公开(公告)号：US20100067781A1

公开(公告)日：2010-03-18

申请号：US12626021

申请日：2009-11-25

申请人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

发明人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

IPC分类号： G06K9/00

CPC分类号： G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8864 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

摘要翻译： 一种用于分析衬底上的缺陷信息的方法，包括将衬底逻辑划分为区域，以及检测衬底上的缺陷以产生缺陷信息。 在逐个区域的基础上分析来自基板的缺陷信息，以产生每个区域内的缺陷的缺陷水平分类。 根据至少一种分析方法分析区域缺陷水平分类。 缺陷级分类优选地从由食谱指定的一组缺陷级别分类中选择。 优选地，所述至少一个分析方法包括区域缺陷分布，自动缺陷分类，空间签名分析和偏移检测中的至少一个。 缺陷级分类优选地包括个体缺陷，缺陷簇和空间签名分析签名中的至少一个。 在一个实施例中，在检测到衬底上的缺陷之后，将缺陷信息在逻辑上划分为可配置区域。

公开(公告)号：US06718526B1

公开(公告)日：2004-04-06

申请号：US10360433

申请日：2003-02-07

申请人： Peter Eldredge ,  Patrick Y. Huet ,  Robinson Piramuthu ,  Sandeep Bhagwat ,  Kai Chi ,  Kai Liu ,  Martin Plihal ,  Shaio Roan ,  Maruti Shanbhag

发明人： Peter Eldredge ,  Patrick Y. Huet ,  Robinson Piramuthu ,  Sandeep Bhagwat ,  Kai Chi ,  Kai Liu ,  Martin Plihal ,  Shaio Roan ,  Maruti Shanbhag

IPC分类号： G06F1750

CPC分类号： G06T7/001

摘要： A system for determining an assigned classification for a set of physical events on a substrate. Sensors sense the physical events on the substrate and produce event data. A plug in rule module manager receives and manages any number of plug in rule modules. Each plug in rule module has an input, a local filter, an analyzer, and an output. The input receives the event data and confidence values from preceding plug in rule modules. The local filter analyzes the received confidence values from the preceding plug in rule modules and selectively by passes the plug in rule module based at least in part upon the received confidence values from the preceding plug in rule modules. The analyzer analyzes the event data in view of a given classification associated with the plug in rule module, and assigns a confidence value based at least in part upon how well the event data fits the given classification. The output provides the confidence value to subsequent plug in rule modules. A post processor receives the confidence values provided by the plug in rule modules, and makes a final selection of the assigned classification to be associated with the set of physical events from the given classifications based at least in part upon a comparison of the confidence values produced by all plug in rule modules.

摘要翻译： 一种用于确定衬底上一组物理事件的分配分类的系统。 传感器感测衬底上的物理事件并产生事件数据。 插入规则模块管理器接收并管理任意数量的插入规则模块。 每个插入规则模块都有输入，本地过滤器，分析器和输出。 输入从前面插入规则模块接收事件数据和置信度值。 本地过滤器分析来自先前插入规则模块的接收到的置信度值，并且通过至少部分地基于从先前插入到规则模块中得到的置信度值来选择性地传递插件规则模块。 鉴于与插入规则模块相关联的给定分类，分析器分析事件数据，并且至少部分地基于事件数据符合给定分类的方式来分配置信度值。 输出为后续插入规则模块提供置信度值。 后处理器接收由插入规则模块提供的置信度值，并且至少部分地基于所产生的置信度值的比较，从所述给定分类中选择与所述一组物理事件相关联的所分配的分类 通过所有插入规则模块。

公开(公告)号：US08537349B2

公开(公告)日：2013-09-17

申请号：US12811319

申请日：2010-06-23

申请人： Patrick Huet ,  Brian Duffy ,  Martin Plihal ,  Thomas Trautzsch ,  Chris Maher

发明人： Patrick Huet ,  Brian Duffy ,  Martin Plihal ,  Thomas Trautzsch ,  Chris Maher

IPC分类号： G01N21/00

CPC分类号： G01R31/2656 ,  G01R31/2894 ,  G05B19/41875 ,  G05B2219/37224 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  Y02P90/22 ,  H01L2924/00

