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公开(公告)号：US20050170897A1
公开(公告)日：2005-08-04
申请号：US10915699
申请日：2004-08-10
申请人： Paul Cornay , Richard Carson , Pedro Narvaez
发明人： Paul Cornay , Richard Carson , Pedro Narvaez
CPC分类号： F16D3/32 , Y10S464/905
摘要： Universal joint (100) includes a centering mechanism (100A) for supporting the universal and forcing the two joint halves to operate at the same angle thereby causing the joint to operate at constant velocity at all angles. Each shaft (134, 135) of the joint (100) is rotatably connected to the centering mechanism (100A). Movement of one of the shafts (134, 135) at an angle relative to the longitudinal axis of the coupling yoke (136) is transmitted to the other shaft (135, 134) by the centering mechanism (100A) and the centering mechanism (100A) causes the other shaft (135, 134) to likewise move at the same angle relative to the longitudinal axis of the coupling yoke (136). The centering mechanism (100A) includes cam rods (102, 103) supported within a cam tube (101), which arrangement allows a full range of movement of the shafts (134, 135) at angles of 90°.
摘要翻译： 通用接头（100）包括用于支撑通用并迫使两个接头半部以相同的角度操作的定心机构（100A），从而使接头在各个角度以恒定速度运行。 接头（100）的每个轴（134,135）可旋转地连接到定心机构（100A）。 一个轴（134,135）中的一个相对于联接轭（136）的纵向轴线的运动通过定心机构（100A）和定心机构（100,13）传递到另一轴（135,134） 100A）使得另一轴（135,134）相对于联接轭（136）的纵向轴线以相同的角度同样移动。 定心机构（100A）包括支撑在凸轮管（101）内的凸轮杆（102,103），该布置允许轴（134,135）以90°的角度的全范围的运动。
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2.发明申请VISUAL INDICATOR FOR SEMICONDUCTOR CHIPS FOR INDICATING MECHANICAL OR ESD DAMAGE 审中-公开用于表示机械或ESD损伤的半导体芯片的可视指示器公开(公告)号：US20130094531A1
公开(公告)日：2013-04-18
申请号：US13709914
申请日：2012-12-10
申请人： Richard Carson , Elaine Taylor , Douglas Collins
发明人： Richard Carson , Elaine Taylor , Douglas Collins
CPC分类号： H01S5/30 , H01L23/585 , H01L23/60 , H01L27/0251 , H01L27/04 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device including a semiconductor substrate having a surface including an active semiconductor device including one of a laser and a photodiode; and a visual indicator disposed on the semiconductor body and at least adjacent to a portion of said active semiconductor device, the indicator having a state that shows if damage to the active semiconductor device may have occurred.
摘要翻译： 一种半导体器件，包括具有包括激光器和光电二极管之一的有源半导体器件的表面的半导体衬底; 以及视觉指示器，设置在所述半导体主体上并且至少与所述有源半导体器件的一部分相邻，所述指示器具有显示是否可能发生对所述有源半导体器件的损坏的状态。
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3.发明申请Method of protecting semiconductor chips from mechanical and ESD damage during handling 有权在处理期间保护半导体芯片免受机械和ESD损坏的方法公开(公告)号：US20070111378A1
公开(公告)日：2007-05-17
申请号：US11280378
申请日：2005-11-16
申请人： Richard Carson , Elaine Taylor , Douglas Collins
发明人： Richard Carson , Elaine Taylor , Douglas Collins
IPC分类号： H01L21/00
CPC分类号： H01S5/30 , H01L23/585 , H01L23/60 , H01L27/0251 , H01L27/04 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for protecting a semiconductor device from damage. The method includes the steps of providing a active semiconductor device on a surface of the semiconductor substrate where the active device is surrounded by inactive semiconductor areas and providing a soft metallic guard ring only in the inactive semiconductor areas around the periphery of the active device wherein the metallic guard ring is connected to ground potential and not to the active device.
摘要翻译： 提供了一种用于保护半导体器件免受损坏的方法和装置。 该方法包括以下步骤：在半导体衬底的表面上提供有源半导体器件，其中有源器件被非活性半导体区域包围，并且仅在有源器件周围的非活性半导体区域中提供软金属保护环，其中， 金属保护环连接到地电位，而不连接到有源器件。
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4.发明授权Method of protecting semiconductor chips from mechanical and ESD damage during handling 有权在处理期间保护半导体芯片免受机械和ESD损坏的方法公开(公告)号：US08357556B2
公开(公告)日：2013-01-22
申请号：US12476895
申请日：2009-06-02
申请人： Richard Carson , Elaine Taylor , Douglas Collins
发明人： Richard Carson , Elaine Taylor , Douglas Collins
IPC分类号： H01L21/00
CPC分类号： H01S5/30 , H01L23/585 , H01L23/60 , H01L27/0251 , H01L27/04 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for protecting a semiconductor device from damage. The method may include the steps of providing an active semiconductor device on a surface of a semiconductor substrate where the active device is surrounded by an inactive semiconductor area, and providing a soft metallic guard element in the inactive semiconductor area around at least a portion of the periphery of the active device wherein the metallic guard element is connected to ground potential and not to the active device.
