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公开(公告)号：US11336184B2
公开(公告)日：2022-05-17
申请号：US17017152
申请日：2020-09-10
Inventor： Shinya Kimura , Toshihiko Bessho , Satoshi Kominami
Abstract: An LLC resonant converter in which a capacitor (Cr), an inductance (Lr), and a power line between the capacitor (Cr) and the inductance (Lr), which constitute a series resonance unit, are resin-encapsulated by a resin. Because the series resonance unit that is a high voltage portion is resin-encapsulated collectively, it is possible to shorten an insulation distance even in the case of higher voltages and frequencies, and to prevent an increase in size.
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公开(公告)号：US10830825B2
公开(公告)日：2020-11-10
申请号：US16042519
申请日：2018-07-23
Inventor： Shinya Kimura
IPC: G01R31/3842 , G01R31/364 , H01R11/28 , H01R13/66 , H01M10/48 , H01M2/30 , G01R1/20
Abstract: A battery sensor device includes; a bus bar having a resistor and disposed in a power supply path from a battery; a sensor substrate configured to detect current flowing through the resistor; an output end configured to externally output a signal based on current detected by the sensor substrate; and a battery terminal unit configured to electrically couple the bus bar and the battery. A sensor unit including the bus bar and the output end is separate from the battery terminal unit. The sensor unit has a structure capable of being fixed onto the battery terminal unit in two modes in a reverse relation in a plane.
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Patent Agency Ranking
公开(公告)号：US11864362B2
公开(公告)日：2024-01-02
申请号：US17724345
申请日：2022-04-19
Inventor： Atsushi Yamashima , Shinya Kimura
CPC classification number: H05K7/209 , H05K7/20409 , H05K7/20445 , H05K7/20509 , H02M3/003
Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.
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公开(公告)号：US12043130B2
公开(公告)日：2024-07-23
申请号：US17196473
申请日：2021-03-09
Inventor： Shinya Kimura
IPC: H02J7/00 , B60L53/18 , B60L53/302 , H02J7/14
CPC classification number: B60L53/302 , B60L53/18 , B60L2210/30
Abstract: A cooling structure is provided. The cooling structure includes a harness, a board electrically connected to the harness, a heat transfer member whose one end is connected between the harness and the board, the heat transfer member being a member to which heat of the harness is transmitted, and a heat sink connected to the other end of the heat transfer member and configured to radiate heat transmitted to the heat transfer member.
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公开(公告)号：US11855528B2
公开(公告)日：2023-12-26
申请号：US17415562
申请日：2019-12-18
Inventor： Shinya Kimura
IPC: H01L23/36 , H02M3/00 , H01L23/367 , H05K5/00 , H05K7/20
CPC classification number: H02M3/003 , H01L23/3677 , H05K5/0026 , H05K7/209
Abstract: A power conversion apparatus, comprising: a semiconductor component for power conversion; a heat transfer member to which the semiconductor component is fixed such that the heat transfer member is thermally connected to a heat dissipation surface formed on at least one surface of the semiconductor component; and a housing, wherein the housing includes a heat dissipation wall portion, a fitting portion that fits to the heat transfer member is formed on the heat dissipation wall portion at an inside of the housing space, an area of contact between the fitting portion and the heat transfer member is greater than an area of the heat dissipation surface of the semiconductor component, and an occupied area of the fitting portion as seen in plan view is smaller than an area of the at least one surface of the semiconductor component on which the heat dissipation surface is formed.
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公开(公告)号：US11855375B2
公开(公告)日：2023-12-26
申请号：US17389545
申请日：2021-07-30
Inventor： Motohiko Fujimura , Toshihiko Bessho , Eiji Nishimura , Shinya Kimura , Shigeru Nakabayashi , Manabu Egawa , Hiroshi Ogura
CPC classification number: H01R13/112 , H01R12/707 , H01R12/718 , H01R13/055 , H01R13/113 , H02M3/003
Abstract: A power conversion device includes first and second components and pairs of engagement members each including male and female engagement members. The male engagement member includes an insertion part having a substantially flat plate shape. The female engagement member includes first and second clamping parts arranged to be opposed to each other. In each of the pairs of engagement members, the male and female engagement members are respectively arranged on one and another of the first and second components. The first and second components are coupled when the female engagement member clamps the insertion part inserted between the first and second clamping parts in each of the pairs of engagement members. Each of the first and second clamping parts is bent to form a projecting portion toward an opposed surface. A gap is provided at a distal end of each of the first and second clamping parts.
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公开(公告)号：US11330742B2
公开(公告)日：2022-05-10
申请号：US17072917
申请日：2020-10-16
Inventor： Atsushi Yamashima , Shinya Kimura
IPC: H05K7/20
Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.
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