LASER PROCESSING APPARATUS
    2.
    发明申请

    公开(公告)号:US20210346984A1

    公开(公告)日:2021-11-11

    申请号:US17232412

    申请日:2021-04-16

    Abstract: A laser processing apparatus includes a light source including a laser oscillator that emits laser light; a power supply that supplies a current to the light source; a deflection unit that is provided on an optical path of the laser light emitted from the light source and includes an optical element that changes an amount of transmission of the laser light to deflect at least a part of the laser light; an optical separation unit that is provided on the optical path of the laser light passing through the deflection unit, shields higher-order light that is included in the laser light and deflected by the optical element in the deflection unit, and transmits zero-order light that is included in the laser light and passes through the deflection unit; and a signal synchronization unit that controls selectively turns on or off the current in synchronization with a timing at which the higher-order light is deflected by the optical element.

    LASER OSCILLATION DEVICE
    3.
    发明申请

    公开(公告)号:US20220173576A1

    公开(公告)日:2022-06-02

    申请号:US17673867

    申请日:2022-02-17

    Abstract: Provided is a laser oscillation device including; a plurality of semiconductor laser diodes (1a to 1e); optical component (5) that directs a plurality of laser beams emitted from the plurality of semiconductor laser diodes in a specific direction to generate a superimposed laser beam including the plurality of laser beams and propagating in the specific direction; and optical switching element (130) that receives the superimposed laser beam from optical component (5). The superimposed laser beam has a plurality of wavelengths.

    SEMICONDUCTOR LASER DEVICE
    5.
    发明申请

    公开(公告)号:US20170149205A1

    公开(公告)日:2017-05-25

    申请号:US15322232

    申请日:2015-07-09

    Abstract: A semiconductor laser device of the present disclosure includes a cooling plate, an insulating sheet, a first cooling block, and a first semiconductor laser element. The conductive cooling plate includes a water supply passage and a drain passage. The insulating sheet is provided to the cooling plate, and includes a first through hole connected to the water supply passage and a second through hole connected to the drain passage. A first cooling block is provided to the insulating sheet, includes therein a first tube connected to the first through hole and the second through hole, and is electrically conductive. The first semiconductor laser element is provided to the first cooling block. The first semiconductor laser element includes a first electrode, and a second electrode opposite to the first electrode. The first electrode is electrically connected to the first cooling block, and the cooling plate is at a floating potential.

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