Abstract:
Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.
Abstract:
A nonwoven fabric includes a fiber including a first portion and a second portion connected to the first portion. A first fiber diameter of the first portion is smaller than a reference fiber diameter. A second fiber diameter of the second portion is equal to or greater than the reference fiber diameter. The reference fiber diameter is smaller than 1 μm. A ratio of a maximum fiber diameter of the second portion to a length of a linear line connecting both end portions of the second portion is from 1/10 to 1/3.
Abstract:
Provided is an in vitro diagnostic tool configured to quantitatively or qualitatively detect a suspected substance in a test solution, the tool including: a first porous layer having a first surface and a second surface; a base sheet bonded to the first surface; a second porous layer bonded to the second surface; and a reagent configured to react with the suspected substance and carried in at least a part of the second porous layer, wherein: the first porous layer has a matrix structure of first nanofibers formed by electrostatic spinning; the second porous layer has a matrix structure of second nanofibers formed by electrostatic spinning; and a fiber diameter of the second nanofibers is smaller than a fiber diameter of the first nanofibers.
Abstract:
Provided is an in vitro diagnostic tool configured to quantitatively or qualitatively detect a suspected substance in a test solution, the tool including: a first porous layer having a first surface and a second surface; a base sheet bonded to the first surface; a second porous layer bonded to the second surface; and a reagent configured to react with the suspected substance and carried in at least a part of the second porous layer, wherein: the first porous layer has a matrix structure of first nanofibers formed by electrostatic spinning; the second porous layer has a matrix structure of second nanofibers formed by electrostatic spinning; and a fiber diameter of the second nanofibers is smaller than a fiber diameter of the first nanofibers.
Abstract:
Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.