公开(公告)号：US20100067781A1

公开(公告)日：2010-03-18

申请号：US12626021

申请日：2009-11-25

申请人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

发明人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

IPC分类号： G06K9/00

CPC分类号： G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8864 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

摘要翻译： 一种用于分析衬底上的缺陷信息的方法，包括将衬底逻辑划分为区域，以及检测衬底上的缺陷以产生缺陷信息。 在逐个区域的基础上分析来自基板的缺陷信息，以产生每个区域内的缺陷的缺陷水平分类。 根据至少一种分析方法分析区域缺陷水平分类。 缺陷级分类优选地从由食谱指定的一组缺陷级别分类中选择。 优选地，所述至少一个分析方法包括区域缺陷分布，自动缺陷分类，空间签名分析和偏移检测中的至少一个。 缺陷级分类优选地包括个体缺陷，缺陷簇和空间签名分析签名中的至少一个。 在一个实施例中，在检测到衬底上的缺陷之后，将缺陷信息在逻辑上划分为可配置区域。

公开(公告)号：US07394534B1

公开(公告)日：2008-07-01

申请号：US10717403

申请日：2003-11-19

申请人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

发明人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

IPC分类号： G01N21/00

CPC分类号： G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8864 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

摘要翻译： 一种用于分析衬底上的缺陷信息的方法，包括将衬底逻辑划分为区域，以及检测衬底上的缺陷以产生缺陷信息。 在逐个区域的基础上分析来自基板的缺陷信息，以产生每个区域内的缺陷的缺陷水平分类。 根据至少一种分析方法分析区域缺陷水平分类。 缺陷级分类优选地从由食谱指定的一组缺陷级别分类中选择。 优选地，所述至少一个分析方法包括区域缺陷分布，自动缺陷分类，空间签名分析和偏移检测中的至少一个。 缺陷级分类优选地包括个体缺陷，缺陷簇和空间签名分析签名中的至少一个。 在一个实施例中，在检测到衬底上的缺陷之后，将缺陷信息在逻辑上划分为可配置区域。

公开(公告)号：US20110137576A1

公开(公告)日：2011-06-09

申请号：US13024471

申请日：2011-02-10

申请人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

发明人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

IPC分类号： G06F19/00

CPC分类号： G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8864 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

摘要翻译： 一种用于分析衬底上的缺陷信息的方法，包括将衬底逻辑划分为区域，以及检测衬底上的缺陷以产生缺陷信息。 在逐个区域的基础上分析来自基板的缺陷信息，以产生每个区域内的缺陷的缺陷水平分类。 根据至少一种分析方法分析区域缺陷水平分类。 缺陷级分类优选地从由食谱指定的一组缺陷级别分类中选择。 优选地，所述至少一个分析方法包括区域缺陷分布，自动缺陷分类，空间签名分析和偏移检测中的至少一个。 缺陷级分类优选地包括个体缺陷，缺陷簇和空间签名分析签名中的至少一个。 在一个实施例中，在检测到衬底上的缺陷之后，将缺陷信息在逻辑上划分为可配置区域。

公开(公告)号：US07646476B2

公开(公告)日：2010-01-12

申请号：US12117823

申请日：2008-05-09

申请人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

发明人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

IPC分类号： G01N21/00

CPC分类号： G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8864 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

摘要翻译： 一种用于分析衬底上的缺陷信息的方法，包括将衬底逻辑划分为区域，以及检测衬底上的缺陷以产生缺陷信息。 在逐个区域的基础上分析来自基板的缺陷信息，以产生每个区域内的缺陷的缺陷水平分类。 根据至少一种分析方法分析区域缺陷水平分类。 缺陷级分类优选地从由食谱指定的一组缺陷级别分类中选择。 优选地，所述至少一个分析方法包括区域缺陷分布，自动缺陷分类，空间签名分析和偏移检测中的至少一个。 缺陷级分类优选地包括个体缺陷，缺陷簇和空间签名分析签名中的至少一个。 在一个实施例中，在检测到衬底上的缺陷之后，将缺陷信息在逻辑上划分为可配置区域。

公开(公告)号：US08289510B2

公开(公告)日：2012-10-16

申请号：US13024471

申请日：2011-02-10

申请人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

发明人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

IPC分类号： G01N21/00

CPC分类号： G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8864 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

摘要翻译： 一种用于分析衬底上的缺陷信息的方法，包括将衬底逻辑划分为区域，以及检测衬底上的缺陷以产生缺陷信息。 在逐个区域的基础上分析来自基板的缺陷信息，以产生每个区域内的缺陷的缺陷水平分类。 根据至少一种分析方法分析区域缺陷水平分类。 缺陷级分类优选地从由食谱指定的一组缺陷级别分类中选择。 优选地，所述至少一个分析方法包括区域缺陷分布，自动缺陷分类，空间签名分析和偏移检测中的至少一个。 缺陷级分类优选地包括个体缺陷，缺陷簇和空间签名分析签名中的至少一个。 在一个实施例中，在检测到衬底上的缺陷之后，将缺陷信息在逻辑上划分为可配置区域。

公开(公告)号：US20080204739A1

公开(公告)日：2008-08-28

申请号：US12117823

申请日：2008-05-09

申请人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

发明人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

IPC分类号： G01N21/88

CPC分类号： G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8864 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

