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Patent Agency Ranking
1.发明申请ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT MOUNTING STRUCTURE 审中-公开电子元件安装结构及制造电子元器件安装结构的方法公开(公告)号：US20150373845A1
公开(公告)日：2015-12-24
申请号：US14735605
申请日：2015-06-10
Inventor： Yoshiyuki WADA , Tadahiko SAKAI
CPC classification number: H05K3/3436 , H01L2224/16225 , H01L2224/73204 , H01L2224/83192 , H05K3/305 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , Y10T29/49146
Abstract: In an electronic component mounting structure, a plurality of bumps formed on an electronic component is joined to a plurality of electrodes formed on a substrate by way of joining portions formed with the bumps and solder. Bonding portions bond the electronic component to the substrate and the bonding portions are formed of thermosetting materials obtained by curing thermosetting resins having a curing temperature which is lower than a melting point of the solder between the electronic component and the substrate. The thermosetting materials come in contact with a nearest-neighboring joining portion in the bonding portions.
Abstract translation: 在电子部件安装结构中，形成在电子部件上的多个凸块通过与凸点和焊料形成的接合部而接合到形成在基板上的多个电极。 接合部将电子部件粘合到基板上，并且通过固化固化温度低于电子部件和基板之间的焊料的熔点的热固化性树脂而获得的热固性材料形成接合部。 热固性材料与接合部分中最邻近的接合部分接触。
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公开(公告)号：US20240282594A1
公开(公告)日：2024-08-22
申请号：US18564807
申请日：2022-02-21
Inventor： Tadashi MAEDA , Shingo OKAMURA , Yuki YOSHIOKA , Tadahiko SAKAI
IPC: H01L21/60
CPC classification number: H01L21/60 , H01L2021/6006
Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film 13 in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the plurality of lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the second thermoplastic resin is equal to or lower than the softening point of the first thermoplastic resin.
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公开(公告)号：US20240196545A1
公开(公告)日：2024-06-13
申请号：US18550317
申请日：2021-10-07
Inventor： Yuki YOSHIOKA , Tadahiko SAKAI , Tadashi MAEDA , Shingo OKAMURA
IPC: H05K3/30 , B23K1/00 , B23K1/20 , B23K101/42 , C09J11/06 , C09J193/04 , H05K3/34
CPC classification number: H05K3/305 , B23K1/0016 , B23K1/20 , C09J11/06 , C09J193/04 , H05K3/3442 , B23K2101/42
Abstract: An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.
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公开(公告)号：US20240268036A1
公开(公告)日：2024-08-08
申请号：US18565172
申请日：2022-02-21
Inventor： Shingo OKAMURA , Tadashi MAEDA , Yuki YOSHIOKA , Tadahiko SAKAI
IPC: H05K3/34 , B23K1/00 , B23K1/20 , B23K101/42
CPC classification number: H05K3/3442 , B23K1/0016 , B23K1/20 , H05K3/3485 , H05K3/3489 , B23K2101/42 , H05K2203/0445
Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film (13) in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.
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公开(公告)号：US20240015893A1
公开(公告)日：2024-01-11
申请号：US18043955
申请日：2021-07-05
Inventor： Masayuki MANTANI , Tadahiko SAKAI , Tadashi MAEDA , Yuki YOSHIOKA
CPC classification number: H05K3/3485 , H05K1/181 , H05K3/3489 , H05K3/1275 , H05K2203/0195 , H05K2203/0143
Abstract: A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land 2 of a substrate 1 includes: a paste disposing step of disposing a solder paste on the land 2; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area 3 coated with solder, on the land 2; a breaking step of breaking a residue covering a surface of the precoated area 3 by pressing a tool 432, 442 against the precoated area 3; a flux disposing step of disposing a flux F on the precoated area 3; a component placement step of placing an electronic component on the substrate 1, with the terminal of the electronic component aligned with the precoated area 3; and a reflow step of heating the substrate 1 to melt the precoated area 3, to solder the terminal to the land 2. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.
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