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公开(公告)号:US20190061320A1
公开(公告)日:2019-02-28
申请号:US16072715
申请日:2017-01-24
发明人: Yohsuke ISHIKAWA , Yoshiaki ESAKI , Takayoshi OZEKI , Jun TOCHIHIRA , Ryu HARADA
IPC分类号: B32B15/088 , B32B15/08 , B32B27/08 , B32B27/28 , B32B27/32 , B32B27/42 , B32B27/34 , B32B15/20 , H05K1/03
摘要: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.
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公开(公告)号:US20180376579A1
公开(公告)日:2018-12-27
申请号:US16072680
申请日:2017-01-24
发明人: Hiroaki TAKAHASHI , Tomoyuki AOKI , Kiyotaka KOMORI , Jun TOCHIHIRA , Ryu HARADA
摘要: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.
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3.
公开(公告)号:US20210176854A1
公开(公告)日:2021-06-10
申请号:US17172769
申请日:2021-02-10
发明人: Hiroaki TAKAHASHI , Kiyotaka KOMORI , Masaya KOYAMA , Jun TOCHIHIRA , Ryu HARADA
IPC分类号: H05K1/02 , B32B27/20 , B32B27/32 , B32B15/08 , H05K1/03 , H05K3/02 , B32B15/085 , B32B15/20 , H05K3/46
摘要: A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.
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4.
公开(公告)号:US20180270945A1
公开(公告)日:2018-09-20
申请号:US15542766
申请日:2016-01-05
发明人: Hiroaki TAKAHASHI , Kiyotaka KOMORI , Masaya KOYAMA , Jun TOCHIHIRA , Ryu HARADA
CPC分类号: H05K1/024 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/20 , B32B27/32 , B32B2270/00 , B32B2307/202 , B32B2307/206 , B32B2457/08 , H05K1/036 , H05K1/0373 , H05K1/0393 , H05K3/022 , H05K3/4673 , H05K2201/0133 , H05K2201/0141 , H05K2201/0158 , H05K2201/0195
摘要: A multilayer printed wiring board including one or more insulating layers and at least one conductive layer which are stacked alternately is disclosed. The one or more insulating layers include at least one liquid crystal polymer resin layer so that each of the one or more insulating layers includes at least one layer selected from a group consisting of at least one polyolefin resin layer and the at least one liquid crystal polymer resin layer. A percentage by volume of the at least one liquid crystal polymer resin layer relative to the one or more insulating layers is within a range of 5 to 90%.
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