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16 条记录 (耗时 0.023 秒)

    Check valve package for Pb-free, single piece electronic modules
    4.
    发明授权
    Check valve package for Pb-free, single piece electronic modules 有权
    止回阀包装，用于无铅，单件电子模块

    公开(公告)号：US07675149B1

    公开(公告)日：2010-03-09

    申请号：US11520469

    申请日：2006-09-12

    申请人： Patrick Clement Strittmatter ,  Joseph P. Hundt ,  Steven N. Hass

    发明人： Patrick Clement Strittmatter ,  Joseph P. Hundt ,  Steven N. Hass

    IPC分类号： H01L23/02

    CPC分类号： H01L23/564 ,  H01L23/055 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Check valve package for pb-free, single piece electronic modules, the package having an exterior and an interior, and at least one electronic device mounted within the interior of the package electrically connected to a lead-free solder ball grid array on a surface of the package, the package having a check valve between the interior and exterior of the package configured to allow flow from the interior to the exterior and to prevent flow form the exterior to the interior. The package withstands the solder reflow temperatures for the reflow of the pb-free solder balls of a ball grid array packaging of an NVSRAM during mounting on a circuit board. The package is suitable for packaging circuits containing rechargeable batteries and for packaging other electronic devices.

    摘要翻译： 止回阀包装，用于无铅单片电子模块，该封装具有外部和内部，以及安装在封装内部的至少一个电子器件，其电连接到无铅焊球栅格阵列的表面上 所述包装件在所述包装件的内部和外部之间具有止回阀，所述止回阀被构造成允许从内部流动到外部并且防止从外部流到内部。 该封装可承受焊锡回流温度，用于在安装在电路板上时NVSRAM的球栅阵列封装的无pb焊球的回流。 该封装适用于包含可再充电电池和包装其他电子设备的封装电路。

    Low profile electrical connector
    5.
    发明授权
    Low profile electrical connector 有权
    薄型电连接器

    公开(公告)号：US08834208B2

    公开(公告)日：2014-09-16

    申请号：US13251730

    申请日：2011-10-03

    申请人： Patrick Clement Strittmatter ,  Devin Bertrum Pauley

    发明人： Patrick Clement Strittmatter ,  Devin Bertrum Pauley

    IPC分类号： H01R24/04 ,  H01R13/50 ,  H01R43/20 ,  H01R13/33 ,  H01R24/58 ,  H01R24/76

    CPC分类号： H01R43/20 ,  H01R13/33 ,  H01R13/50 ,  H01R24/58 ,  H01R24/76 ,  Y10T29/49208

    摘要： An electrical device has a socket formed as a continuous integral portion of an outer case housing. Conductors connect an interior of the socket to circuits within the device, and may be integrally molded with the outer case housing. Separate case housings may be assembled together to form the socket. A resulting socket has a lower profile and a reduced impact to a height requirement within the case, and has a relatively greater strength attributable to the inherent robustness of the case.

    摘要翻译： 电气设备具有形成为外壳体的连续整体部分的插座。 导体将插座的内部连接到设备内的电路，并且可以与外壳体一体地模制。 单独的外壳可以组装在一起形成插座。 所产生的插座具有较低的外形和对壳体内的高度要求的减小的冲击，并且具有归因于壳体的固有坚固性的相对较大的强度。

    Piezoelectric assembly
    6.
    发明授权
    Piezoelectric assembly 有权
    压电组件

    公开(公告)号：US08618720B2

    公开(公告)日：2013-12-31

    申请号：US12895953

    申请日：2010-10-01

    申请人： Todd Robert Paleczny ,  Arnett Ryan Weber ,  Dietmar Frank Wennemer ,  Cameron Russell Steeves ,  Patrick Clement Strittmatter

    发明人： Todd Robert Paleczny ,  Arnett Ryan Weber ,  Dietmar Frank Wennemer ,  Cameron Russell Steeves ,  Patrick Clement Strittmatter

    IPC分类号： H01L41/047

    CPC分类号： G06F3/044 ,  G06F3/016 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/0926 ,  H01L41/0986

    摘要： A piezoelectric assembly is described. In accordance with one embodiment, there is provided a piezoelectric assembly comprising: an electrode assembly; a signal electrical connector electrically connected to the electrode assembly; a reference electrical connector electrically connected to the electrode assembly; and a spacer positioned about a perimeter of the electrode assembly and disposed between the signal electrical connector and the reference electrical connector such that no electrical communication is provided between the signal electrical connector and the reference electrical connector through the spacer; wherein a humidity barrier space is defined between the signal electrical connector, the reference electrical connector and the spacer, and wherein the electrode assembly is disposed in the humidity barrier space.

    摘要翻译： 描述了压电组件。 根据一个实施例，提供了一种压电组件，包括：电极组件; 电连接到所述电极组件的信号电连接器; 电连接到电极组件的参考电连接器; 以及围绕所述电极组件的周边定位并且设置在所述信号电连接器和所述参考电连接器之间的间隔件，使得在所述信号电连接器和所述参考电连接器之间不通过所述间隔件提供电连通; 其中在所述信号电连接器，所述参考电连接器和所述间隔件之间限定湿气屏障空间，并且其中所述电极组件设置在所述湿度屏障空间中。

    Check valve package for PB-free, single piece electronic modules
    8.
    发明授权
    Check valve package for PB-free, single piece electronic modules 有权
    止回阀包装，用于无PB，单件电子模块

    公开(公告)号：US08088646B1

    公开(公告)日：2012-01-03

    申请号：US12692383

    申请日：2010-01-22

    申请人： Patrick Clement Strittmatter ,  Joseph P. Hundt ,  Steven N. Hass

    发明人： Patrick Clement Strittmatter ,  Joseph P. Hundt ,  Steven N. Hass

    IPC分类号： H01L21/44

    CPC分类号： H01L23/564 ,  H01L23/055 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Check valve package for pb-free, single piece electronic modules, the package having an exterior and an interior, and at least one electronic device mounted within the interior of the package electrically connected to a lead-free solder ball grid array on a surface of the package, the package having a check valve between the interior and exterior of the package configured to allow flow from the interior to the exterior and to prevent flow form the exterior to the interior. The package withstands the solder reflow temperatures for the reflow of the pb-free solder balls of a ball grid array packaging of an NVSRAM during mounting on a circuit board. The package is suitable for packaging circuits containing rechargeable batteries and for packaging other electronic devices.

    摘要翻译： 止回阀包装，用于无铅单片电子模块，该封装具有外部和内部，以及安装在封装内部的至少一个电子器件，其电连接到无铅焊球栅格阵列的表面上 所述包装件在所述包装件的内部和外部之间具有止回阀，所述止回阀被构造成允许从内部流动到外部并且防止从外部流到内部。 该封装可承受焊锡回流温度，用于在安装在电路板上时NVSRAM的球栅阵列封装的无pb焊球的回流。 该封装适用于包含可再充电电池和包装其他电子设备的封装电路。