摘要翻译： 一种用于分析衬底上的缺陷信息的方法，包括将衬底逻辑划分为区域，以及检测衬底上的缺陷以产生缺陷信息。 在逐个区域的基础上分析来自基板的缺陷信息，以产生每个区域内的缺陷的缺陷水平分类。 根据至少一种分析方法分析区域缺陷水平分类。 缺陷级分类优选地从由食谱指定的一组缺陷级别分类中选择。 优选地，所述至少一个分析方法包括区域缺陷分布，自动缺陷分类，空间签名分析和偏移检测中的至少一个。 缺陷级分类优选地包括个体缺陷，缺陷簇和空间签名分析签名中的至少一个。 在一个实施例中，在检测到衬底上的缺陷之后，将缺陷信息在逻辑上划分为可配置区域。

公开(公告)号：US07417724B1

公开(公告)日：2008-08-26

申请号：US11746884

申请日：2007-05-10

申请人： Paul Sullivan ,  George Kren ,  Eliezer Rosengaus ,  Patrick Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Yan Xiong

发明人： Paul Sullivan ,  George Kren ,  Eliezer Rosengaus ,  Patrick Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Yan Xiong

IPC分类号： G01N21/88 ,  G06K9/00

CPC分类号： G01N21/9501 ,  G01N21/9503 ,  H01L21/67005 ,  H01L21/67288

摘要： Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.

摘要翻译： 提供晶圆检查系统和方法。 一个检查系统包括通过晶片处理器耦合到主机检查系统的模块测量单元。 模块测量单元被配置为在主机检查系统检查晶片之前使用一种或多种模式来检查晶片。 一种或多种模式包括后侧检查，边缘检查，前侧宏观缺陷检查或其组合。 另一种检查系统包括以多个视角布置的两个或多个低分辨率电子传感器。 传感器被配置为基本上同时检测从晶片返回的光。 用于分析检查数据的方法包括在检查晶片的背面之前选择与支撑装置相对应的模板，所述支撑装置接触晶片的背面。 该方法还包括从通过检查晶片的背面产生的检查数据中减去表示模板的数据。

公开(公告)号：US07227628B1

公开(公告)日：2007-06-05

申请号：US10964585

申请日：2004-10-12

申请人： Paul Sullivan ,  George Kren ,  Eliezer Rosengaus ,  Patrick Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Yan Xiong

发明人： Paul Sullivan ,  George Kren ,  Eliezer Rosengaus ,  Patrick Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Yan Xiong

IPC分类号： G01N21/88 ,  G06K9/00

CPC分类号： G01N21/9501 ,  G01N21/9503 ,  H01L21/67005 ,  H01L21/67288

摘要： Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.

摘要翻译： 提供晶圆检查系统和方法。 一个检查系统包括通过晶片处理器耦合到主机检查系统的模块测量单元。 模块测量单元被配置为在主机检查系统检查晶片之前使用一种或多种模式来检查晶片。 一种或多种模式包括后侧检查，边缘检查，前侧宏观缺陷检查或其组合。 另一种检查系统包括以多个视角布置的两个或多个低分辨率电子传感器。 传感器被配置为基本上同时检测从晶片返回的光。 用于分析检查数据的方法包括在检查晶片的背面之前选择与支撑装置相对应的模板，所述支撑装置接触晶片的背面。 该方法还包括从通过检查晶片的背面产生的检查数据中减去表示模板的数据。

公开(公告)号：US08112241B2

公开(公告)日：2012-02-07

申请号：US12403905

申请日：2009-03-13

申请人： Yan Xiong

发明人： Yan Xiong

IPC分类号： G01R27/28 ,  G06K9/00

CPC分类号： G01N21/9501 ,  G01N2021/8854

摘要： Methods and systems for generating an inspection process for a wafer are provided. One computer-implemented method includes separately determining a value of a local attribute for different locations within a design for a wafer based on a defect that can cause at least one type of fault mechanism at the different locations. The method also includes determining a sensitivity with which defects will be reported for different locations on the wafer corresponding to the different locations within the design based on the value of the local attribute. In addition, the method includes generating an inspection process for the wafer based on the determined sensitivity. Groups may be generated based on the value of the local attribute thereby assigning pixels that will have at least similar noise statistics to the same group, which can be important for defect detection algorithms. Better segmentation may lead to better noise statistics estimation.

摘要翻译： 提供了用于产生晶片检查过程的方法和系统。 一种计算机实现的方法包括基于可能在不同位置处引起至少一种类型的故障机制的缺陷单独地确定用于晶片的设计中不同位置的局部属性的值。 该方法还包括基于局部属性的值来确定对于与设计中的不同位置相对应的晶片上的不同位置将报告缺陷的灵敏度。 另外，该方法包括基于所确定的灵敏度产生晶片的检查处理。 可以基于本地属性的值生成组，从而将具有至少相似噪声统计的像素分配给同一组，这对缺陷检测算法可能是重要的。 更好的分割可以导致更好的噪声统计估计。

公开(公告)号：US20060215361A1

公开(公告)日：2006-09-28

申请号：US11262529

申请日：2005-10-27

申请人： Yung-Chi Yang ,  Yan Xiong

发明人： Yung-Chi Yang ,  Yan Xiong

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A housing of electronic product includes an accommodating space and at least one heat dissipating opening, wherein the heat dissipating opening is formed on an upper surface of the housing so as to allow a heat dissipating device received in the accommodating space to dissipate heat generated by operation of electronic components received in the accommodating space to improve heat dissipating efficiency.

摘要翻译： 电子产品的壳体包括容纳空间和至少一个散热开口，其中散热开口形成在壳体的上表面上，以便允许容纳在容纳空间中的散热装置散发由操作产生的热量 的电子部件容纳在容纳空间中以提高散热效率。