公开(公告)号：US20240162091A1

公开(公告)日：2024-05-16

申请号：US18501124

申请日：2023-11-03

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hidehiko KARASAKI ,  Shogo OKITA ,  Toshiyuki TAKASAKI ,  Ryota FURUKAWA

IPC: H01L21/78 ,  H01L21/308

CPC classification number: H01L21/78 ,  H01L21/3086 ,  H01L21/3065

Abstract: The disclosed element chip manufacturing method includes: a first step of imparting hydrophilicity to a first surface 11 of a substrate 1, the first surface 11 including element regions 11A and dicing regions 11B defining the element regions 11A; a second step of applying a raw material liquid containing a water-soluble resin onto the first surface 11, to form a water-soluble resin layer 20 on the first surface 11; a third step of applying a laser beam to the water-soluble resin layer 20 covering the dicing regions 11B, to form openings 20a that expose the dicing regions 11B, in the water-soluble resin layer 20; a fourth step of etching the dicing regions 11B exposed at the openings 20a, with plasma, to obtain element chips 30; and a fifth step of removing the water-soluble resin layer 20 by bringing the element chips 30 into contact with a water-containing cleaning liquid.

公开(公告)号：US20220199411A1

公开(公告)日：2022-06-23

申请号：US17550309

申请日：2021-12-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Toshiyuki TAKASAKI ,  Ryota FURUKAWA ,  Atsushi HARIKAI ,  Shogo OKITA

IPC: H01L21/3065 ,  H01L21/78 ,  H01L21/311

Abstract: Disclosed is a method for producing element chips. The method includes: a preparing step of preparing a substrate 10 that is held on a holding sheet 22 that is supported by a frame 21, the substrate including element regions and dicing regions; a protective film forming step of forming a protective film 15 so as to cover the frame 21, the holding sheet 22, and the substrate 10; a patterning step of removing a part of the protective film 15 so as to expose the dicing regions of the substrate 10; a plasma dicing step including a process that uses a plasma that contains fluorine, the plasma dicing step being a step of individualizing the substrate 10 into a plurality of element chips; and a fluorine removing step of removing, together with the protective film 15, fluorine attached to the protective film 15 in the plasma dicing step.