摘要： Systems and methods for monitoring time-varying classification performance are disclosed. A method may include, but is not limited to: receiving one or more signals indicative of one or more properties of one or more samples from one or more scanning inspection tools; determining populations of one or more defect types for the one or more samples according an application of one or more classification rules to the one or more signals received from the one or more scanning inspection tools; determining populations of the one or more defect types for the one or more samples using one or more high-resolution inspection tools; and computing one or more correlations between populations of one or more defect types for one or more samples determined from application of one or more classification rules applied to one or more signals received from the one or more scanning inspection tools and populations of the one or more defect types for the one or more samples determined using the one or more high-resolution inspection tools.

摘要翻译： 公开了用于监视时变分类性能的系统和方法。 方法可以包括但不限于：从一个或多个扫描检查工具接收指示一个或多个样品的一个或多个特性的一个或多个信号; 根据一个或多个分类规则对从一个或多个扫描检查工具接收的一个或多个信号的应用来确定一个或多个样本的一个或多个缺陷类型的种群; 使用一个或多个高分辨率检查工具确定所述一个或多个样品的一种或多种缺陷类型的种群; 以及计算一个或多个缺陷类型的群体之间的一个或多个相关性，所述一个或多个缺陷类型的群体由应用于从所述一个或多个扫描检查工具和所述一个或多个扫描检查工具的群体接收到的一个或多个信号应用的一个或多个分类规则确定 使用一个或多个高分辨率检查工具确定的一个或多个样品的缺陷类型。

公开(公告)号：US08165837B1

公开(公告)日：2012-04-24

申请号：US12478844

申请日：2009-06-05

申请人： Saravanan Paramasivam ,  Patrick Y. Huet ,  Martin Plihal ,  Luc Debarge

发明人： Saravanan Paramasivam ,  Patrick Y. Huet ,  Martin Plihal ,  Luc Debarge

IPC分类号： G01N37/00

CPC分类号： G01R31/2894

摘要： A computerized method for categorizing defects on a substrate. A list of defects on the substrate is received as input to a processor, where each defect is represented by a defect location and an associated micro-defect code. The input is analyzed with the processor to detect spatial clusters of defects on the substrate. The spatial clusters are analyzed with the processor to determine which of the spatial clusters represent known macro-defects and which of the spatial clusters represent unknown macro-defects. The micro-defect code associated with each defect that is included in one of the spatial clusters that is determined to be a known macro-defect is changed with the processor with a macro-defect code that is associated solely with the known macro-defect. The processor analyzes the defects that are included in one of the spatial clusters that is determined to be an unknown macro-defect to determine a predominantly occurring micro-defect code. The processor changes the micro-defect code associated with each defect that is included in the one spatial cluster that is determined to be an unknown macro-defect with the predominantly-occurring micro-defect code. The processor sends the changed list of defects on the substrate as output.

摘要翻译： 用于对基板上的缺陷进行分类的计算机化方法。 接收基板上的缺陷列表作为处理器的输入，其中每个缺陷由缺陷位置和相关联的微缺陷代码表示。 用处理器分析输入以检测衬底上的缺陷的空间簇。 用处理器分析空间聚类，以确定空间簇中的哪一个表示已知的宏缺陷，哪些空间簇表示未知的宏观缺陷。 与被确定为已知宏缺陷的空间集群之一中包括的每个缺陷相关联的微缺陷代码与具有仅与已知宏缺陷相关联的宏缺陷代码的处理器改变。 处理器分析被确定为未知宏缺陷的空间集群之一中包含的缺陷，以确定主要发生的微缺陷代码。 处理器改变与被确定为具有主要发生的微缺陷代码的未知宏缺陷的一个空间簇中包括的每个缺陷相关联的微缺陷代码。 处理器在衬底上发送更改的缺陷列表作为输出。

公开(公告)号：US20110172804A1

公开(公告)日：2011-07-14

申请号：US12919757

申请日：2010-07-12

申请人： Allen Park ,  Ellis Chang ,  Masami Aoki ,  Chris Chih-Chien Young ,  Martin Plihal ,  Michael John Van Riet

发明人： Allen Park ,  Ellis Chang ,  Masami Aoki ,  Chris Chih-Chien Young ,  Martin Plihal ,  Michael John Van Riet

IPC分类号： G06F19/00

CPC分类号： H01L22/12 ,  G03F7/70516 ,  G03F7/70625 ,  G03F7/70641 ,  G03F7/7065

摘要： A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a “no match”. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.