摘要翻译： 提供了一种用于保护半导体器件免受损坏的方法和装置。 该方法可以包括以下步骤：在半导体衬底的表面上提供有源半导体器件，其中有源器件被非活性半导体区域包围，并且在非活性半导体区域内的软金属保护元件周围至少部分 有源器件的周边，其中金属保护元件连接到地电位，而不连接到有源器件。
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公开(公告)号：US20100017156A1
公开(公告)日：2010-01-21
申请号：US12310293
申请日：2007-08-23
申请人： Anton Ziolkowski , Richard Carson
发明人： Anton Ziolkowski , Richard Carson
CPC分类号： G01V3/02
摘要： A method for removing cultural noise from a measurement of the field generated by an electromagnetic source, such as a current bi-pole or a magnetic loop source, the method comprising: simultaneously measuring the electromagnetic signal at a field measurement position and a calibration position close to the field measurement position, but in a null field of the source; using the field measurement and the calibration measurement to compute a filter that estimates the component of the field measurement that is correlated with cultural noise; convolving the computed filter with the calibration measurement to yield the estimated cultural noise component, and subtracting that component from the field measurement.
摘要翻译： 一种从电磁源（例如电流双极或磁环源）产生的场的测量中去除文化噪声的方法，所述方法包括：同时测量场测量位置和校准位置处的电磁信号 到现场测量位置，但在源的空字段中; 使用场测量和校准测量来计算估计与文化噪声相关的场测量的分量的滤波器; 将计算的滤波器与校准测量进行卷积，以产生估计的文化噪声分量，并从场测量中减去该分量。
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6.发明申请Method of Protecting Semiconductor Chips from Mechanical and ESD Damage During Handling 有权保护半导体芯片在处理过程中免受机械和ESD损害的方法公开(公告)号：US20090238232A1
公开(公告)日：2009-09-24
申请号：US12476895
申请日：2009-06-02
申请人： Richard Carson , Elaine Taylor , Douglas Collins
发明人： Richard Carson , Elaine Taylor , Douglas Collins
CPC分类号： H01S5/30 , H01L23/585 , H01L23/60 , H01L27/0251 , H01L27/04 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for protecting a semiconductor device from damage. The method may include the steps of providing an active semiconductor device on a surface of a semiconductor substrate where the active device is surrounded by an inactive semiconductor area, and providing a soft metallic guard element in the inactive semiconductor area around at least a portion of the periphery of the active device wherein the metallic guard element is connected to ground potential and not to the active device.
摘要翻译： 提供了一种用于保护半导体器件免受损坏的方法和装置。 该方法可以包括以下步骤：在半导体衬底的表面上提供有源半导体器件，其中有源器件被非活性半导体区域包围，并且在非活性半导体区域内的软金属保护元件周围至少部分 有源器件的周边，其中金属保护元件连接到地电位，而不连接到有源器件。
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公开(公告)号：US20050018972A1
公开(公告)日：2005-01-27
申请号：US09749285
申请日：2000-12-26
申请人： Gene Anderson , Marcelino Armendariz , Johnny Baca , Robert Bryan , Richard Carson , Edwin Duckett , Frederick McCormick , Gregory Miller , David Peterson , Terrance Smith
发明人： Gene Anderson , Marcelino Armendariz , Johnny Baca , Robert Bryan , Richard Carson , Edwin Duckett , Frederick McCormick , Gregory Miller , David Peterson , Terrance Smith
CPC分类号： G02B6/4277 , G02B6/421 , G02B6/4249 , G02B6/4269 , G02B6/4281 , G02B6/4283 , G02B6/4286 , G02B6/4292 , H05K1/189
摘要： This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.
摘要翻译： 本发明涉及一种光发射器，接收器或收发器模块，更具体地，涉及一种用于将第一光学连接器连接到第二光学连接器的装置。 所述装置包括：（1）具有至少第一端和至少第二端的壳体，所述壳体的第一端能够接收第一光学连接器，并且壳体的第二端能够接收第二光学连接器 ; （2）从壳体的第一端延伸到壳体的第二端的纵向腔; 和（3）包括壳体的至少一部分的电磁屏蔽。 本发明还涉及一种用于容纳柔性印刷电路板的装置，该装置包括：（1）至少具有第一表面和第二表面的安装结构; （2）沿着安装结构的第一和第二表面的对准脊，对准脊起到对准和固定柔性印刷电路板的作用，所述柔性印刷电路板缠绕并附接到安装结构的第一和第二表面; 和（3）适于安装结构的一系列散热脊，散热脊用于散发由柔性印刷电路板产生的热量。
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8.发明授权Method of protecting semiconductor chips from mechanical and ESD damage during handling 有权在处理期间保护半导体芯片免受机械和ESD损坏的方法公开(公告)号：US07547572B2
公开(公告)日：2009-06-16
申请号：US11280378
申请日：2005-11-16
申请人： Richard Carson , Elaine Taylor , Douglas Collins
发明人： Richard Carson , Elaine Taylor , Douglas Collins
IPC分类号： H01L21/00
CPC分类号： H01S5/30 , H01L23/585 , H01L23/60 , H01L27/0251 , H01L27/04 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for protecting a semiconductor device from damage. The method includes the steps of providing a active semiconductor device on a surface of the semiconductor substrate where the active device is surrounded by inactive semiconductor areas and providing a soft metallic guard ring only in the inactive semiconductor areas around the periphery of the active device wherein the metallic guard ring is connected to ground potential and not to the active device.
摘要翻译： 提供了一种用于保护半导体器件免受损坏的方法和装置。 该方法包括以下步骤：在半导体衬底的表面上提供有源半导体器件，其中有源器件被非活性半导体区域包围，并且仅在有源器件周围的非活性半导体区域中提供软金属保护环，其中， 金属保护环连接到地电位，而不连接到有源器件。
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