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公开(公告)号:US20230101791A1
公开(公告)日:2023-03-30
申请号:US17800109
申请日:2021-02-15
Inventor: Kouichi AOKI , Tomoyuki AOKI
Abstract: A thermosetting resin composition contains an ethylene-propylene-diene copolymer (A), a terminal-modified polyphenylene ether compound (B), an inorganic filler (C), a styrene-based elastomer (D), and a fibrous filler (E).
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公开(公告)号:US20220098404A1
公开(公告)日:2022-03-31
申请号:US17426917
申请日:2020-01-30
Inventor: Kouichi AOKI , Tomoyuki AOKI , Eiichiro SAITO
IPC: C08L71/12
Abstract: The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.
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公开(公告)号:US20210235580A1
公开(公告)日:2021-07-29
申请号:US17050624
申请日:2019-04-22
Inventor: Akihiro YAMAUCHI , Eiichiro SAITO , Kouichi AOKI
IPC: H05K1/03 , B32B15/08 , H05K7/20 , H01L23/373
Abstract: A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.
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公开(公告)号:US20240301173A1
公开(公告)日:2024-09-12
申请号:US18665379
申请日:2024-05-15
Inventor: Kouichi AOKI
IPC: C08K9/04 , B32B15/06 , B32B15/20 , B32B25/02 , B32B25/08 , B32B25/16 , B32B27/28 , C08J5/18 , C08K3/36 , C08L23/16 , H05K1/03 , H05K3/02
CPC classification number: C08K9/04 , B32B15/06 , B32B15/20 , B32B25/02 , B32B25/08 , B32B25/16 , B32B27/285 , C08J5/18 , C08K3/36 , C08L23/16 , H05K1/036 , B32B2264/102 , B32B2307/206 , B32B2457/08 , C08J2323/16 , C08J2423/16 , C08L2203/202 , C08L2205/025 , H05K3/022 , H05K2201/0195
Abstract: A resin sheet includes a dried product or semi-cured product of a thermosetting composition, the thermosetting composition including an ethylene-propylene-diene copolymer as Component (A); and an inorganic filler, as Component (B), surface-treated with a surface treatment agent having a polymerizable unsaturated bond.
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5.
公开(公告)号:US20200207953A1
公开(公告)日:2020-07-02
申请号:US16634771
申请日:2018-07-31
Inventor: Kouichi AOKI
IPC: C08K9/04 , H05K1/03 , C08K3/36 , C08J5/18 , C08L23/16 , B32B15/06 , B32B15/20 , B32B27/28 , B32B25/08 , B32B25/16 , B32B25/02
Abstract: A thermosetting composition according to the present disclosure contains: an ethylene-propylene-diene copolymer as Component (A); and an inorganic filler, as Component (B), surface-treated with a surface treatment agent having a polymerizable unsaturated bond.
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公开(公告)号:US20220372245A1
公开(公告)日:2022-11-24
申请号:US17771079
申请日:2020-10-21
Inventor: Akihiro YAMAUCHI , Eiichiro SAITO , Nobuo SHIBATA , Kouichi AOKI
Abstract: A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B1); and a second filler (B2) of a nanometer scale having a smaller particle size than the first filler (B1). The first filler (B1) includes an anhydrous magnesium carbonate filler (b1) and an alumina filler (b2). The proportion of the first filler (B1) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B2) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.
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公开(公告)号:US20220127432A1
公开(公告)日:2022-04-28
申请号:US17572225
申请日:2022-01-10
Inventor: Kouichi AOKI
IPC: C08K9/04 , B32B15/06 , B32B15/20 , B32B25/02 , B32B25/08 , B32B25/16 , B32B27/28 , C08J5/18 , C08K3/36 , C08L23/16 , H05K1/03
Abstract: A resin sheet includes a dried product or semi-cured product of a thermosetting composition, the thermosetting composition including an ethylene-propylene-diene copolymer as Component (A), and an inorganic filler that is surface-treated with a surface treatment agent having a polymerizable unsaturated bond as Component (B).
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