摘要翻译： 描述使用设计和缺陷数据匹配多个扫描仪的系统和方法。 使用金色工具处理金色晶圆。 使用第二工具处理第二晶片。 两种工具都提供对焦/曝光调制。 可以比较两个晶片的关键结构的晶片级空间特征，以评估扫描仪的行为。 关键结构可以通过在具有相似图案的金色晶片上合并缺陷来识别。 在一个实施例中，签名必须在一定百分比内匹配，或者第二工具被表征为“不匹配”。 可以以类似的方式比较网状物，其中分别使用金色掩模版和第二掩模版来处理金色和第二晶片。

公开(公告)号：US07570797B1

公开(公告)日：2009-08-04

申请号：US11125429

申请日：2005-05-10

申请人： David Wang ,  Patrick Huet ,  Tong Huang ,  Martin Plihal ,  Adam Chien-Huei Chen ,  Mike Van Riet ,  Stewart Hill

发明人： David Wang ,  Patrick Huet ,  Tong Huang ,  Martin Plihal ,  Adam Chien-Huei Chen ,  Mike Van Riet ,  Stewart Hill

IPC分类号： G06K9/00

CPC分类号： G06K9/6253 ,  G01N21/9501 ,  G06K2209/19 ,  G06T7/0004 ,  G06T2200/24 ,  G06T2207/10152 ,  G06T2207/20081 ,  G06T2207/30148

摘要： Methods and systems for generating an inspection process for an inspection system are provided. One computer implemented method includes generating inspection data for a selected defect on a specimen at different values of one or more image acquisition parameters of the inspection system. The method also includes determining which of the different values produces the best inspection data for the selected defect. In addition, the method includes selecting the different values determined to produce the best inspection data as values of the one or more image acquisition parameters to be used for the inspection process.

摘要翻译： 提供了用于产生检查系统的检查过程的方法和系统。 一种计算机实现的方法包括在检查系统的一个或多个图像采集参数的不同值处产生用于样本上的选定缺陷的检查数据。 该方法还包括确定哪个不同的值产生用于所选缺陷的最佳检查数据。 此外，该方法包括选择确定为产生最佳检查数据的不同值作为要用于检查过程的一个或多个图像获取参数的值。

公开(公告)号：US20110224932A1

公开(公告)日：2011-09-15

申请号：US12811319

申请日：2010-06-23

申请人： Patrick Huet ,  Brian Duffy ,  Martin Plihal ,  Thomas Trautzsch ,  Chris Maher

发明人： Patrick Huet ,  Brian Duffy ,  Martin Plihal ,  Thomas Trautzsch ,  Chris Maher

IPC分类号： G06F19/00

CPC分类号： G01R31/2656 ,  G01R31/2894 ,  G05B19/41875 ,  G05B2219/37224 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  Y02P90/22 ,  H01L2924/00

摘要： Systems and methods for monitoring time-varying classification performance are disclosed. A method may include, but is not limited to: receiving one or more signals indicative of one or more properties of one or more samples from one or more scanning inspection tools; determining populations of one or more defect types for the one or more samples according an application of one or more classification rules to the one or more signals received from the one or more scanning inspection tools; determining populations of the one or more defect types for the one or more samples using one or more high-resolution inspection tools; and computing one or more correlations between populations of one or more defect types for one or more samples determined from application of one or more classification rules applied to one or more signals received from the one or more scanning inspection tools and populations of the one or more defect types for the one or more samples determined using the one or more high-resolution inspection tools.

