公开(公告)号：US20230257540A1

公开(公告)日：2023-08-17

申请号：US18012583

申请日：2021-07-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tomoyuki AOKI ,  Akihiro YAMAUCHI ,  Eiichiro SAITO

IPC: C08J5/24 ,  C08J5/18 ,  H05K1/18 ,  H05K1/03 ,  B29B11/16

CPC classification number: C08J5/244 ,  C08J5/18 ,  H05K1/182 ,  H05K1/0366 ,  B29B11/16 ,  C08J2363/00 ,  C08J2463/00 ,  B29K2101/10

Abstract: A resin sheet according to the present disclosure includes an uncured product or semi-cured product of a thermosetting resin composition. A melt viscosity of the resin sheet is equal to or greater than 10 Pa·s and equal to or less than 2000 Pa·s when measured using a Koka flow tester under a measuring condition including 130° C. and 1 MPa and is equal to or greater than 6 Pa·s and equal to or less than 1200 Pa·s when measured using the Koka flow tester under a measuring condition including 130° C. and 4 MPa.

公开(公告)号：US20180376579A1

公开(公告)日：2018-12-27

申请号：US16072680

申请日：2017-01-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ,  TOMOEGAWA CO., LTD.

Inventor： Hiroaki TAKAHASHI ,  Tomoyuki AOKI ,  Kiyotaka KOMORI ,  Jun TOCHIHIRA ,  Ryu HARADA

IPC: H05K1/02 ,  H05K1/09 ,  H01B1/02 ,  H01B3/42 ,  H01B3/30

Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.

公开(公告)号：US20230101791A1

公开(公告)日：2023-03-30

申请号：US17800109

申请日：2021-02-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kouichi AOKI ,  Tomoyuki AOKI

IPC: C08L71/12 ,  C08L9/06 ,  B32B15/08 ,  C08L57/10

Abstract: A thermosetting resin composition contains an ethylene-propylene-diene copolymer (A), a terminal-modified polyphenylene ether compound (B), an inorganic filler (C), a styrene-based elastomer (D), and a fibrous filler (E).

公开(公告)号：US20220098404A1

公开(公告)日：2022-03-31

申请号：US17426917

申请日：2020-01-30

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kouichi AOKI ,  Tomoyuki AOKI ,  Eiichiro SAITO

IPC: C08L71/12

Abstract: The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.