a printed solder on each electrode of a board. The component mounting apparatus includes a mounting unit that mounts an electronic component on the board, at least one component supply unit that supplies a chip solder, and a control unit that controls the mounting unit to mount the chip solder supplied from the component supply unit based on production data in which a size of the chip solder is instructed corresponding to the solder volume measured for each of component terminals corresponding to each electrode of the board.

Abstract translation: 部件安装线包括检查装置和部件安装装置。 检查装置测量板的每个电极上的印刷焊料的焊料体积。 部件安装装置包括安装单元，其安装在电路板上的电子部件，提供芯片焊料的至少一个部件供应单元和控制单元以安装从元件供应单元提供的芯片焊料为基础的控制单元 对应于根据与板的每个电极相对应的每个组件端子测量的焊料体积来指示芯片焊料的尺寸的生产数据。

公开(公告)号：US20160234984A1

公开(公告)日：2016-08-11

申请号：US14868885

申请日：2015-09-29

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0465 ,  H05K3/3421 ,  H05K3/3478 ,  H05K13/0817 ,  H05K2203/041

Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.

Abstract translation: 一种部件安装装置，包括将电子部件安装在基板上的安装单元，供给芯片焊料的至少一个部件供给部，以及控制单元，其控制从所述部件供给部供给的芯片焊料的安装部 基于生产数据，其中指示每个组件端子的芯片焊料的尺寸。