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公开(公告)号:US20150282302A1
公开(公告)日:2015-10-01
申请号:US14668819
申请日:2015-03-25
Inventor: Takashi HOSHI , Hiroharu INOUE , Takeshi KITAMURA
CPC classification number: H05K1/0271 , B32B5/024 , B32B5/26 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/202 , B32B2307/51 , B32B2307/54 , B32B2457/08 , C08J5/24 , C08J2363/00 , C08J2433/00 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/0209 , H05K2201/029 , Y10T442/2361 , Y10T442/3455
Abstract: A prepreg containing: a resin composition; and a woven fabric base material. The resin composition contains: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic curing agent having a naphthalene skeleton; (B) a high molecular weight compound having at least structures represented by formulae (1) and (2 ) or at least a structure represented by the formula (2), no unsaturated bond between carbon atoms, and a weight-average molecular weight of 250,000 to 850,000; and (C) an inorganic filler. (C) The inorganic filler is subjected to surface treatment with a silane coupling agent represented by a formula (3).
Abstract translation: 一种预浸料,其包含:树脂组合物; 和织物基材。 树脂组合物含有:(A)具有萘骨架的环氧树脂和具有萘骨架的酚类固化剂中的至少一种; (B)至少具有由式(1)和(2)表示的结构或至少由式(2)表示的结构的高分子量化合物,碳原子之间不饱和键和重均分子量 25万至85万; 和(C)无机填料。 (C)用式(3)表示的硅烷偶联剂对无机填料进行表面处理。