ANTENNA DEVICE
    2.
    发明申请
    ANTENNA DEVICE 审中-公开

    公开(公告)号:US20190165460A1

    公开(公告)日:2019-05-30

    申请号:US16198908

    申请日:2018-11-23

    Abstract: An antenna device that includes a housing formed with an window surface and transmits and receives an electromagnetic wave through a cover member facing the window surface, comprises: a transmitting antenna that is provided inside the housing and transmits the electromagnetic wave to a side of the cover member; a receiving antenna that receives the electromagnetic wave; a circuit board that extends along a transmission direction of the electromagnetic wave and includes a board surface provided with the transmitting antenna and the receiving antenna; and a dielectric lens covering the window surface that narrows a beam of the electromagnetic wave transmitted from the transmitting antenna to transmit the beam outside the housing and collects the electromagnetic wave from outside the housing to transmit the electromagnetic wave to the receiving antenna.

    ARRAY ANTENNA DEVICE
    3.
    发明申请
    ARRAY ANTENNA DEVICE 审中-公开
    阵列天线设备

    公开(公告)号:US20160248159A1

    公开(公告)日:2016-08-25

    申请号:US14975624

    申请日:2015-12-18

    Abstract: An array antenna device of this disclosure includes a substrate, a strip conductor with a linear-shape, which is provided on the substrate, and a power feeder that feeds power to the strip conductor, and a plurality of loop elements, a conductor plate, and a plurality of feeding elements. The plurality of loop elements are provided on a first surface of the substrate, and are located along the strip conductor with a specified spacing from each other. Each of the plurality of loop elements has a loop-shape with a notch. The plurality of feeding elements are connected to the strip conductor, and each has a shape extending along a portion of an outer edge of corresponding one of the plurality of loop elements. The conductor plate is provided on a second surface of the substrate.

    Abstract translation: 本公开的阵列天线装置包括基板,设置在基板上的线状的带状导体和向带状导体供电的馈电器,以及多个环路元件,导体板, 和多个进给元件。 所述多个环形元件设置在所述基板的第一表面上,并且沿着所述带状导体以彼此间隔一定间隔设置。 多个环形元件中的每一个都具有带凹口的环形。 多个馈送元件连接到带状导体,并且每个馈电元件具有沿着多个环形元件中相应的一个环形元件的外边缘的一部分延伸的形状。 导体板设置在基板的第二表面上。

    ANTENNA DEVICE AND RADIO DEVICE
    4.
    发明申请

    公开(公告)号:US20190386395A1

    公开(公告)日:2019-12-19

    申请号:US16379849

    申请日:2019-04-10

    Abstract: An antenna device includes: a first antenna that is provided on a board and forms a main lobe in a first direction along a plane of the board; a second antenna that is provided on the board and forms a main lobe in a second direction along the plane of the board, the second direction forming an angle of greater than 90 degrees and equal to or less than 180 degrees with respect to the first direction; a first reflecting mirror that changes a traveling direction of radio waves radiated in the first direction from the first antenna into a third direction; and a second reflecting mirror that changes a traveling direction of radio waves entering from a fourth direction into the second direction.

    HIGH FREQUENCY MODULE
    6.
    发明申请
    HIGH FREQUENCY MODULE 审中-公开
    高频模块

    公开(公告)号:US20150234003A1

    公开(公告)日:2015-08-20

    申请号:US14702633

    申请日:2015-05-01

    Abstract: A high frequency module includes a module board, a connection member, and test terminals. The module board has a first surface on which a transmit antenna and a receive antenna are provided and a second surface on which a signal processing IC is provided, the second surface of the module board being the opposite side of the first surface. The connection member contains wiring for connecting the signal processing IC disposed on the second surface of the module board with another board. The test terminals are connected with the signal processing IC disposed on the second surface of the module board and arranged on the first surface of the module board.

    Abstract translation: 高频模块包括模块板,连接构件和测试端子。 模块板具有设置发射天线和接收天线的第一表面和设置有信号处理IC的第二表面,模块板的第二表面是与第一表面相反的一侧。 连接构件包含用于将布置在模块板的第二表面上的信号处理IC与另一个板连接的布线。 测试端子与设置在模块板的第二表面上的信号处理IC连接,并布置在模块板的第一表面上。

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