公开(公告)号：US20240282594A1

公开(公告)日：2024-08-22

申请号：US18564807

申请日：2022-02-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tadashi MAEDA ,  Shingo OKAMURA ,  Yuki YOSHIOKA ,  Tadahiko SAKAI

IPC: H01L21/60

CPC classification number: H01L21/60 ,  H01L2021/6006

Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film 13 in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the plurality of lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the second thermoplastic resin is equal to or lower than the softening point of the first thermoplastic resin.

公开(公告)号：US20240196545A1

公开(公告)日：2024-06-13

申请号：US18550317

申请日：2021-10-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuki YOSHIOKA ,  Tadahiko SAKAI ,  Tadashi MAEDA ,  Shingo OKAMURA

IPC: H05K3/30 ,  B23K1/00 ,  B23K1/20 ,  B23K101/42 ,  C09J11/06 ,  C09J193/04 ,  H05K3/34

CPC classification number: H05K3/305 ,  B23K1/0016 ,  B23K1/20 ,  C09J11/06 ,  C09J193/04 ,  H05K3/3442 ,  B23K2101/42

Abstract: An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.

公开(公告)号：US20240268036A1

公开(公告)日：2024-08-08

申请号：US18565172

申请日：2022-02-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shingo OKAMURA ,  Tadashi MAEDA ,  Yuki YOSHIOKA ,  Tadahiko SAKAI

IPC: H05K3/34 ,  B23K1/00 ,  B23K1/20 ,  B23K101/42

CPC classification number: H05K3/3442 ,  B23K1/0016 ,  B23K1/20 ,  H05K3/3485 ,  H05K3/3489 ,  B23K2101/42 ,  H05K2203/0445

Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film (13) in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.

公开(公告)号：US20240015893A1

公开(公告)日：2024-01-11

申请号：US18043955

申请日：2021-07-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masayuki MANTANI ,  Tadahiko SAKAI ,  Tadashi MAEDA ,  Yuki YOSHIOKA

IPC: H05K3/34 ,  H05K1/18 ,  H05K3/12

CPC classification number: H05K3/3485 ,  H05K1/181 ,  H05K3/3489 ,  H05K3/1275 ,  H05K2203/0195 ,  H05K2203/0143

Abstract: A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land 2 of a substrate 1 includes: a paste disposing step of disposing a solder paste on the land 2; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area 3 coated with solder, on the land 2; a breaking step of breaking a residue covering a surface of the precoated area 3 by pressing a tool 432, 442 against the precoated area 3; a flux disposing step of disposing a flux F on the precoated area 3; a component placement step of placing an electronic component on the substrate 1, with the terminal of the electronic component aligned with the precoated area 3; and a reflow step of heating the substrate 1 to melt the precoated area 3, to solder the terminal to the land 2. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.