Abstract:
An infrared detection device includes a substrate and a heat-type light sensing element. The substrate has a recess, and a frame positioned around the recess. The heat-type light sensing element has a leg and a sensing unit, and the leg is connected onto the frame so that the sensing unit is positioned over the recess. The heat-type light sensing element includes an intermediate layer provided on the substrate, a first electrode layer provided on the intermediate layer, a sensing layer provided on the first electrode layer, and a second electrode layer provided on the sensing layer. The substrate has a linear thermal expansion coefficient larger than that of the sensing layer. The intermediate layer has a linear thermal expansion coefficient decreasing toward the first electrode layer from the substrate.
Abstract:
An infrared detecting device includes a substrate and a thermal photo detecting element. The substrate includes a concave portion, and a frame portion positioned on the periphery of the concave portion. The thermal photo detecting element includes leg portions and a detecting portion. The leg portions are connected on the frame portion so that the detecting portion is positioned above the concave portion. The thermal photo detecting element includes a first electrode layer disposed on the substrate, a detecting layer disposed on the first electrode layer, and a second electrode layer disposed on the detecting layer. The linear thermal expansion coefficient of the first electrode layer is larger than the linear thermal expansion coefficient of the substrate. The linear thermal expansion coefficient of the substrate is larger than the linear thermal expansion coefficient of the detecting layer.
Abstract:
An infrared ray detecting element includes: a substrate having a cavity; an infrared ray detecting portion including, sequentially stacked, a lower electrode layer, a detection layer, and an upper electrode layer; first and second support portions which support the infrared ray detecting portion above the cavity; and first and second external lead portions for leading electrical signals outputted from the infrared ray detecting portion, to the outside. The first support portion includes, sequentially stacked, a first upper wiring pattern, a first insulating layer, and a first lower wiring pattern. The upper electrode layer is connected to the first external lead portion via the first upper wiring pattern. The second support portion includes, sequentially stacked, a second upper wiring pattern, a second insulating layer, and a second lower wiring pattern. The lower electrode layer is connected to the second external lead portion via the second lower wiring pattern.