公开(公告)号：US20140091909A1

公开(公告)日：2014-04-03

申请号：US13632745

申请日：2012-10-01

申请人： Patrick SMITH ,  Criswell CHOI ,  James Montague CLEEVES ,  Vivek SUBRAMANIAN ,  Arvind KAMATH ,  Steven MOLESA

发明人： Patrick SMITH ,  Criswell CHOI ,  James Montague CLEEVES ,  Vivek SUBRAMANIAN ,  Arvind KAMATH ,  Steven MOLESA

IPC分类号： G06K7/01 ,  H01G7/00 ,  G06K19/077

CPC分类号： H01G4/40 ,  H01G4/38

摘要： The present invention relates to surveillance and/or identification devices having capacitors connected in parallel or in series, and methods of making and using such devices. Devices with capacitors connected in parallel, where one capacitor is fabricated with a relatively thick capacitor dielectric and another is fabricated with a relatively thin capacitor dielectric achieve both a high-precision capacitance and a low breakdown voltage for relatively easy surveillance tag deactivation. Devices with capacitors connected in series result in increased lateral dimensions of a small capacitor. This makes the capacitor easier to fabricate using techniques that may have relatively limited resolution capabilities.

摘要翻译： 本发明涉及具有并联或串联连接的电容器的监视和/或识别装置以及制造和使用这些装置的方法。 具有并联连接电容器的器件，其中一个电容器用相对较厚的电容器电介质制造，另一个电容器由相对薄的电容器电介质制成，实现了高精度电容和低击穿电压，以便相对容易的监视标签去激活。 具有串联连接的电容器的装置增加了小电容器的横向尺寸。 这使得使用可能具有相对有限的分辨能力的技术来制造电容器更容易。

公开(公告)号：US20170098508A1

公开(公告)日：2017-04-06

申请号：US15385727

申请日：2016-12-20

申请人： Arvind KAMATH ,  Criswell CHOI ,  Patrick SMITH ,  Erik SCHER ,  Jiang LI

发明人： Arvind KAMATH ,  Criswell CHOI ,  Patrick SMITH ,  Erik SCHER ,  Jiang LI

IPC分类号： H01G4/40 ,  H01L23/66 ,  H01G4/12 ,  H01Q1/38 ,  H01G4/008 ,  H01G4/01 ,  H01G4/224 ,  H01Q1/22 ,  H01L49/02 ,  H01G4/30

CPC分类号： H01G4/40 ,  H01G4/002 ,  H01G4/005 ,  H01G4/008 ,  H01G4/01 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/224 ,  H01G4/30 ,  H01G4/306 ,  H01G4/33 ,  H01G13/00 ,  H01L23/66 ,  H01L27/016 ,  H01L28/60 ,  H01L2223/6677 ,  H01Q1/22 ,  H01Q1/2283 ,  H01Q1/38 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49016

摘要： High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.

公开(公告)号：US20150146345A1

公开(公告)日：2015-05-28

申请号：US14613178

申请日：2015-02-03

申请人： Arvind KAMATH ,  Criswell CHOI ,  Patrick SMITH ,  Erik SCHER ,  Jiang LI

发明人： Arvind KAMATH ,  Criswell CHOI ,  Patrick SMITH ,  Erik SCHER ,  Jiang LI

IPC分类号： H01G4/10 ,  H01Q1/22 ,  H01G4/005 ,  H01G4/30

CPC分类号： H01G4/40 ,  H01G4/002 ,  H01G4/005 ,  H01G4/008 ,  H01G4/01 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/224 ,  H01G4/30 ,  H01G4/306 ,  H01G4/33 ,  H01G13/00 ,  H01L23/66 ,  H01L27/016 ,  H01L28/60 ,  H01L2223/6677 ,  H01Q1/22 ,  H01Q1/2283 ,  H01Q1/38 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49016

摘要： High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.

摘要翻译： 高精度电容器及其形成方法采用精确且高度保形的沉积工艺，用于在各种粗糙度和组成的基底上沉积绝缘层。 该方法通常包括以下步骤：通过原子层沉积（ALD）在金属衬底上沉积第一绝缘层; （b）在所述第一绝缘层上形成第一电容器电极; 和（c）在所述第一绝缘层上形成第二绝缘层，并且在所述第一电容器电极上或与所述第一电容器电极相邻。 实施例提供了一种改进的沉积工艺，其在宽范围的衬底上产生高度保形的绝缘层，从而产生改进的电容器。

公开(公告)号：US20150129667A1

公开(公告)日：2015-05-14

申请号：US14599972

申请日：2015-01-19

申请人： Vikram PAVATE ,  Criswell CHOI

发明人： Vikram PAVATE ,  Criswell CHOI

IPC分类号： G06K19/077 ,  H01Q1/22

CPC分类号： G06K19/07783 ,  G06K19/07749 ,  H01Q1/2208 ,  H01Q1/2225 ,  H01Q7/00 ,  H01Q23/00 ,  Y10T29/49018

摘要： Wireless devices such as sensors, interactive displays and electronic article surveillance (EAS) and/or radio frequency identification (RFID) tags including integrated circuitry and an antenna and/or inductor printed thereon, and methods for making and using the same, are disclosed. The device generally includes an integrated circuit on a substrate and an antenna, directly on the substrate and/or the integrated circuit, in electrical communication with the integrated circuit. The method of making a wireless device generally includes forming an integrated circuit on the substrate and printing at least part of an antenna or antenna precursor layer on the integrated circuit and/or substrate. The present invention advantageously provides a low cost wireless device capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional devices.

摘要翻译： 公开了诸如传感器，交互式显示器和电子物品监视（EAS）和/或射频识别（RFID）标签的无线设备，包括集成电路和印刷在其上的天线和/或电感器，以及用于制造和使用它们的方法。 该装置通常包括基板上的集成电路和直接在基板和/或集成电路上与集成电路电连通的天线。 制造无线设备的方法通常包括在基板上形成集成电路并且在集成电路和/或基板上印刷天线或天线前体层的至少一部分。 本发明有利地提供了能够以比常规设备更短的时间周期制造的MHz频率的低成本无线设备。