公开(公告)号：US20160234983A1

公开(公告)日：2016-08-11

申请号：US14867241

申请日：2015-09-28

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC: H05K13/04 ,  H05K3/34

CPC classification number: H05K13/0465 ,  H05K3/3421 ,  H05K3/3478 ,  H05K13/08 ,  H05K13/0817 ,  H05K2203/041

Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.

Abstract translation: 一种部件安装装置，包括将电子部件安装在基板上的安装单元，供给芯片焊料的至少一个部件供给部，以及控制单元，其控制从所述部件供给部供给的芯片焊料的安装部 基于生产数据，其中指示要安装在板的每个电极上的芯片焊料的尺寸的单元。

公开(公告)号：US20150305213A1

公开(公告)日：2015-10-22

申请号：US14443691

申请日：2013-11-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO.,LTD

Inventor： Katsuhiko ITOH ,  Mitsuo NAKAMURA ,  Daisuke NAGAI ,  Kenji OKAMOTO

IPC: H05K13/00 ,  H05K3/34 ,  B23K37/04 ,  B23K31/12 ,  B23K1/00 ,  B23K1/20

CPC classification number: H05K13/0015 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0638 ,  B23K3/087 ,  B23K31/12 ,  B23K37/04 ,  B23K2101/42 ,  H05K3/303 ,  H05K3/34 ,  H05K13/0465 ,  H05K13/08 ,  H05K13/0812 ,  H05K13/0817 ,  H05K2201/10636 ,  H05K2203/04 ,  H05K2203/163 ,  H05K2203/166 ,  Y02P70/611

Abstract: In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.

Abstract translation: 在检测印刷焊料的位置的安装位置校正中，计算电极的位置与印刷焊料的位置之间的位置偏移量，并且基于计算出的位置移动量来校正安装位置，当校正量 基于计算出的位置偏移量超过表示在安装信息中定义和允许的修正量的上限的极限值，电子部件安装在通过考虑极限值而被校正的安装位置作为校正 量。 因此，可以根据打印位置偏移的程度考虑作为基准的焊锡印刷位置来适当地采用安装位置校正，并获得期望的接合质量改进效果。

公开(公告)号：US20160234984A1

公开(公告)日：2016-08-11

申请号：US14868885

申请日：2015-09-29

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0465 ,  H05K3/3421 ,  H05K3/3478 ,  H05K13/0817 ,  H05K2203/041

Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.

Abstract translation: 一种部件安装装置，包括将电子部件安装在基板上的安装单元，供给芯片焊料的至少一个部件供给部，以及控制单元，其控制从所述部件供给部供给的芯片焊料的安装部 基于生产数据，其中指示每个组件端子的芯片焊料的尺寸。

公开(公告)号：US20160295757A1

公开(公告)日：2016-10-06

申请号：US14993852

申请日：2016-01-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC: H05K13/08 ,  H05K3/34 ,  H05K13/04

Abstract: A component mounting line includes an inspecting apparatus and a component mounting apparatus. The inspecting apparatus measures a solder volume of a printed solder on each electrode of a board. The component mounting apparatus includes a mounting unit that mounts an electronic component on the board, at least one component supply unit that supplies a chip solder, and a control unit that controls the mounting unit to mount the chip solder supplied from the component supply unit based on production data in which a size of the chip solder is instructed corresponding to the solder volume measured for each of component terminals corresponding to each electrode of the board.

Abstract translation: 部件安装线包括检查装置和部件安装装置。 检查装置测量板的每个电极上的印刷焊料的焊料体积。 部件安装装置包括安装单元，其安装在电路板上的电子部件，提供芯片焊料的至少一个部件供应单元和控制单元以安装从元件供应单元提供的芯片焊料为基础的控制单元 对应于根据与板的每个电极相对应的每个组件端子测量的焊料体积来指示芯片焊料的尺寸的生产数据。

公开(公告)号：US20150359149A1

公开(公告)日：2015-12-10

申请号：US14655560

申请日：2013-12-19

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Katsuhiko ITOH ,  Nobuo KOMIYA

IPC: H05K13/08 ,  H05K13/04 ,  H05K3/34

CPC classification number: H05K13/08 ,  H05K3/341 ,  H05K13/0465 ,  Y10T29/49135 ,  Y10T29/53013

Abstract: An electronic component mounting system includes: a printing apparatus; a plurality of electronic component mounting apparatuses; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic component mounting apparatuses. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for each of the electronic component mounting apparatuses by referring to the mounting information.

Abstract translation: 电子部件安装系统包括：打印装置; 多个电子部件安装装置; 以及安装信息存储单元，其存储安装信息。 安装信息包括为每个电子部件安装装置设置了第一安装模式和第二安装模式中的一个的执行模式信息。 在第一安装模式中，电子部件被放置在基于在板上形成的第一识别标记的识别结果而被校正的安装位置。 在第二安装模式中，电子部件被放置在基于通过印刷在印版上的糊状物形成的第二识别标记的识别结果来校正的安装位置。 电子部件通过参照安装信息按照为每个电子部件安装装置设定的安装方式安装在电路板上。