摘要翻译： 公开了用于监视时变分类性能的系统和方法。 方法可以包括但不限于：从一个或多个扫描检查工具接收指示一个或多个样品的一个或多个特性的一个或多个信号; 根据一个或多个分类规则对从一个或多个扫描检查工具接收的一个或多个信号的应用来确定一个或多个样本的一个或多个缺陷类型的种群; 使用一个或多个高分辨率检查工具确定所述一个或多个样品的一种或多种缺陷类型的种群; 以及计算一个或多个缺陷类型的群体之间的一个或多个相关性，所述一个或多个缺陷类型的群体由应用于从所述一个或多个扫描检查工具和所述一个或多个扫描检查工具的群体接收到的一个或多个信号应用的一个或多个分类规则确定 使用一个或多个高分辨率检查工具确定的一个或多个样品的缺陷类型。

公开(公告)号：US07394534B1

公开(公告)日：2008-07-01

申请号：US10717403

申请日：2003-11-19

申请人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

发明人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal ,  Christopher W. Lee ,  Cho H. Teh ,  Yan Xiong

IPC分类号： G01N21/00

CPC分类号： G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8864 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

摘要翻译： 一种用于分析衬底上的缺陷信息的方法，包括将衬底逻辑划分为区域，以及检测衬底上的缺陷以产生缺陷信息。 在逐个区域的基础上分析来自基板的缺陷信息，以产生每个区域内的缺陷的缺陷水平分类。 根据至少一种分析方法分析区域缺陷水平分类。 缺陷级分类优选地从由食谱指定的一组缺陷级别分类中选择。 优选地，所述至少一个分析方法包括区域缺陷分布，自动缺陷分类，空间签名分析和偏移检测中的至少一个。 缺陷级分类优选地包括个体缺陷，缺陷簇和空间签名分析签名中的至少一个。 在一个实施例中，在检测到衬底上的缺陷之后，将缺陷信息在逻辑上划分为可配置区域。

公开(公告)号：US07006886B1

公开(公告)日：2006-02-28

申请号：US10755546

申请日：2004-01-12

申请人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal

发明人： Patrick Y. Huet ,  Robinson Piramuthu ,  Martin Plihal

IPC分类号： G06F19/00

CPC分类号： H01L21/67288

摘要： A method for analyzing defects on a substrate, including inspecting the substrate to detect the defects, identifying the defects by location, analyzing the defects to detect extended objects, and analyzing the extended objects for repetition across the substrate. Thus, the present invention extends beyond the present analysis methods, by analyzing the extended objects for repetition across the substrate. In this manner, correlation with processing problems can be more readily detected, in cases where the individual defects themselves, of which the extended objects are formed, do not appear to have repeating properties.

摘要翻译： 一种用于分析衬底上的缺陷的方法，包括检查衬底以检测缺陷，通过位置识别缺陷，分析缺陷以检测扩展对象，以及分析扩展对象以重复穿过衬底。 因此，本发明通过分析跨越衬底的重复的扩展对象来延伸超出本分析方法。 以这种方式，在形成扩展对象的各个缺陷本身似乎不具有重复性质的情况下，可以更容易地检测与处理问题的相关性。

公开(公告)号：US08594823B2

公开(公告)日：2013-11-26

申请号：US12919757

申请日：2010-07-12

申请人： Allen Park ,  Ellis Chang ,  Masami Aoki ,  Chris Chih-Chien Young ,  Martin Plihal ,  Michael John Van Riet

发明人： Allen Park ,  Ellis Chang ,  Masami Aoki ,  Chris Chih-Chien Young ,  Martin Plihal ,  Michael John Van Riet

IPC分类号： G06F19/00 ,  H01L21/66

CPC分类号： H01L22/12 ,  G03F7/70516 ,  G03F7/70625 ,  G03F7/70641 ,  G03F7/7065

摘要： A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a “no match”. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.

摘要翻译： 描述使用设计和缺陷数据匹配多个扫描仪的系统和方法。 使用金色工具处理金色晶圆。 使用第二工具处理第二晶片。 两种工具都提供对焦/曝光调制。 可以比较两个晶片的关键结构的晶片级空间特征，以评估扫描仪的行为。 关键结构可以通过在具有相似图案的金色晶片上合并缺陷来识别。 在一个实施例中，签名必须在一定百分比内匹配，或者第二工具被表征为“不匹配”。 可以以类似的方式比较网状物，其中分别使用金色掩模版和第二掩模版来处理金色和第二晶片。