公开(公告)号：US6058012A

公开(公告)日：2000-05-02

申请号：US67071

申请日：1998-04-27

申请人： Patrick R. Cooper ,  William C. Hallowell ,  Mark S. Tracy ,  Curtis Progl ,  Minh H. Nguyen

发明人： Patrick R. Cooper ,  William C. Hallowell ,  Mark S. Tracy ,  Curtis Progl ,  Minh H. Nguyen

IPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/40 ,  H05K7/20

CPC分类号： G06F1/203 ,  G06F1/206 ,  H01L23/34 ,  H01L23/4006 ,  H05K7/20727 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002

摘要： A thermal management controller to regulate the operating temperature of high speed, high circuit density semiconductor dice in an electronic product. The thermal management controller monitors the temperature of a heat sink in thermal contact with the high speed, high circuit density semiconductor dice and also monitors the operational status of one or more specified devices which may increase the heat load within the electronic product. As the temperature of the heat sink increases and/or as specified devices increase the heat load in the electronic product, the thermal management controller will start cooling fans and/or increases the speed of the cooling fans to increase heat removal from the electronic product by forced convection. As the temperature of the heat sink decreases and/or as specified devices cease contributing to the heat load in the electronic product, the thermal management controller will decrease the speed of the cooling fans and/or turn off the cooling fans to decrease heat removal from the electronic product. If the temperature of the heat sink rises above a predetermined temperature, the thermal management structure will reduce the clock speed of the semiconductor dice. If the temperature of the heat sink rises above a predetermined maximum temperature, the thermal management structure will turn of the semiconductor dice.

摘要翻译： 一种用于调节电子产品中高速，高电路密度半导体晶片的工作温度的热管理控制器。 热管理控制器监测与高速，高电路密度半导体管芯热接触的散热器的温度，并且还监视可增加电子产品内的热负荷的一个或多个指定装置的操作状态。 随着散热器的温度升高和/或如指定的装置增加电子产品中的热负荷，热管理控制器将启动冷却风扇和/或增加冷却风扇的速度以增加从电子产品的热量去除 强制对流 随着散热器的温度降低和/或如指定的设备停止对电子产品中的热负荷的贡献，热管理控制器将降低冷却风扇的速度和/或关闭冷却风扇以减少从 电子产品。 如果散热器的温度升高到预定温度以上，则热管理结构将降低半导体晶片的时钟速度。 如果散热器的温度升高到预定的最高温度以上，则热管理结构将转向半导体晶片。

公开(公告)号：US09488359B2

公开(公告)日：2016-11-08

申请号：US13430478

申请日：2012-03-26

申请人： Long Larry Le ,  Curtis Progl ,  James Michael Lay ,  Hattie Blackwell ,  Malcolm D. James, Sr. ,  Michael D. Poncheri ,  Jason Taylor

发明人： Long Larry Le ,  Curtis Progl ,  James Michael Lay ,  Ronald Blackwell ,  Malcolm D. James, Sr. ,  Michael D. Poncheri ,  Jason Taylor

IPC分类号： F21V29/00 ,  F21V29/58 ,  F21V29/71 ,  F21V3/00 ,  F21Y101/00

CPC分类号： F21V29/59 ,  F21V3/00 ,  F21V29/006 ,  F21V29/717 ,  F21Y2101/00 ,  F21Y2115/10

摘要： Heat management devices and structures are disclosed that can be used in lamps having solid state light sources such as one or more LEDs. Some lamp embodiments comprise one or more phase change radiators that utilize the latent heat of fluids to circulate and draw heat away from the LEDs and radiate the heat into the ambient, allowing for the LEDs to operate at a lower temperature. Some phase change radiators according to the present invention can comprise a main radiator body and multiple radiator coolant loops mounted to the body. The present invention relies on the circulation of heated fluid through the radiator body to radiate heat from the LEDs. The heated liquid moves away from the LEDs and is circulated back to thermal contact with the LEDs thought the coolant loops.

摘要翻译： 公开了可用于具有固态光源（例如一个或多个LED）的灯的热管理装置和结构。 一些灯实施例包括一个或多个相变辐射器，其利用流体的潜热循环并将热量从LED中散热并将热量辐射到环境中，从而允许LED在较低的温度下工作。 根据本发明的一些相变辐射器可以包括主散热器主体和安装到主体的多个散热器冷却剂回路。 本发明依赖于通过散热器主体的加热流体的循环以辐射来自LED的热量。 被加热的液体远离LED移动，并循环回热量，认为冷却剂循环。